Semiconductor device

Abstract

A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation of U.S. patent application Ser. No. 11 / 634,384, filed Dec. 6, 2006, which claims priority to seven Japanese Patent Applications whose numbers are 2005-376396, 2005-354458, 2006-48351, 2006-21164, 2005-354459, 2006-303717, and 2006-303837, the entirety of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to semiconductor devices including semiconductor sensor chips for detecting variations of pressure such as variations of sound pressure applied thereto.[0004]2. Description of the Related Art[0005]Conventionally, semiconductor devices such as silicon-capacitor microphones and pressure sensors, in which semiconductor chips having thin-film diaphragms for detecting variations of sound pressure are mounted on the surfaces of the printed boards, have been developed. For example, Japanese Patent Application Publication No. 2...

AI Technical Summary

Benefits of technology

The present invention provides a semiconductor device that can be downsized without changing the size of the semiconductor sensor chip and can be mounted on a printed-circuit board in a stable manner. The semiconductor device includes a semiconductor sensor chip with a diaphragm for detecting pressure variations, a cover member with conductivity, and a substrate sealed with a resin layer and covered with the cover member. The semiconductor device also includes interconnection leads for integrally interconnecting the packaging leads and the stage, which prevents electromagnetic noise from being transmitted into the hollow space. The semiconductor device can be modified to include a plurality of internal terminals and external terminals for further electrical connection.

Problems solved by technology

This makes the installation of the semiconductor device mounted on the printed-circuit board unstable.

It may be possible to combine the technical features of the aforementioned semiconductor devices; however, when the semiconductor device mounted on the printed-circuit board vibrates, the diaphragm may not accurately detect pressure variations due to vibration.

In other words, fine precision is required to prevent electrical discontinuity between the conductive layer of the cover member and the connection terminals of the printed board; hence, it is troublesome for the human operator (or worker) to precisely arrange the cover member in connection with the printed board.

Images