A MEMS microgravity sensor
chip with the quasi-zero stiffness characteristic preloaded based on
electric heating comprises a
monocrystalline silicon substrate, a
silicon dioxide insulating layer growson the
monocrystalline silicon substrate, a
monocrystalline silicon structure layer is bonded on the
silicon dioxide insulating layer, and a MEMS acceleration sensor
chip is manufactured in the monocrystalline
silicon structure layer; the MEMS acceleration sensor
chip comprises a chip frame, four corners of the chip frame are respectively provided with a group of
electrode anchor points, an
electric heating driving unit composed of V-shaped beams is connected between each group of
electrode anchor points, the V-shaped beams are connected with a middle arm, the middle arm is connected with a
mass block through a limiting self-
locking mechanism and a spring, and the limiting self-
locking mechanism is matched with the chip frame; except the
electrode anchor points and the chip frame, the monocrystalline silicon substrate and the
silicon dioxide insulating layer below the rest part are corroded; an electro-
thermal effect is adopted to carry out
axial displacement loading on the spring, the
mass block obtains a section of working interval with quasi-zero rigidity in the vertical direction on the premise that the vertical rigidity of the spring is not reduced, and the
mass block can beused for microgravity acceleration detection and has the advantages of being simple in structure and the like.