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High-refractive, high-adhesion, high-power LED packaging organosilicon material and preparation method thereof

A LED packaging, high-adhesion technology, used in electrical components, circuits, semiconductor devices, etc., can solve problems such as poor adhesion between PPA and metal, waste, separation of packaging materials and shells, and achieve excellent adhesion. , Moderate hardness and flexibility, good colloid compatibility

Active Publication Date: 2016-03-02
湖北环宇化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, traditional tackifiers are mostly silane coupling agents or simple adducts of hydrogen-containing cyclic bodies and allyl glycidyl ether, which are not ideal for bonding PPA to metals, especially during reflow soldering. body is prone to detachment, forming waste products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1: Stir 100 g of vinyl phenyl polysiloxane and 50 g of vinyl phenyl silicone oil, vacuumize under reduced pressure, heat to 100°C and mix evenly; after cooling down to room temperature, add platinum-containing polysiloxane catalyst 1.1 g, tackifier (preferably adopt the special tackifier of the present invention, also can adopt a kind of silane coupling agent KH-560, alkane coupling agent KH-550, alkane coupling agent KH-570) 1g, vacuum Stir evenly under pressure, and obtain component A after pressure filtration.

[0031]Stir 80g of phenylvinylpolysiloxane, 27g of dihydrogen-terminated phenylpolysiloxane, and 45g of hydrogen-containing phenylpolysiloxane and vacuumize under reduced pressure, heat to 100°C and mix well; after cooling down to room temperature Add 0.1 g of 1-acetylene-1-cyclohexanol, stir evenly under vacuum, and press filter to obtain component B.

[0032] .Take components A and B and mix well, remove air bubbles under vacuum, pour into a mold wi...

Embodiment 2

[0033] Example 2: Stir 100 g of vinyl phenyl polysiloxane and 55 g of vinyl phenyl silicone oil, vacuumize under reduced pressure, heat to 100°C and mix evenly; after cooling down to room temperature, add platinum-containing polysiloxane catalyst 1.2 g. 1.3 g of tackifier (preferably the special tackifier of the present invention, or titanate coupling agent), stir evenly under vacuum, and press filter to obtain component A.

[0034] Stir 80 g of phenyl vinyl polysiloxane obtained above, 23 g of dihydrogen-terminated phenyl polysiloxane, and 54.4 g of hydrogen-containing phenyl polysiloxane, and vacuumize under reduced pressure, heat to 100°C and mix uniformly; After reaching room temperature, add 0.1 g of 2-phenyl-3-butyn-2-ol, stir evenly under vacuum, and press filter to obtain component B.

[0035] Take components A and B and mix well, remove air bubbles under vacuum, pour into a mold with LED chips, bake at 80°C for 1 hour, then bake at 150°C for 2 hours, and then solidify...

Embodiment 3

[0036] Example 3: Stir 100 g of vinyl phenyl polysiloxane and 45 g of vinyl phenyl silicone oil, vacuumize under reduced pressure, heat to 100°C and mix evenly; after cooling down to room temperature, add platinum-containing polysiloxane catalyst 1.1 g. Tackifier (preferably the special tackifier of the present invention, or a simple adduct of hydrogen-containing cyclic body and allyl glycidyl ether) 1.2g, stir evenly under vacuum, and obtain A after pressure filtration Component.

[0037] Stir 80 g of phenyl vinyl polysiloxane obtained above, 16.4 g of dihydrogen-terminated phenyl polysiloxane, and 50.8 g of hydrogen-containing phenyl polysiloxane, then vacuumize under reduced pressure, heat to 100°C and mix well; After cooling down to room temperature, add 0.1 g of 1-acetylene-1-cyclohexanol, stir evenly under vacuum, and press filter to obtain component B.

[0038] Take components A and B and mix well, remove air bubbles under vacuum, pour into a mold with LED chips, bake ...

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Abstract

The invention relates to a high-refraction, high-adhesion high-power LED packaging organosilicon material and a chemical synthesis method thereof. The silicone encapsulation material is made by mixing two components A and B at a mass ratio of 1:1, wherein component A includes: vinylphenyl polysiloxane, vinylphenyl silicone oil, platinum-containing polysilicon Oxygen catalyst, tackifier; component B includes: hydrogen-containing phenylpolysiloxane, dihydrogen-terminated phenylpolysiloxane, vinylphenylpolysiloxane, inhibitor. The tackifier of the present invention is prepared by addition of isocyanate, methoxysilane and epoxy silane, and has strong adhesion with PPA and silver surface; the curing agent is composed of hydrogen-containing and double-hydrogen-containing phenylpolysiloxane The compounding mass ratio is preferably 4:1-2 so that the hardness and flexibility of the packaging material after curing are moderate, and the contradiction between the strength and the cracking of the colloid after curing is effectively solved. The invention can obtain a refraction of 1.54, is suitable for industrialization, and is an organic silicon packaging material that fully meets the packaging requirements of high-power LEDs.

Description

technical field [0001] The invention relates to an organic silicon material for LED packaging, in particular to a high-refraction, high-adhesion high-power LED packaging organic silicon material and a preparation method thereof. Background technique [0002] LED (Light Emitting Diode) light-emitting diode is a solid-state semiconductor device that can directly convert electricity into light. Due to its high brightness, long life, energy saving and environmental protection, it is known as a new light source in the 21st century. Its technology and application market development fast. With the continuous improvement of power white LED manufacturing technology, its luminous efficiency, brightness and power have been greatly improved. In the process of manufacturing power white LED devices, in addition to chip manufacturing technology, phosphor manufacturing technology and heat dissipation technology, the performance of LED packaging materials will also have a significant impact...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08G77/20C08G77/12C08G77/06H01L33/56C08J3/24
Inventor 袁发强杨涛黄国辉杨世明刘春香
Owner 湖北环宇化工有限公司
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