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Packaging structure and method for high power white light LED

A technology of light-emitting diodes and packaging structures, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of not getting rid of the traditional module packaging method, and achieve the effect of improving the light-emitting effect, reducing the probability of total reflection, and improving the light-emitting effect.

Inactive Publication Date: 2009-02-18
刘胜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But fundamentally speaking, these packaged modules still haven't got rid of the traditional module's packaged way

Method used

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  • Packaging structure and method for high power white light LED
  • Packaging structure and method for high power white light LED
  • Packaging structure and method for high power white light LED

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] see figure 1 The LED chip 1 is welded in the chip bonding area of ​​the substrate 2, and the positive and negative electrodes of the chip 1 are connected to the first electrode 3 and the second electrode 4 of the circuit layer of the substrate 2 through the gold wire 11. The LED chip 1 is covered by multiple layers of inner sealing colloids 8 of different shapes, the outer surface of the inner sealing colloid 8 is covered by multiple layers of phosphor adhesive layers 9 of different shapes, and the outer surface of the phosphor adhesive layer 9 is covered by multiple layers of different shapes. The outer envelope lens 10 covers.

[0034] The type of the LED chip 1 in this embodiment is not limited, and the type of the substrate 2 and the positions of the first electrode 3 and the second electrode 4 on the circuit layer of the substrate 2 can be adjusted according to the type of the chip 1 .

[0035] In this embodiment, the number of layers of inner sealing colloid 8, f...

Embodiment 2

[0050] Embodiment 2 is the same as Embodiment 1, except that the substrate 2 of Embodiment 2 is a double-layer substrate, see figure 2 , there is a recessed reflective cup on the substrate 2, and the chip 1 is located at the bottom of the reflective cup. In addition, the forming method of each layer of colloid of the inner sealing colloid 8 is the injection mode, see Figure 11 . The colloid of each layer of the fluorescent powder adhesive layer 9 is formed by injection, and each layer of the outer sealing lens 9 is formed by molding or potting.

Embodiment 3

[0052] Embodiment 3 is the same as Embodiment 1, except that the inner sealing colloidal layer 8, the fluorescent powder adhesive layer 9, and the outer sealing lens 10 of the third embodiment are all single layers, and the inner sealing colloidal layer 8 is formed by potting, and the fluorescent The powder layer 9 is formed by potting, and the outer sealing lens 10 is formed by injection or molding. see image 3 .

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Abstract

The invention discloses a high power white light emitting diode (LED) packaging structure and a packaging method. The high power white LED packaging structure mainly comprises an LED chip, a substrate, an internally sealed colloid, a fluorescent powder layer or a fluorescent powder adhesive layer and an externally sealed lens. The invention is characterized in that the LED chip is stuck on the substrate, a chip electrode is connected with a circuit layer on the substrate, the LED chip is covered by the internally sealed colloid, the outer surface of the internally sealed colloid is wrapped by the fluorescent powder layer or the fluorescent powder adhesive layer, and the outer surface of the fluorescent powder layer or the fluorescent powder adhesive layer is wrapped by the externally sealed lens. The invention has the advantages of promoting the light emitting effect of each layer through optically designing and packaging each layer of enveloped colloid of the LED chip, realizing mutually separate heat diffusion through a suitable process flow manufacture to isolate the fluorescent powder and the chip, having high light emitting efficiency and good light emitting stability, and being applied to packaging high power and high brightness LED.

Description

technical field [0001] The invention relates to a semiconductor device, in particular to a packaging structure and packaging method of a high-power white light emitting diode. Background technique [0002] At present, the bottleneck restricting the further development of high-power light-emitting diodes (LEDs) lies in its light-emitting effect and heat dissipation mechanism. The two affect each other, the light output effect is not good, the light energy lost or absorbed will be converted into heat energy, and the heat in the LED package module will be increased, resulting in a further increase in temperature; poor heat dissipation mechanism will lead to a rise in the temperature of the package module, The luminous efficiency of the LED chip decreases with the rise of the junction temperature, which makes the light extraction effect worse. The light output effect of the LED packaging module mainly depends on the luminous efficiency of the LED chip, the optical properties an...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/52H01L33/58H01L33/64
CPCH01L2224/45144H01L2224/48091H01L2224/48227
Inventor 刘胜刘宗源陈明祥罗小兵王恺甘志银
Owner 刘胜
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