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Embedded chip printed circuit board and method of manufacturing the same

a printed circuit board and embedded chip technology, applied in the association of printed circuit non-printed electric components, printed circuits, etc., can solve the problems of large circuit space, difficult to manufacture an embedded chip pcb which is light, slim, short and small, and suffers from the conventional method of manufacturing an embedded chip pcb

Inactive Publication Date: 2006-08-31
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0023] Accordingly, the present invention has been made keeping in mind the above problems occurring in the related art, and an object of the present invention is to provide an embedded chip PCB, which is highly dense and is light, slim, short and small by forming the connection line between a chip and a circuit line to be relatively short.

Problems solved by technology

However, the conventional method of manufacturing an embedded chip PCB is disadvantageous because the chip is embedded, the resin insulating layer is laminated, and the via holes are formed to electrically connect the chip to the circuit layer, resulting in a lone circuit connection line and a large circuit space.
Consequently, it is difficult to manufacture an embedded chip PCB which is light, slim, short and small.
In addition, the conventional method of manufacturing an embedded chip PCB suffers because it has high inductance due to the extensive length of its circuit line.

Method used

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  • Embedded chip printed circuit board and method of manufacturing the same
  • Embedded chip printed circuit board and method of manufacturing the same
  • Embedded chip printed circuit board and method of manufacturing the same

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Embodiment Construction

[0036] Hereinafter, a detailed description will be given of an embedded chip PCB and a method of manufacturing the same, according to the present invention, with reference to the appended drawings.

[0037]FIG. 2 is a cross-sectional view showing an embedded chip PCB, according to the present invention.

[0038] As shown in FIG. 2, the embedded chip PCB, according to the present invention, includes a core layer 110, which includes a CCL having an insulating layer and thin copper foils provided on both surfaces thereof, chips embedded in the CCL, inner circuit pattern layers formed on upper and lower surfaces of the CCL, and via holes for use in the electrical connection of the inner circuit pattern layers and the embedded chips. In addition, the embedded chip PCB includes an insulating layer 120 laminated on each of the upper and lower surfaces of the core layer 110 and having via holes formed therethrough, and an outer circuit pattern layer 130 laminated on the insulating layer 120 and...

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Abstract

The present invention relates to an embedded chip printed circuit board in which a space required for embedding a chip is formed to a desired depth depending on various thicknesses of chips to be embedded, and thus, the circuit line for the electrical connection between the embedded chip and the circuit pattern layer can be formed to be relatively short, thereby maximizing space efficiency and decreasing inductance at high frequencies. In addition, a method of manufacturing such an embedded printed circuit board is also provided.

Description

INCORPORATION BY REFERENCE [0001] The present application claims priority under 35 U.S.C. §119 to Korean Patent Application No. 10-2005-0016928 filed on Feb. 28, 2005. The content of the application is incorporated herein by reference in its entirety. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates, generally, to an embedded chip printed circuit board and a method of manufacturing the same. More particularly, the present invention relates to an embedded chip printed circuit board, in which the connection length between a chip and a circuit line is decreased to improve the degree of integration, and to a method of manufacturing such an embedded chip printed circuit board. [0004] 2. Description of the Related Art [0005] With the recent improvement of electronic industries, in order to correspond to electronic products requiring miniaturization and high functionality, electronic technologies have been developed to insert resistors, capa...

Claims

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Application Information

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IPC IPC(8): H05K1/18H05K3/30H01L23/12
CPCH01L23/5389Y10T29/4913H01L24/82H01L2224/24227H01L2224/82047H01L2924/01005H01L2924/01013H01L2924/01015H01L2924/01027H01L2924/01029H01L2924/01033H01L2924/01078H01L2924/15153H01L2924/15165H01L2924/19041H01L2924/19042H01L2924/19043H01L2924/30105H01L2924/30107H05K1/185H05K3/4602H05K3/4652H01L24/24Y10T29/49165H01L2224/92244H01L2924/01019H01L2924/01006H01L2224/12105H01L2224/32225H01L2224/73267H01L2924/14H01L2924/19105H01L2924/00H05K1/18
Inventor CHO, SUK HYEONRYU, CHANG SUPAHN, JIN YONG
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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