16 results about "Scanning microscopy" patented technology

An image scanning microscope (100, 200) comprises a detection arrangement (112, 204) comprising a beam splitting element (122) configured to receive detection light (120), to split the detection light (120) into two parts, to direct a first part (124a) of the detection light (120) into a first beam path (126a), and to direct a second part (124b) of the detection light (120) into a second beam path (126b). The first beam path (126a) comprises a spatially resolved detector (128, 202) configured to detect a spatial distribution of the intensity of the first part (124a) of the detection light (120). The second beam path (126b) comprises a spectrally resolved detector (130) configured to detect a spectral information of the second part (124b) of the detection light (120). The image scanning microscope (100, 200) further comprises a controller (116) configured to determine a spatial distribution of at least one fluorophore species in a sample (104) based on the spatial distribution of the intensity of the first part (124a) of the detection light (120) and the spectral information of the second part (124b) of the detection light (120).

The invention discloses an assessment test and decision-making method for regression use of a domestic plastic package layered device based on layering characteristics, and relates to the field of reliability assessment and test of plastic package layered devices. The process comprises the following steps: obtaining a screened plastic package layered device, and determining an initial state and basic parameters of a to-be-tested device; extracting hierarchical feature data; classifying the devices based on the hierarchical features; designing a multi-stress assessment test, and carrying out the multi-stress assessment test on different layered devices to obtain reliability layered characteristic changes and test data of the devices; and judging the regression use qualification of the device. The hierarchical feature data is obtained through an acoustic scanning microscope and a computer vision algorithm based on OpenCV; the design method of the multi-stress assessment test is an iterative test framework comprising configurable environmental stress (such as high temperature and high humidity, temperature cycle) and synchronous electrical stress (such as dynamic / static signals); the regression use decision-making method is a comprehensive decision in combination with the category of the device, the electrical parameter state after examination, the layering proportion change trend and whether reliability improvement measures such as coating and the like are added or not; according to the method, the screened layered devices can be scientifically evaluated and recycled, and the accuracy and economical efficiency of screening decisions are remarkably improved.

The utility model provides a scanning microscope control device, which comprises a main control chip circuit, a microscope light path dimming circuit, a motor driver circuit and a scanning table control circuit, signals are sent to the microscope light path dimming circuit, the motor driver circuit and the scanning table control circuit, and signals returned by all the circuits are received; the microscope dimming circuit is used for controlling and dimming a dimming lamp after receiving the dimming signal sent by the main control chip circuit; the motor driver circuit is used for controlling a motor through a driver chip after receiving the control signal sent by the main control chip circuit; the scanning table control circuit is used for receiving a signal of the main control chip, controlling the scanning table, receiving a position signal sent back by the scanning table and sending the position signal back to the main control chip. According to the utility model, efficient and accurate control of the scanning microscope is realized.

The invention mainly relates to a wafer chuck (1) for handling a wafer, in particular in a wafer processing device, further preferred in an acoustic scanning microscope, having a holding device for the wafer, wherein the holding device has a free space (12) for receiving the wafer (50) and a carrier (10) having several wafer contact fingers (16, 18) for the wafer (50) which are movable relative to the carrier (10), wherein the wafer contact fingers (16, 18) are arranged in a ring around the free space (12) for the wafer (50), preferably in one plane, wherein the wafer contact fingers (16, 18) are movable towards or away from the free space (12) for the wafer (50), wherein preferably only one actuating device (20) for the wafer contact fingers (16, 18) is provided, which, when actuated, simultaneously moves or can simultaneously move the wafer contact fingers (16, 18).

