A
multi band filter
package is disclosed. The
multi band filter can include a first
acoustic wave filter that is mounted on a carrier, a second
acoustic wave filter mounted on the carrier, and a ground pad on the carrier. The first
acoustic wave filter has a first filter component and a first shunt
resonator. The second acoustic wave filter has a second filter component and a second shunt
resonator. The first and second acoustic wave filters are arranged such that the first and second shunt resonators are positioned between the first and second filter component. The first and second shunt resonators are coupled to the ground pad by way of an
electrically conductive path. At least a portion of the
electrically conductive path is positioned between the first and second shunt resonators.