Sheet-type micro refrigerator applying lead-free ferroelectric material
A ferroelectric material and refrigerator technology, which can be applied to machines, refrigerators, refrigeration and liquefaction using electrical/magnetic effects, etc., can solve problems such as environmental pollution and human poisoning, and achieve low cost, high electrothermal effect, and simple structure. Effect
Active Publication Date: 2011-09-21
THE HONG KONG POLYTECHNIC UNIV
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Although the electrothermal effect of lead-based ferroelectric materials is better, lead-containing materials will cause serious environm
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Abstract
The invention relates to a sheet-type micro refrigerator applying a lead-free ferroelectric material. The micro refrigerator comprises a multi-layer structure which is composed of a ferroelectric dialectric layer and a metal electrode layer alternatively; the ferroelectric dielectric layer is made of the lead-free ferroelectric material; periodic square wave signals with alternative changes of working electric fields for controlling the ferroelectric dialectric layer are applied on the metal electrode layer, thus the changes of the working electric fields of the ferroelectric dialectric layer are higher than 100kv/cm. A curtain coating technology is adopted to manufacture the multi-layer thick film structure for the sheet-type micro refrigerator provided by the invention, the high electrocaloric effect is realized through a superelevation electric field condition, and the sheet-type micro refrigerator has the following beneficial effects: 1) environmental protection: a lead-free ferroelectric ceramic is adopted as a working medium, which correponds to the environment protection requirement; 2) high efficiency: the actual refrigerating amount can reach more than 2J/g; and 3) the structure is simple, the production technology is mature, and the cost is low.
Description
technical field [0001] The invention relates to the field of electronic components, in particular to a chip-type microrefrigerator using lead-free ferroelectric materials. Background technique [0002] The rapid growth of high-performance portable electronic devices in the past ten years has promoted the rapid development of electronic technology in the direction of miniaturization and integration, and three-dimensional high-density packaging has become the mainstream technology in the industry. More and more components in electronic equipment are integrated into smaller and smaller closed spaces. When the equipment is working, a large number of components will release heat at the same time, which will cause local high temperature, cause various failures, and greatly reduce system reliability. Therefore, the overall heat dissipation of the system The design and application of efficient cooling devices has become the key to the reliable operation of electronic systems. [00...
Claims
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IPC IPC(8): F25B21/02
Inventor 白洋郑广平石三强
Owner THE HONG KONG POLYTECHNIC UNIV
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