The invention provides a defect excitation test and reliability evaluation method for a plastic package component. The method comprises the following steps: acquiring a to-be-tested sample of the plastic package component; performing appearance detection on the to-be-detected sample and recording first appearance detection data; performing electrical parameter testing on the to-be-tested sample to obtain first electrical parameter data; performing ultrasonic scanning microscope detection on the to-be-detected sample to obtain a first ultrasonic detection result; determining a mounting condition corresponding to the to-be-detected sample, and carrying out mounting treatment on the to-be-detected sample based on the mounting condition to obtain a mounted to-be-detected sample; performing a temperature cycle test on the assembled to-be-tested sample; performing appearance detection, ultrasonic scanning microscope detection and electrical parameter test on the assembled to-be-tested sample after the temperature cycle test to obtain second appearance detection data, a second ultrasonic detection result and second electrical parameter data; and comparing and analyzing the appearance detection data, the electrical parameter data and the ultrasonic detection result to obtain a first evaluation result of the to-be-detected sample.

This invention relates to the field of destructive physical analysis or failure analysis technology for molded components, and particularly to a method for detecting and identifying the location of internal voids in molded components. It addresses the problems of existing molded component inspection methods, such as high time consumption, limited observation range of the molded component's interior, and inability to accurately pinpoint the exact location of internal defects. The method for detecting and identifying the location of internal voids in molded components includes the following steps: performing acoustic scanning microscopy on the molded component to check for the appearance of black shadows in the image; if black shadows are present, performing X-ray inspection on the shadowed area to observe whether the molding compound forms an image with light and dark differences; if an image with light and dark differences is formed, performing laser decapsulation; observing whether voids are present, and recording the void location. This invention can accurately pinpoint the location of internal voids, improving the efficiency and accuracy of internal void location determination.

A method and a system for removing particles during laser-based scanning microscopy are disclosed. The method comprises: scanning a sample (12) in a medium (19) with focused laser light along a plurality of scanning areas (21) and thereby determining a plurality of measurement values, each indicating scattered light from a corresponding one of the scanning areas (21); determining an occurrence of a particle (30) in an active scanning area (22) based on comparing values of a measurement values subset which corresponds to a scanning areas subset (32) of spatially connected scanning areas containing the active scanning area (22); in reaction to having determined the occurrence of the particle (30) in the active scanning area (22), removing the particle (30) from the active scanning area (22), comprising one of: providing a relative movement of the focused laser light from the active scanning area (22) to outside the scanning areas subset (32) and subsequently lowering a laser power of the focused laser light below an optical trapping threshold, and lowering the laser power of the focused laser light below the optical trapping threshold and providing a flow of the medium (19) in the active scanning area (22).

The application discloses an automatic tool setting method for repairing micro-defects on the surface of an optical crystal based on cooperation of two microscopes, and relates to the technical field of precise optical processing. The application first determines a plane fitting equation of a crystal surface to be repaired through a three-point "trial cutting method", calculates distances from different defect points to be repaired to a tool setting surface according to plane position information of optical surface micro-defects obtained by a scanning microscope, and determines a tool setting feeding distance to improve the safety of tool setting efficiency. Then, the application calculates the distance from a tool tip to the crystal surface to be repaired during tool setting based on the "inverted image method" of a repairing microscope. Finally, the tool setting pit in the scanning microscope is used as a criterion for determining whether tool setting is completed. The tool setting method of the application solves the problem that the "inverted image method" is prone to misjudgment due to tool tip adhesion, and ensures the accuracy of tool setting.

A multi-beam charged particle system and a method of operating a multi-beam charged particle system with moving stage is provided. With the method and system configured to execute the method, a high throughput of an image acquisition is provided.

1. Name of the product in this design: Digital Image Scanning Microscope (Low Throughput). 2. Purpose of this design: For fluorescent or bright-field scanning, image observation, annotation, and measurement of clinical samples, i.e., human biological samples. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The present disclosure provides a semiconductor package interface acquisition and analysis method, device and medium, the method comprising: scanning a sample to be analyzed by using an acoustic scanning microscope, identifying a target region with delamination abnormalities and a corresponding target interface in the sample to be analyzed; cutting around the target region along a preset path using a focused ion beam to form a separable weak boundary of the target interface at the preset path; applying a physical force to the target region after the focused ion beam cutting treatment by a micro mechanical device to separate the upper layer material of the target interface from the lower layer material of the target interface along the target interface; analyzing the separated target interface to determine the cause of the delamination abnormalities of the target interface. Through the present disclosure, the in-situ and complete two-dimensional matching interface in the semiconductor package structure can be efficiently and non-destructively acquired for the target interface in the target region with delamination abnormalities, and high-reliability comparative analysis can be carried out.

