Cooling material with electrocaloric effect

Abstract

The invention discloses a cooling material with electrocaloric effect, wherein the cooling material comprises 1-50% by mass of a perovskite structure filler and 50-99% by mass of a macromolecule polymer substrate. According to the present invention, the isothermal entropy change and the adiabatic temperature change at 800 KV / cm respectively can reach more than 60 KJ.cm<-3>k<-1> and 9 DEG C, the refrigerant capacity is higher than 0.7 MJ.m<-3>, the actual working temperature range is up to 60 DEG C, and the cooling material has high electrocaloric effect compared with pure ceramics or polymer materials.

Description

technical field

[0001] The invention belongs to the field of composite materials, and in particular relates to a composite material with electric card effect. Background technique

[0002] With the rapid development of electronic devices, efficient heat dissipation is becoming more and more important to avoid damage caused by overheating. According to the results of the U.S. Air Force Avionics Integrity Program, 55% of electronic product failures are caused by temperature, and with As the junction temperature rises, the failure rate increases exponentially, which creates an urgent need to explore new methods and materials for heat dissipation and switching. Current heat dissipation methods include air cooling, water cooling, semiconductor cooling, heat pipe cooling, and heat sinks made of thermally conductive materials, but they all have their own shortcomings. For example, the air-cooled heat dissipation method is heavy and noisy, the water cooling method has a large volum...

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