Insulated conductive particles and anisotropic conductive adhesive film containing the particles

A technology of insulating conductive and conductive particles, applied in conductive materials dispersed in non-conductive inorganic materials, assembling printed circuits with electrical components, circuits, etc., can solve the problem of reducing long-term reliability of electrical connections, large manufacturing time and process parameters, Problems such as the limitation of the amount of conductive particles

Active Publication Date: 2007-04-25
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the above-cited conventional techniques using organic or inorganic particles and insulating fibrous fillers have the disadvantage that the amount of conductive particles is limited, and it causes many problems during the production of the anisotropic conductive film and may also be da

Method used

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  • Insulated conductive particles and anisotropic conductive adhesive film containing the particles
  • Insulated conductive particles and anisotropic conductive adhesive film containing the particles
  • Insulated conductive particles and anisotropic conductive adhesive film containing the particles

Examples

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preparation example Construction

[0045] The preparation steps of each insulating fixing particle (30) include: preparing hard particles for the hard particle region (32) and preparing a polymer resin region (33) on the hard particle region (32) by seed polymerization to become a compound. The prepared insulating fixing particles (30) are fixed on the surface of the conductive particles (31) by physical / mechanical hybridization, which obtains the insulating conductive particles (3). The diameter of each insulating fixing particle (30) is 1 / 30-1 / 5 of the diameter of the conductive particle (31), and the fixing density of the insulating fixing particles fixed on the surface of the conductive particle (31) ranges from 1 to 550E. A / μm 2 . Each insulating fixing particle (30) has an aspect ratio of less than 1.5, and a coefficient of variation of less than 30%. As used herein, "aspect ratio" refers to the ratio of the largest diameter to the smallest diameter of an individual particle, and "coefficient of variat...

Embodiment 1

[0078] In Example 1, insulating conductive particles were prepared as follows.

[0079] First, mix methyl methacrylate (MMA) monomer and divinylbenzene (DVB), and mix with 1g azobisisobutyronitrile (as fat-soluble initiator), 17.9g polyvinylpyrrolidone (its molecular weight is 40,000, as a dispersion stabilizer), and 877.7 g of a solution containing methanol as a whole and ion-exchanged water (as a solvent) were stirred and then completely dissolved in the reactor. This was maintained so that the total weight of the monomers was 100 g, 30.0% by weight of MMA was applied to the DVB, and polymerization was carried out for 24 hours during stirring at 70° C. and a stirring rate of 200 rpm. The resulting polyMMA-DVD particles were separated from unreacted substances and dispersion stabilizers using a centrifugal separator, and then dried in a vacuum oven for 24 hours, which provided hard particles of 400 nm in powder form.

[0080] 20 g of the prepared polyMMA-DVD particles were d...

Embodiment 2

[0083] Example 2 was carried out in the same manner as in Example 1, except that insulating fixing particles were prepared as follows.

[0084] First, 0.125g of azobisisobutyronitrile (as a fat-soluble initiator), 8g of polyvinylpyrrolidone (its molecular weight is 40,000, as a dispersion stabilizer), and 76.375g of methanol (as a solution) and (methacryloyloxy propyl)propyltrimethoxysilane (MOPTMS) (with different weight fractions relative to styrene monomer) was added to the styrene monomer in the reactor. The total weight of the monomers was adjusted to 12.5 g, and then 30% by weight of propylmethoxysilane was added. The compound was stirred at room temperature for several hours. Water was added in an amount of 3% relative to the total weight and stirred together with the water, and then polymerization was performed at 200 rpm and 70° C. for 24 hours while stirring. This gives polystyrene-silica particles. After removing the unreacted matter and the dispersion stabilizer...

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Abstract

An insulated conductive particle for an anisotropic conductive film is disclosed. One embodiment of the particle includes a conductive particle and insulating fixative particles discontinuously fixed on the surface of the conductive particle. The insulating particles provides insulation with other adjacent insulated conductive particles, while the insulated conductive particle is electrically connected between electrodes with the insulating fixative particles being deviated from its position. The instant disclosure also provides a method for manufacturing the insulated conductive particle, an anisotropic conductive adhesive film containing the insulated conductive particles, and an electrically connected structure using the film.

Description

technical field [0001] The present invention relates to insulating conductive particles and anisotropic conductive films comprising the particles. More specifically, the present invention relates to insulating conductive particles having conductive particles and insulating fixative particles on the surface of the conductive particles. The present invention includes an anisotropic conductive film using the insulating conductive particles. Background technique [0002] Anisotropic conductive connections are generally used for electrical connection between electrodes of an IC circuit board and wired patterns of another circuit board such as an LCD panel. It means that if the direction of the circuit board is parallel to the xy plane in Cartesian coordinates, the direction of current flow is the z-axis direction. [0003] Such an anisotropic conductive electrical connection includes the following steps. First, an anisotropic conductive connection material in the form of a fil...

Claims

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Application Information

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IPC IPC(8): H01B1/14H01B1/22H05K3/32
CPCH01L2924/07811H01L2224/29399H01L2924/01019H05K3/323H01B1/22H05K2201/0212H05K2201/0224H01L2924/01079Y10T428/29Y10T428/259Y10T428/24917Y10T428/254Y10T428/2998Y10T428/25Y10T428/2991H01L2924/00H04M1/026H01Q1/243H04M1/0237
Inventor 朴晋圭裵泰燮田正培李在浩洪在根
Owner KUKDO ADVANCED MATERIALS CO LTD
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