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Two-phase flow refrigerating device based on electric heating effect

A technology of electro-thermal effect and refrigeration device, which is applied to machines, refrigerators, refrigeration and liquefaction using electric/magnetic effect, etc. problems, to achieve the effect of improving heat dissipation power and temperature span, simple structure and scientific design

Pending Publication Date: 2018-10-16
ZHENGZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the main problem of electrocaloric effect refrigeration based on materials with electrocaloric effect is that the existing electrothermal effect refrigeration devices cannot achieve continuous heat transfer due to the limitation of the application and removal time of the electric field, so the heat dissipation power and temperature span are low, which cannot meet the requirements. Practical application of device cooling requirements

Method used

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  • Two-phase flow refrigerating device based on electric heating effect
  • Two-phase flow refrigerating device based on electric heating effect
  • Two-phase flow refrigerating device based on electric heating effect

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Embodiment Construction

[0017] The technical solutions of the present invention will be described in further detail below through specific implementation methods.

[0018] Such as Figure 1-3 As shown, a two-phase flow refrigeration device based on electrocaloric effect, which includes N refrigeration devices with electrocaloric effect materials, N+1 heat transfer fluid pipelines 1, low thermal conductivity fluid 2, high thermal conductivity fluid 3 and power supply 7 , N+1 heat transfer fluid pipelines 1 are laid alternately with N refrigeration devices, the surfaces of adjacent refrigeration devices and heat transfer fluid pipelines 1 are attached, and the two outermost heat transfer fluid pipelines The pipeline 1 corresponds to the heat dissipation end and the refrigeration end respectively; the low heat transfer fluid 2 and the high heat transfer fluid 3 are alternately filled in the heat transfer fluid pipeline 1 and travel intermittently according to the specified frequency, each of the The re...

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Abstract

The invention discloses a two-phase flow refrigerating device based on an electric heating effect. The device comprises N refrigerating devices with electric heating effect materials, N+1 heat transfer fluid pipelines, low heat conducting fluids, high heat conducting fluids and a power supply; the N+1 heat transfer fluid pipelines and the N refrigerating devices are alternately paved; the two heattransfer fluid pipelines on the outermost side respectively correspond to a heat dissipating end and a refrigerating end; the low heat conducting fluids and the high heat conducting fluids are alternately filled in the heat transfer fluid pipelines by the same volumes; each refrigerating device comprises multiple sections of refrigerating chips, and thermal insulation matters arranged between twoadjacent sections of refrigerating chips; each section of refrigerating chip is connected with the power supply; power supply switches are connected to circuits between each section of refrigeratingchip and the power supply; and the power supply switches corresponding to odd sections of refrigerating chips and even sections of refrigerating chips are alternately turned on and off. The two-phaseflow refrigerating device based on the electric heating effect has the advantages of scientific design, simple structure, continuous heat transfer and improvement of the heat dissipating power and thetemperature span.

Description

technical field [0001] The invention relates to the field of solid refrigeration, in particular to a two-phase flow refrigeration device based on electrothermal effect. Background technique [0002] At present, domestic and foreign research on the use of electrothermal effect for refrigeration mainly focuses on the development of materials with high electrothermal effect, such as PbZrTiO3 thin film and BaTiO3, as well as other thin film ceramics and polymers. With the development of the economy, devices are developing toward miniaturization, especially the refrigeration technology in electronic equipment is particularly important. Electronic chips will generate a lot of heat during the working process, and the accumulation of heat will cause chip failure and damage. According to investigations and research, more than half of the current electronic device damage is caused by thermal failure. Therefore, timely heat dissipation of electronic devices is the key Necessary safegu...

Claims

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Application Information

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IPC IPC(8): F25B21/00
CPCF25B21/00F25B2321/001Y02B30/00
Inventor 孟祥睿李洁李水莲王慧张天桦李迎雪
Owner ZHENGZHOU UNIV
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