46results about How to "Simple and low-cost process" patented technology

A method performs electrical testing and assembly of an electronic device on a wafer and comprising a pad made in an oxide layer covered by a passivation layer. The method includes connecting the electronic device to a testing apparatus; providing said electronic device with a metallization layer extending on the passivation layer from the pad to a non-active area of said wafer. The method comprises-performing the electrical testing on wafer of the electronic device by placing a probe of on a portion of the extended metallization layer; performing the cut of said wafer, reducing the extension of the metallization layer to the edge of the electronic device; embedding the device inside a package, forming on the metallization layer an electrical connection configured to connect the metallization layer to a circuit in said package.

A method of fabricating a trench isolation with high aspect ratio. The method comprises the steps of: providing a substrate with a trench; depositing a first isolation layer filling the trench by low pressure chemical vapor deposition; etching the first isolation layer so that its surface is lowered to the opening of the trench; depositing a second isolation layer to fill the trench without voids by high density plasma chemical vapor deposition and achieving global planarization by chemical-mechanical polishing then providing a rapidly annealing procedure. Accordingly, the present invention achieves void-free trench isolation with high aspect ratio.

An electric device having a plurality of nanowires, in which at least one of the nanowires is cut or changed in its electric characteristics so as to have a desired characteristic value of the electric device.

The disclosure relates to a superhydrophobic surface. Methods of fabrication are disclosed including laminating a polymer sheet having a surface to a template having a textured surface or a layer of a nanomaterial (e.g., nanoparticles or nanofibers) to convert the surface of the polymer sheet to a hydrophobic surface having a water contact angle of at least about 150°.

An electron emission device and / or display using the same includes a beam-focusing structure. The beam-focusing structure has a first insulating layer formed on a plate. The first insulating layer has a thickness, and is formed with a first hole. A first electrode is formed on the first insulating layer and extending into the first hole. An emission portion is formed in the first hole and connected to the first electrode. A second insulating layer is formed on the first electrode and is also formed with a second hole through which the emission portion is at least partially exposed. A second electrode is formed on the second insulating layer. In the electron emission device and / or the display, an electric field between the first electrode and the second electrode causes the emission portion to emit an electron beam and focuses the electron beam from the emission portion.

A method performs electrical testing and assembly of an electronic device on a wafer and comprising a pad made in an oxide layer covered by a passivation layer. The method includes connecting the electronic device to a testing apparatus; providing said electronic device with a metallization layer extending on the passivation layer from the pad to a non-active area of said wafer. The method comprises-performing the electrical testing on wafer of the electronic device by placing a probe of on a portion of the extended metallization layer; performing the cut of said wafer, reducing the extension of the metallization layer to the edge of the electronic device; embedding the device inside a package, forming on the metallization layer an electrical connection configured to connect the metallization layer to a circuit in said package.

An organic glass for automobile is provided which has excellent weatherability, wear-resistance and abrasion-resistance, and which can be mass-produced by a simple and inexpensive process. The organic glass comprises a transparent resin base plate 12 and a hard coat layer 14 formed on at least one surface of the resin base plate. The hard coat layer includes an organic thin film 16 formed by vacuum deposition polymerization.

The present invention relates to a composite material for a negative electrode, including: a plurality of iron oxide particles; and a conductivity improver, which is selected form the group consisting of copper, cobalt, nickel, tin, antimony, bismuth, indium, silver, gold, lead, cadmium, carbon black, graphite, copper salt, cobalt salt, nickel salt, tin salt, antimony salt, bismuth salt, indium salt, silver salt, gold salt, lead salt, cadmium salt, copper hydroxide, cobalt hydroxide, nickel hydroxide, stannic hydroxide, antimony hydroxide, bismuth hydroxide, indium hydroxide, silver hydroxide, gold hydroxide, lead hydroxide, cadmium hydroxide and the combination thereof. In the case of applying the composite material for a negative electrode according to the present invention in an electrochemical device, the improved charge / discharge characteristics and high capacity can be achieved. In addition, the present invention further provides a method for fabricating the above-mentioned composite material for a negative electrode and an electrochemical device using the same.