Electronic arrangement (1) with: - a carrier (2), - at least one connecting surface (6) on the support (2), - at least one optoelectronic component (3a) which is attached at least to the connecting surface (6) by means of a contact material (4), - a cover surface (5) that surrounds the connecting surface (6) on the support (2), and - at least one covered area (15, 16, 17, 18, 19) which is covered by a covering material (10), wherein - the cover surface (5) is highly reflective with a
reflectivity greater than 70%, and exposed areas on the connecting surface (6) and on the contact material (4) are covered with the cover material (10), wherein the cover material (10) is
colored by
titanium dioxide (TiO2) particles such that the
titanium dioxide particles in the cover material (10) are provided at a proportion of 25% to 70% by weight, so that the cover material (10) is highly reflective with a
reflectivity greater than 70%, thereby minimizing
optical contrast between the cover surface (5) and the covered area (15, 16, 17, 18, 19), wherein the difference in
reflectivity between the cover surface (5) and the cover material (10) is less than 20%, - that at least one optoelectronic component (3a) is a
radiation-emitting component that is encapsulated with a
potting material (13) in which scattering centers (12) are introduced, and - the area covered by the covering material (15, 16, 17, 18, 19) comprises side surfaces (7) of the optoelectronic component (3a).