80results about How to "Wide gap" patented technology

Apparatus and method for atomic layer deposition on a surface of a substrate (6) in a treatment space. A gas supply device (15, 16) is present for providing various gas mixtures to the treatment space. The gas supply device (15, 16) is arranged to provide a gas mixture with a precursor material to the treatment space for allowing reactive surface sites to react with precursor material molecules to give a surface covered by a monolayer of precursor molecules attached via the reactive sites to the surface of the substrate. Subsequently, a gas mixture comprising a reactive agent capable to convert the attached precursor molecules to active precursor sites is provided. A plasma generator (10) is present for generating an atmospheric pressure plasma in the gas mixture comprising the reactive agent.

The invention relates to a thermal interface material comprising aligned nanostructures to increase the thermal conductivity of an electronic assembly. Aligned carbon nanotubes are a particularly suitable nanostructure possessing very high thermal conductivity. The novel use of nanostructures in the invention is particularly applicable to solving the issues of thermal expansion of the electronic assembly over time.

A method and device for ultrasound imaging including an array of transducers wherein the distance between adjacent transducers is greater than the minimum separation of adjacent scanlines required to produce an ultrasound image of a selected resolution. The transducer array is adapted to be mechanically moved so that the array may be swept to generate scanlines.

What is described here is an array for the contact-less transmission of electrical signals or energy, respectively, from at least one transmitter to several receivers. The invention is characterised by the provisions that each transmitter comprises an AC voltage or current source, respectively, as well as a plurality of inductive coupling elements supplied from said source, which elements are supplemented by at least one capacitor to form elements capable of resonating, and that furthermore one control element is that controls said AC voltage or current source, respectively, in such a way that the latter operates on a resonant frequency of said elements capable of resonating

Structures and configurations for planar ultrawideband modular antenna arrays. One example of a PUMA array includes an unbalanced RF interface, a lattice of horizontal dipole segments directly fed with the unbalanced RF interface, the lattice being arranged in either a dual-offset dual-polarized configuration or a single-polarization configuration, and a metallic plate capacitively-coupled to the lattice of horizontal dipole segments and pinned to a ground plane with a first plated via.

An improved electrical stun weapon for the temporary immobilization of a living being, in which the power source, electronics package, trigger mechanism and discharge contacts are securely contained within an insulated glove worn on the human hand. The stun weapon employs a simple and durable triggering mechanism allowing it to be armed and ready for use while permitting its user to engage a combatant or handle a detainee with both hands free. The stun weapon comprises a widened discharge gap and variable power settings providing improved stun effectiveness and improved control over the stun application.

The present invention is directed to a system and method for detecting impaired electric power equipment. An exemplary embodiment of the present invention may receive electromagnetic radiation and process the resulting signal. For example, signal processing may be used to identify electromagnetic radiation having a particular pattern that is characteristic of electric power equipment. Furthermore, an embodiment of the present invention may determine the time and/or location during testing. As a result, the present invention may be useful for stationary and/or mobile testing of an electrical system.

Various embodiments of a capsulotomy repair device include a resistive-heating element comprising an electrically resistive, superelastic wire forming a loop between first and second ends of the superelastic wire. The first and second ends of the loop may at least partially extend at an angle from a planar face defined by the loop, to an insulating portion, to form a transitional neck between the loop and the insulating portion. The capsulotomy repair device may be positioned in the eye relative to a capsularhexis perimeter to overlap tears in the capsularhexis periemeter to remove the tears by forming an adjusted capsularhexis perimeter by burning around the tear.

This electronic device package includes a substrate upon which an electronic device is mounted, a plurality of device electrodes which are formed upon an electronic device, a plurality of substrate electrodes which are formed upon the substrate, and a plurality of connection lines, formed by a liquid drop ejection method, each of which electrically connects together one of the plurality of device electrodes and one of the plurality of substrate electrodes. The plurality of substrate electrodes are arranged in a staggered configuration.

