19 results about "Quartz resonator" patented technology

The invention provides a high-quality-factor metal arched quartz resonator and a preparation method thereof, and relates to the technical field of sensors. The structure of the metal arched quartz resonator sequentially comprises a lower metal electrode layer, a lower adhesion layer, a quartz substrate, an upper adhesion layer, an upper metal electrode layer and a metal arched structure from bottom to top. And each layer coincides with the geometric center normal of the metal arch structure. The metal arched structures are consistent in height and comprise a central symmetrical metal structure and a plurality of annular metal structures surrounding the periphery of the central symmetrical metal structure, and the two annular metal structures are concentric. The ring widths of the annular metal structures are integrally decreased from the center to the periphery, and the distances are integrally increased from the center to the periphery. According to the design, the metal arched quartz resonator has the advantages of high quality factor, high yield and low processing cost.

A resonator including: a resonator plate having a thickness, and a surface having a maximum length and a width, wherein the resonator plate is a ZT-cut quartz, and a frame including a C-shaped portion having a first arm and a second arm extending at least partially about the lateral edges of the resonator plate and wherein each of the first arm and second arm is connected to the resonator plate by means of tethers.

One aspect of the invention relates to a resonator comprising:-a resonating plate having a thickness and a surface, the surface having a maximum length and width, where the resonating plate is ZT cut quartz; and-a frame comprising a C-shaped portion comprising a first arm and a second arm, the first and second arms extending at least partially around a lateral edge of the resonating plate, where the first and second arms are each connected to the resonating plate by means of tethers.

One embodiment of the present invention provides a wafer sensor using a quartz resonator and capable of monitoring a plasma process. A wafer-shaped sensor using a quartz resonator according to one embodiment of the present invention can be used to simultaneously measure frequency changes at various positions by attaching the quartz resonator on a wafer, and thus can improve production yield by diagnosing the degree of etching in real time during a plasma process. In addition, a wafer-shaped sensor using a quartz resonator according to one embodiment of the present invention can remove noise due to having a conductive layer formed on the surface of the quartz resonator, can be used for a long period of time, thus having an increased lifespan, and can reduce process costs through preventive maintenance (PM) cycle optimization.

The invention relates to a quartz harmonic oscillator surface metallization method based on an atom transfer radical polymerization method. The method comprises the following steps: firstly, carrying out surface cleaning and hydroxylation on a quartz substrate; then immersing the quartz substrate into a toluene solution of (3-aminopropyl) triethoxysilane, continuously reacting, immersing the quartz substrate into anhydrous tetrahydrofuran or dichloromethane, and adding an acid absorbent for reacting; mixing the quartz substrate with a monomer with a metal coordination functional group, a catalyst, a ligand and a solvent, and carrying out polymerization reaction; after polymerization, immersing the quartz substrate into a metal salt solution for metal ion adsorption; and taking out, cleaning, reducing and annealing to obtain a pure quartz surface metal layer. According to the method, the absolutely uniform polymer template can be formed on a workpiece with a complex three-dimensional curved surface macroscopically through microcosmic quartz surface modification of the polymer and a dipping-metal reduction method, then uniform atomic layer scale metal deposition is achieved, and extremely high uniformity and shape preserving performance are achieved.

The invention provides a TO quartz crystal resonator with low G sensitivity, and belongs to the technical field of quartz crystal resonators. The antenna comprises a shell, a quartz vibrator and a base, the quartz vibrator comprises a quartz wafer and two electrode structures, and each electrode structure comprises a main electrode and an electrode lead; the quartz wafer is provided with two hollow fan-ring-shaped stress isolation structures; the stress isolation structure is positioned between the main electrode and the tail part of the electrode lead and is not crossed with the electrode lead; four supporting elastic pieces are arranged in the base, five external leads are arranged at the bottom of the base, and the quartz vibrator is erected on the four supporting elastic pieces and is fixed and electrically connected through conductive adhesive. According to the invention, stress and mass load can be reduced, and G sensitivity of the quartz crystal resonator is reduced.

