A multi band filter package is disclosed. The multi band filter can include a first acoustic wave filter that is mounted on a carrier, a second acoustic wave filter mounted on the carrier, and a ground pad on the carrier. The first acoustic wave filter has a first filter component and a first shunt resonator. The second acoustic wave filter has a second filter component and a second shunt resonator. The first and second acoustic wave filters are arranged such that the first and second shunt resonators are positioned between the first and second filter component. The first and second shunt resonators are coupled to the ground pad by way of an electrically conductive path. At least a portion of the electrically conductive path is positioned between the first and second shunt resonators.