The invention relates to an automatic
thin wire adhesive tape bonding device based on negative pressure gathering, and belongs to the technical field of
automatic processing equipment. In order to solve the problem that in the prior art, due to the fact that a
thin line segment (the
diameter is smaller than or equal to 1 mm) is prone to slipping and breaking due to clamping, the distance between line segments on an
adhesive tape is inaccurate, negative pressure adsorption is adopted for replacing mechanical clamping. The core of the device comprises a box body (comprising a height-adjustable second bottom plate), a
line segment gathering device (comprising an exhaust fan and a small gathering plate), a line feeding and
cutting device (with a
waist-shaped hole slide block for adjustment), a pressing device (driven by a
ball screw stepping motor) and an
adhesive tape feeding / winding device. During working, the exhaust fan generates negative-pressure
airflow to enable the
fine line segments to vertically droop; the small gathering plate accurately positions the
line segment in the center of the adhesive tape; and after the pressing device presses the
line segment into the adhesive tape, the scissors synchronously
cut off. Three-dimensional adjustment is achieved through the
kidney-shaped hole design, and the device is compatible with different adhesive tape widths (transverse adjustment of scissors), line segment lengths (Z-direction adjustment of a bottom plate + / -10 mm) and adhesive roll inner diameters. The device has the advantages that line segment damage is avoided, the positioning precision reaches + / -0.2 mm, the spacing error is smaller than or equal to + / -0.5 mm, and the device is suitable for
fine line bonding in the fields of building,
spinning, packaging and the like.