This invention belongs to the field of quartz resonator technology, specifically to a high-frequency quartz resonator wafer and its manufacturing process. It includes a wafer body with grooves on both sides. A vibration electrode is positioned at the center of the bottom of each groove, and the vibration electrode is connected to a surface electrode via wiring. The surface electrode is connected to an electrode excitation area. This invention provides two manufacturing processes for electrodes made of different materials: the first uses a photolithography-etching-sputtering micro-nano fabrication process to manufacture a high-frequency quartz resonator wafer with gold-chromium composite electrodes. The second method, based on the first, modifies the electrode material system and deposition method, using a solution deposition method with multi-component composite electrode ink. The quartz resonator wafer prepared by this invention can achieve frequencies exceeding 200MHz and can be easily packaged.

A quartz resonator including a casing, a pad, an oscillator crystal and a thermistor is provided. The casing includes a first casing and a second casing. The pad is disposed on an outer surface of the second casing. The oscillator crystal includes two thick parts and a thin part whose two ends are respectively connected to the two thick parts. The two thick parts are sandwiched between the first casing and the second casing. An inner surface of the first casing and the thin part of the oscillator crystal form a sealed first space, and an inner surface of the second casing and the thin part of the oscillator crystal form a sealed second space. The thermistor is disposed in the first space or the second space and is electrically connected to the pad.

The application discloses a method and device for detecting the conductive glue bonding quality of a quartz wafer in situ, and the method comprises the following steps: a, determining a testable area on the wafer; b, inputting an image recognition system with a teaching module to accurately identify the testable area; c, testing the test area of the wafer electrode with a probe, and reading the resistance value, that is, the on-resistance value of the conductive glue; and d, displaying and storing the resistance value obtained by the test into a database for data analysis and product tracing. The application realizes real-time and effective control of the quartz resonator processing technology and quality by monitoring the conductive glue bonding quality of a quartz resonator in a pre-processing stage, and achieves the purposes of improving product yield and avoiding waste of production resources.

The invention provides a high-frequency quartz resonator and a design method thereof. The high-frequency quartz resonator comprises a ceramic base, a metal cover plate, a quartz wafer and a metal electrode, the ceramic base comprises an accommodating cavity and a base gold plating platform arranged in the accommodating cavity; the quartz wafer is positioned in the accommodating cavity and is fixed on the base gold-plated platform through the conductive adhesive to form electric connection; the metal electrode comprises a first electrode layer and a second electrode layer, and the first electrode layer and the second electrode layer are symmetrically arranged on the upper side surface and the lower side surface of the quartz wafer; the first electrode layer and the second electrode layer have the same structure, are arranged in a kitchen knife shape and comprise main body parts and knife handle parts, and the main body parts and the quartz wafer are concentrically arranged; and the metal cover plate is packaged on the upper surface of the ceramic base, so that the accommodating cavity forms a closed chamber. The technical problems of parasitic mode interference, temperature drift and insufficient structural reliability in a high-frequency miniaturized resonator are effectively solved, and high-frequency application requirements of various electronic circuits are met.

The utility model relates to a dual-channel quartz resonance humidity-sensitive device, which is based on the energy trapping theory of a quartz crystal, that is, only waves higher than cutoff frequency can be spread on a quartz substrate when the waves are spread on the quartz substrate. The thickness of the non-electrode area of the quartz substrate is changed by forming the concave separation grooves in the non-electrode area of the upper surface and the non-electrode area of the quartz substrate, the cut-off frequency of the non-electrode area of the quartz substrate can be changed, and the cut-off frequency difference value of the electrode area and the non-electrode area of the quartz substrate is increased. According to the dual-channel quartz resonator, the wave of the electrode area of one vibration electrode group on the quartz substrate cannot be transmitted to the electrode area of the other vibration electrode group, so that the vibration coupling and interference of the dual-channel quartz resonator are reduced, the structure is simple, the processing cost is low, and the vibration interference problem of the traditional dual-channel quartz resonator is effectively solved.

