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Double-sided cooling type power module

A power module, double-sided cooling technology, used in cooling/ventilation/heating retrofit, circuits, electrical components, etc., can solve problems such as expensive, poor thermal conductivity, and thermal degradation of power modules

Pending Publication Date: 2021-09-10
HYUNDAI MOTOR CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal Matrix Composite (Metal Matrix Composite, MMC) is used to reduce the CTE between materials, but MMC is more expensive due to the difficulty of manufacturing methods
In addition, MMC has a low CTE, but has poor thermal conductivity, so there is a limit to the deterioration of the thermal characteristics of the power module

Method used

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Embodiment Construction

[0033] Specific structural or functional descriptions of exemplary embodiments of the present invention disclosed in the specification or application are given only for the purpose of describing embodiments according to the present invention. Therefore, the exemplary embodiments according to the present invention can be implemented in various ways, and the present invention should not be construed as being limited to the exemplary embodiments described in the specification or application.

[0034] Various changes and modifications can be made to the embodiments according to various exemplary embodiments of the present invention, and therefore specific embodiments will be shown in the drawings and described in the specification or application. However, it should be understood that embodiments according to the inventive concept are not limited to specific disclosed embodiments, but that the invention includes all modifications, equivalents and alternatives falling within the spir...

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Abstract

A double-sided cooling type power module according to the present invention includes: an upper substrate including an insulating layer, an upper metal layer bonded to a top of the insulating layer, and a lower metal layer bonded to a bottom of the insulating layer; a lower substrate disposed under the upper substrate and including an insulating layer, an upper metal layer bonded to a top of the insulating layer, and a lower metal layer bonded to a bottom of the insulating layer; a spacer disposed between the upper substrate and the lower substrate and electrically connecting the upper substrate and the lower substrate; and a semiconductor chip disposed between the spacer and the upper substrate or the lower substrate, in which the insulating layers are made of a material of which a coefficient of thermal expansion is 0.8 or more and 1.2 or less times of coefficients of thermal expansion of the metal layers of the upper substrate and the lower substrate.

Description

technical field [0001] The invention relates to a double-sided cooling type power supply module. The double-sided cooling type power module may have improved heat dissipation characteristics and durability. Background technique [0002] Inverters are attracting attention as components for driving eco-friendly vehicles (hybrid vehicles and electric vehicles). The power module is one of components that bear most of the manufacturing cost of the inverter, and many studies have been conducted to increase power, reduce size, and reduce manufacturing cost. In addition, double-side cooled power modules have been actively researched to reduce the size of the power module and improve the cooling efficiency of the power module. [0003] The double-sided cooled power module includes a plurality of semiconductor chips between a top substrate and a bottom substrate, and is configured such that heat from the semiconductors is removed by coolers arranged outside the two substrates, and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L23/14H01L23/367
CPCH01L23/3736H01L23/14H01L23/145H01L23/367H01L23/473H01L23/42H01L23/3735H01L23/4334H01L2224/33181H05K7/209H05K7/2039H02M7/003H02M7/44
Inventor 朴准熙金泰华金现旭
Owner HYUNDAI MOTOR CO LTD
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