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High refraction and high adhesion large power LED packaging organosilicon material and preparation method thereof

A technology of LED packaging and high adhesion, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of detachment of packaging materials from the shell, waste products, unsatisfactory bonding of PPA and metal, and achieve colloidal compatibility Good, moderate hardness and flexibility, excellent bonding effect

Active Publication Date: 2013-02-20
湖北环宇化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, traditional tackifiers are mostly silane coupling agents or simple adducts of hydrogen-containing cyclic bodies and allyl glycidyl ether, which are not ideal for bonding PPA to metals, especially during reflow soldering. body is prone to detachment, forming waste products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1: Stir 100 g of vinyl phenyl polysiloxane and 50 g of vinyl phenyl silicone oil, vacuumize under reduced pressure, heat to 100°C and mix evenly; after cooling down to room temperature, add platinum-containing polysiloxane catalyst 1.1 g, tackifier (preferably adopt the special tackifier of the present invention, also can adopt a kind of silane coupling agent KH-560, alkane coupling agent KH-550, alkane coupling agent KH-570) 1g, vacuum Stir evenly under pressure, and obtain component A after pressure filtration.

[0031]Stir 80g of phenylvinylpolysiloxane, 27g of dihydrogen-terminated phenylpolysiloxane, and 45g of hydrogen-containing phenylpolysiloxane and vacuumize under reduced pressure, heat to 100°C and mix well; after cooling down to room temperature Add 0.1 g of 1-acetylene-1-cyclohexanol, stir evenly under vacuum, and press filter to obtain component B.

[0032] .Take components A and B and mix well, remove air bubbles under vacuum, pour into a mold wi...

Embodiment 2

[0033] Example 2: Stir 100 g of vinyl phenyl polysiloxane and 55 g of vinyl phenyl silicone oil, vacuumize under reduced pressure, heat to 100°C and mix evenly; after cooling down to room temperature, add platinum-containing polysiloxane catalyst 1.2 g. 1.3 g of tackifier (preferably the special tackifier of the present invention, or titanate coupling agent), stir evenly under vacuum, and press filter to obtain component A.

[0034] Stir 80 g of phenyl vinyl polysiloxane obtained above, 23 g of dihydrogen-terminated phenyl polysiloxane, and 54.4 g of hydrogen-containing phenyl polysiloxane, and vacuumize under reduced pressure, heat to 100°C and mix uniformly; After reaching room temperature, add 0.1 g of 2-phenyl-3-butyn-2-ol, stir evenly under vacuum, and press filter to obtain component B.

[0035] Take components A and B and mix well, remove air bubbles under vacuum, pour into a mold with LED chips, bake at 80°C for 1 hour, then bake at 150°C for 2 hours, and then solidify...

Embodiment 3

[0036] Example 3: Stir 100 g of vinyl phenyl polysiloxane and 45 g of vinyl phenyl silicone oil, vacuumize under reduced pressure, heat to 100°C and mix evenly; after cooling down to room temperature, add platinum-containing polysiloxane catalyst 1.1 g. Tackifier (preferably the special tackifier of the present invention, or a simple adduct of hydrogen-containing cyclic body and allyl glycidyl ether) 1.2g, stir evenly under vacuum, and obtain A after pressure filtration Component.

[0037] Stir 80 g of phenyl vinyl polysiloxane obtained above, 16.4 g of dihydrogen-terminated phenyl polysiloxane, and 50.8 g of hydrogen-containing phenyl polysiloxane, then vacuumize under reduced pressure, heat to 100°C and mix well; After cooling down to room temperature, add 0.1 g of 1-acetylene-1-cyclohexanol, stir evenly under vacuum, and press filter to obtain component B.

[0038] Take components A and B and mix well, remove air bubbles under vacuum, pour into a mold with LED chips, bake ...

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Abstract

The present invention relates to a high refraction and high adhesion large power LED packaging organosilicon material and a chemical synthesis method thereof. The organosilicon packaging material is prepared by carrying out mixing matching on a component A and a component B according to a mass ratio of 1:1, wherein the component A comprises vinyl phenyl polysiloxane, vinyl phenyl silicone oil, a platinum-containing polysiloxane catalyst and a tackifier, the component B comprises hydrogen-containing phenyl polysiloxane, dihydrideterminated phenyl polysiloxane, vinyl phenyl polysiloxane and an inhibitor, the tackifier is prepared by carrying out addition on isocyanate, methoxy silane and epoxy silane, and provides strong adhesion for PPA and a silver surface, the curing agent is prepared by compounding hydrogen-containing phenyl polysiloxane and dihydrideterminated phenyl polysiloxane, and a compounding mass ratio is preferably 4:1-2, such that the packaging material has moderate hardness and flexibility after curing so as to effectively solve contradiction of strength and cracking of the cured adhesive. With the present invention, the organosilicon packaging material with characteristics of refraction of 1.54, suitability for industrialization and fully meeting of large power LED packaging requirements can be obtained.

Description

technical field [0001] The invention relates to an organic silicon material for LED packaging, in particular to a high-refraction, high-adhesion high-power LED packaging organic silicon material and a preparation method thereof. Background technique [0002] LED (Light Emitting Diode) is a solid-state semiconductor device that can directly convert electricity into light. Due to its high brightness, long life, energy saving and environmental protection, it is known as a new light source in the 21st century. Its technology and application The market is developing rapidly. With the continuous improvement of power white LED manufacturing technology, its luminous efficiency, brightness and power have been greatly improved. In the process of manufacturing power white LED devices, in addition to chip manufacturing technology, phosphor manufacturing technology and heat dissipation technology, the performance of LED packaging materials will also have a significant impact on its lumi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08G77/20C08G77/12C08G77/06H01L33/56C08J3/24
Inventor 袁发强杨涛黄国辉杨世明刘春香
Owner 湖北环宇化工有限公司
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