The application discloses an automatic tool setting process planning method based on node progressive large-diameter KDP crystal element surface global micro-defect repair, relates to the technical field of optical engineering, and aims at solving the problems of low accuracy of existing automatic tool setting method in tool setting stage division, lack of safety criterion and low efficiency of automatic tool setting process. The application adopts a three-point calibration method outside the crystal aperture, establishes a fitting plane equation of the crystal surface to be repaired, divides the coarse tool setting stage and the fine tool setting stage by considering the influence of gravity deformation, determines the feed parameters and the in-feed tool feeding strategy of the coarse tool setting stage, corrects the distance of the tool tip to the crystal surface to be repaired in the movement process through the auxiliary distance measurement of the repair microscope system, adds the safety criterion, determines the feed parameters and the feed strategy of the fine tool setting stage, compares and processes the images collected by the scanning microscope before and after each feed, and takes the appearance of the tool setting pit in the field of view as the tool setting success sign.

In order to shorten the standby time of a fine-motion mechanism and effectively reduce vibration of the fine-motion mechanism, the present invention proposes a technique for controlling a fine-motion mechanism, comprising: setting the operating speed of the fine-motion mechanism during a first transition, which is a transition of the fine-motion mechanism from a first operating state to a second operating state different from the first operating state, and during a second transition, which is a transition from the second operating state to the first operating state, to a speed lower than the operating speed of the fine-motion mechanism in the first operating state and the second operating state by a period of time equivalent to (N - 1 / 2) cycles (N is a natural number) of the principal natural vibration of the fine-motion mechanism that occurs during the first transition or during the second transition; and causing the fine-motion mechanism to operate at the operating speed in the first operating state or the second operating state after the period of time equivalent to (N - 1 / 2) cycles has passed, and thus reducing vibration of the fine-motion mechanism that occurs during the first transition and during the second transition (see Fig. 2B).

This invention discloses a terahertz autocorrelation near-field imaging spectroscopy system, relating to the interdisciplinary field of micro-nano photonics and terahertz photoelectric detection. The system includes: a terahertz emitter, an optical path adjustment unit, a scattering near-field scanning microscope, a terahertz receiver, a current amplifier, a lock-in amplifier, and a processor. This invention employs autocorrelation near-field imaging spectroscopy, which can obtain the time-domain information of terahertz waves by performing autocorrelation measurements on terahertz pulses. The autocorrelation near-field imaging spectroscopy method in this invention also has the ability to enhance signal intensity and suppress background noise. By controlling the optical path difference and adjusting the optical path, the two signals are accumulated to achieve a modulation of the probe resonance effect, which is beneficial for studying the resonance characteristics of the sample itself.

The application relates to a large-aperture KDP crystal micro-defect rapid detection and positioning method based on variable magnification ring magnification conversion, and relates to the technical field of optical engineering, and aims to solve the problems of low scanning efficiency, low image imaging quality and easy image missing of the existing method. The application adopts a feature point matching method based on a simulated CMT tracking algorithm to determine the conversion coefficients under each variable magnification ring magnification, and further calculates the actual field of view range of the scanning microscope under different magnifications; through edge-seeking motion, the edge image of the element is extracted to determine the element center coordinate value, and the crystal global coordinate conversion is realized; based on the low-magnification scanning microscope, a grid format reciprocating scanning strategy is adopted to scan the micro-defects on the surface of the whole crystal element, and the micro-defects on the surface of the element are positioned based on the medium-magnification scanning microscope; during the scanning and positioning of the micro-defects on the surface of the crystal element, an image processing method based on a gradient algorithm is adopted, and finally the position, shape and size information of each micro-defect are obtained quickly and accurately.