The invention provides a crystal oscillator constant temperature structure, which comprises a base, a printed board, a quartz resonator, a heating component power tube, a crystal, a thermistor and a cover plate, and is characterized in that the base is tightly connected with the printed board through a screw hole 1 and is fixed on the printed board; a heating component power tube in the heating circuit is fixed in the constant-temperature structure through a screw hole 2; the crystals are tightly connected through the constant-temperature structure base, and crystal pins are connected with the printed board through the via holes 3; the thermistor is positioned in the space 4 of the constant-temperature structure base and is welded on the printed board; the cover plate passes through the screw holes 5 and is tightly connected with the thermostatic bath base through screws; the crystal is mounted in the constant-temperature structure by the constant-temperature structure crystal oscillator; the space 4 at the base of the constant-temperature structure is used for reducing temperature induction delay and effectively ensuring the temperature control effect.

This invention relates to a quasi-convex quartz resonator achieving a high quality factor and its design method. The quasi-convex quartz resonator includes: a quartz wafer plate region and a plurality of rectangular protrusions arranged in parallel at intervals thereon, the plurality of rectangular protrusions forming a square wave region; the width of the rectangular protrusions is W. H The distance between two adjacent rectangular protrusions is W. L The distance between the same side of two adjacent rectangular protrusions (W) H +W L All are equal; the duty cycle of each of the rectangular protrusions [W] is equal. H / (W H +W L The thickness is calculated based on the integral thickness of the sub-intervals divided into corresponding regions of the plano-convex quartz resonator. This invention reproduces the shape of the plano-convex quartz resonator by arranging fine protrusions on the surface of the resonator; this shape is called "quasi-convex." The shape of the protrusions gradually changes according to a rule. Simultaneously, by optimizing the thickness H and length L of the rectangular protrusions to simulate the vibration displacement characteristics of the plano-convex quartz resonator, the excellent quality factor Q and sufficiently high productivity of the plano-convex resonator are achieved.

The application relates to a sandwich structure quartz resonator and an optimization method thereof and a hydrogen sensor. The quartz resonator comprises metal electrodes and a quartz light plate; the metal electrodes are arranged on the upper and lower sides of the quartz light plate to form a sandwich structure; the lower metal electrode comprises a platinum electrode and a chromium electrode which are sequentially arranged in layers from bottom to top; the upper metal electrode comprises a first electrode and a second electrode which are arranged at intervals along the length direction of the quartz light plate; the first electrode comprises a chromium electrode, a gold electrode and a platinum electrode which are sequentially arranged in layers from bottom to top; the second electrode comprises a chromium electrode and a gold electrode which are sequentially arranged in layers from bottom to top; and the thickness of the platinum electrode is 0.2 mu m. The quartz resonator with the optimized thickness of the platinum electrode realizes good decoupling characteristics and energy trapping effect of the quartz resonator, reduces the interference of the resonator parasitic mode during the working of the sensor, reduces energy loss, improves the working performance of the quartz resonator, and further improves the sensitivity of the sensor.

The utility model discloses a frame-supported quartz resonator, which comprises a base, a crystal is arranged on the base, a pin is arranged at the lower end of the base, a protection mechanism for preventing the pin from being bent is arranged on the base, and the protection mechanism comprises a protection sleeve, a movable sleeve, a sliding block, a mounting groove, a mounting rod and a spring. A movable sleeve is fixedly connected to the lower end of the base, a protective sleeve is fixedly connected to the lower end of the base, a sliding block is fixedly connected to the outer side of the movable sleeve, a mounting groove is formed in the inner wall of the protective sleeve, a mounting rod is fixedly connected into the mounting groove, and a spring is arranged on the outer side of the mounting rod in a sleeving mode. The movable sleeve is installed in the protective sleeve through a sliding block, a spring and the like, the movable sleeve wraps the pin and slides on the outer side of the pin, when the pin is connected into a circuit, the movable sleeve can slide on the outer side of the pin under the action of the spring and the sliding block, at the moment, the extending length of the pin can be reduced through the movable sleeve, and the pin is effectively prevented from being bent.