A process for forming a microelectromechanical system (MEMS) device by a deep reactive ion etching (DRIE) process during which a substrate overlying a cavity is etched to form trenches that breach the cavity to delineate suspended structures. A first general feature of the process is to define suspended structures with a DRIE process, such that the dimensions desired for the suspended structures are obtained. A second general feature is the proper location of specialized features, such as stiction bumps, vulnerable to erosion caused by the DRIE process. Yet another general feature is to control the environment surrounding suspended structures delineated by DRIE in order to obtain their desired dimensions. A significant problem identified and solved by the invention is the propensity for the DRIE process to etch certain suspended features at different rates. In addition to etching wider trenches more rapidly than narrower trenches, the DRIE process erodes suspended structures more rapidly at greater distances from anchor sites of the substrate being etched. At the masking level, the greater propensity for backside and lateral erosion of certain structures away from substrate anchor sites is exploited so that, at the completion of the etch process, suspended structures have acquired their respective desired widths.

The present invention relates to an underwater propelling device (10) i

• • a stator (20) comprising circumferential arrayed coils (35) and being adapted to generate a controlled electromagnetic field along an axial direction,
  • a shaftless propellant rotor (30) comprising:
    • at least two magnetized ring-shaped plates, respectively an upper magnetized plate (31) and a lower magnetized plate (32), coaxially spaced-apart along said axial direction and perpendicular thereto such that said circumferential arrayed coils (35) are positioned therebetween, each plate (31, 32) defining a central aperture (31a, 32a) and having a circumferential array of radially extended magnetized poles (34) embedded therein, said magnetized poles (34) generating a magnetic field which interacts with the electromagnetic field of the stator (20) so as to cause the rotation of said plates (31, 32) about a central axis (ZZ′) parallel to said axial direction,
    • at least one ring-shaped propeller (33) defined by its outer periphery and its inner periphery, said propeller being received inside the central apertures (31a, 32a) of said plates (31, 32) and fixedly secured thereto,
    • a plurality of propeller blades (35) projecting inward from the inner periphery of said propeller (33), said blades (35) producing a thrust along the central axis (ZZ′) when the plates (31, 32) rotate,

wherein the rotor (30) is axially separated from the stator (20) by a gap, preferably less than 3 mm, so as to permit the formation of a hydraulic film inside said gap, said hydraulic film being adapted to provide lubrication of the rotor, thus reducing friction between the rotor and the stator, and to transmit the axial thrust force of the rotor to the stator.

A pair of through holes are formed in a circuit board, and a silver paste filled up in the through holes connects lands formed on a front surface and a rear surface of the circuit board, respectively to each other. When the silver paste is solidified, the silver paste bulges curvedly from the front and rear surfaces of the circuit board and forms a bump. A surface of the bump is covered with an overcoat. An electronic component is brought into contact with the bump, thereby forming a degassing gap between the electronic component and the circuit board. A gas generated during soldering is discharged from the penetrating hole, into which the lead terminal is inserted, to an outside via the gap between the electronic component and the circuit board.

An amorphous braze foil (1) produced by a melt-spin process has an upper side and a lower side. The upper side and the lower side are thinly coated with a film of metallic Ni-based, Co-based, or Ni—Co-based braze powder (2) with a particle size in the nanometer range, wherein both the braze foil (1) and also the braze powder (2) additionally include grain boundary stabilizing elements as alloying elements. In addition, melting point depressants can be present in the braze foil or in the nano braze powder (2) in a commercially common quantity or with a considerably increased proportion. With the braze foil (1) coated in this manner, both the melting temperature of the braze material and also the probability of recrystallization are advantageously reduced when brazing in the adjacent base material (10).

A wide gap semiconductor device includes a substrate and a Schottky electrode. The substrate formed of a wide gap semiconductor material has a main face, and includes a first-conductivity-type region and a second-conductivity-type region. The Schottky electrode is arranged adjoining the main face of the substrate. At the substrate, there is foamed a trench having a side face continuous with the main face and a bottom continuous with the side face. The Schottky electrode adjoins the first-conductivity-type region at the side face of the trench and the main face, and adjoins the second-conductivity-type region at the bottom of the trench. The side face of the trench is inclined relative to the main face of the substrate.

A keyboard musical instrument such as a grand piano has a front top board and a rear top board with which an upper opening of a piano case is closed, and the rear top board is confronted with the front top board at the closing position; an automatic board spacer is provided between the front top board and the piano case, and automatically increases the gap after the rear top board leaves the closing position and decreases the gap at the arrival of the rear top board at the closing position, thereby preventing the user's fingers from pinch between the front and rear top boards.

A connector in which a slider 30 is pushed into a housing 20 in a state in which a terminal of a flexible wiring member 40 has been inserted in the housing 20, thereby holding the terminal of the flexible wiring material 40 at a position where its conductors are brought into contact with terminals 10. A guiding mechanism for the slider 30, including a guide portion 36 and the like, is provided. At the time of the pushing of the slider, the slider 30 is guided such that after being slid in a first direction which is inclined in the direction of approaching conductors of the wiring member 40 with respect to an inserting direction of the wiring member, the slider 30 is slid in a second direction parallel to the inserting direction of the wiring member.

A reactor for film deposition having a first heating unit and the second heating units is described. The temperature of each heating unit is controlled individually by heating and/or cooling means. The first heating unit and the second heating unit are disposed face-to-face to each other to form a reaction region therein, and their inner sides are placed with an inclined angle. At least one substrate is disposed on the inner surface of the first heating unit. The temperature of the second heating unit can be adapted to a temperature higher than the temperature of the first heating unit to improve the thermal decomposition efficiency of input reactants so that a low-temperature film deposition can be accomplished.

The present invention is a coating unit for applying a coating solution to a substrate which includes: a discharge nozzle for reciprocating in a predetermined direction above the substrate and discharging the coating solution to the substrate; a holder for holding the substrate and horizontally movable in one direction perpendicular to the predetermined direction; and a cover for covering an upper face of the substrate when the substrate is moved in the one direction to be more forward than the discharge nozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to be higher on the discharge nozzle side. According to the present invention, the cover covering the upper face of the substrate restrains a solvent from evaporating from the coating solution applied on the substrate to secure flatness of a coating film.

A method of forming a contact opening is provided. First, a substrate having a plurality of conductive structures formed thereon is provided. An ion implantation is performed. Thereafter, a thermal treatment is carried out to form a liner layer on the sidewall of the conductive structure and the exposed substrate. The liner layer on the sidewall of the conductive structure has a thickness smaller than the liner layer on the substrate surface. A spacer is formed on each side of the conductive structure and then an insulation layer is formed over the substrate. The insulation layer is patterned to form a contact opening between two neighboring conductive structures. Since the liner layer on the sidewall of the conductive structures is already quite thin, there is no need to reduce thickness through an etching operation and uniformity of the liner layer on the substrate can be ensured.

The invention relates to a device for optically scanning a machine-readable device applied to an object, comprising a transport apparatus for transporting the object in a transport direction, the object being supported on the transport apparatus on an underside, the transport apparatus containing a first transport belt with a first upper strand and a second transport belt with a second upper strand, wherein a gap is formed between the first transport belt and the second transport belt which is arranged ahead of the first transport belt in the transport direction, and comprising a scanning apparatus for scanning the machine-readable marking, wherein the scanning apparatus has at least one scanning element associated with the gap, wherein the first upper strand and the second upper strand are arranged so as to have a height offset relative to each other in such a way that the underside of the object can be scanned by tipping the object when the object is transferred from the first transport belt to the second transport belt.

An aircraft wing comprising an upper surface; and two or more spoilers pivotally attached to the upper surface, wherein at least two adjacent ones of the spoilers are separated by a gap, and wherein the width of the gap is: greater than 1 cm; and sufficiently small to choke the flow of air through the gap such that for at least one flight regime with the adjacent spoilers deployed, the average air flow speed through the gap is less than 10% of the true air speed.

The reduced size of the spoilers reduces the spanwise wing loading and the spoiler hinge moment, whilst providing a net aerodynamic effect (in terms of destroying lift over the wing) similar to that of a conventional spoiler array with no gaps.

The present invention realizes a heterobipolar transistor using a SiGeC base layer in order to improve its electric characteristics. Specifically, the distribution of carbon and boron within the base layer is controlled so that the concentration of boron is higher than the concentration of carbon on the side bordering on the emitter layer, and upon the formation of the emitter layer, both boron and carbon are dispersed into a portion of the emitter layer that comes into contact with the base layer.