The invention discloses a TiAl alloy transition layer-based quartz resonance force sensor interface strengthening structure and a preparation method thereof. The structure comprises a Fe-based substrate, a TiAl alloy transition layer, an epoxy resin packaging layer and a quartz resonance sheet, the TiAl alloy transition layer is deposited on the surface of the Fe-based substrate, and the epoxy resin packaging layer wraps the TiAl transition layer and packages the quartz resonance piece on the surface of the Fe-based substrate. The content of Al in the TiAl transition layer is 0-70 at.%, and the thickness of the TiAl transition layer is 50-1000 nm. Stable chemical bonding of the Fe-based substrate and the epoxy resin is achieved through the TiAl transition layer, and relative slippage of an interface is avoided; the cubic phase content in the transition layer is adjusted through the Al content, the lattice mismatching degree with Fe is reduced, and the interface stress is reduced. Through 10000 times of loading-unloading cycle tests, compared with a sensor without a transition layer, the indicating value error is reduced by 37.5%, the repeatability error is reduced by 57.2%, the hysteresis error is reduced by 78.3%, and the durability is remarkably improved while the sensing precision + / -0.2% FS is kept.

A quartz resonator comprises a shell, a connecting pad, an oscillator crystal and a thermistor. The shell comprises a first shell and a second shell. The connecting pad is arranged on the outer surface of the second shell. The oscillator crystal comprises two thick parts and a thin part of which the two ends are respectively connected with the two thick parts. The two thick parts are clamped between the first shell and the second shell. A closed first space is formed between the inner surface of the first shell and the thin part of the oscillator crystal, and a closed second space is formed between the inner surface of the second shell and the thin part of the oscillator crystal. The thermistor is arranged in the first space or the second space and is electrically connected with the connecting pad. The quartz resonator provided by the invention can accurately measure the temperature.

The application discloses a quartz resonator and a wafer-level vacuum packaging method thereof. The quartz resonator is made of a full quartz material and comprises a base, a cap and a quartz resonant structure arranged in a vacuum sealed cavity between the base and the cap. The base and the cap are vacuum packaged through an annular sealing structure surrounding the cavity. The method is based on a wafer-level process, and the base unit, the resonant structure unit and the cap unit with the cavity are arrayed and prepared on a quartz wafer respectively, and the integration and vacuum packaging of the structure are realized through twice alignment and bonding. The quartz resonator adopts a full quartz structure, the thermal expansion coefficients of which are completely matched, so that thermal stress is fundamentally eliminated, and the temperature stability and reliability of the device are improved. Meanwhile, the wafer-level integration process realizes high-precision batch manufacturing, and the production efficiency is significantly improved.

The utility model relates to a composite resonance humidity-sensitive chip structure with asymmetric electrodes, which belongs to the technical field of quartz resonators and comprises a quartz substrate, vibrating electrodes with different sizes are arranged on the upper surface and the lower surface of the quartz substrate, and the vibrating electrodes are connected with bonding pads on the upper surface and the lower surface of the quartz substrate through connecting electrodes. A platinum resistor with an MEMS structure is prepared on the upper surface of the quartz substrate, the platinum resistor is directly connected with a bonding pad, and the bonding pad is arranged on the edge of the quartz substrate. According to the utility model, the symmetrical electrode structure of the traditional quartz resonator is changed, the sensitivity of the quartz resonator is effectively improved, the refrigeration efficiency and uniformity of an external refrigeration device to the composite resonant humidity-sensitive chip structure can be improved, the surface temperature difference between the platinum resistor and the vibration electrode is reduced, and the surface temperature of the quartz resonator is monitored in real time; and the real-time high-precision measurement of the dew point is realized.