29 results about "Quartz resonator" patented technology

The invention provides a high-quality-factor metal arched quartz resonator and a preparation method thereof, and relates to the technical field of sensors. The structure of the metal arched quartz resonator sequentially comprises a lower metal electrode layer, a lower adhesion layer, a quartz substrate, an upper adhesion layer, an upper metal electrode layer and a metal arched structure from bottom to top. And each layer coincides with the geometric center normal of the metal arch structure. The metal arched structures are consistent in height and comprise a central symmetrical metal structure and a plurality of annular metal structures surrounding the periphery of the central symmetrical metal structure, and the two annular metal structures are concentric. The ring widths of the annular metal structures are integrally decreased from the center to the periphery, and the distances are integrally increased from the center to the periphery. According to the design, the metal arched quartz resonator has the advantages of high quality factor, high yield and low processing cost.

A resonator including: a resonator plate having a thickness, and a surface having a maximum length and a width, wherein the resonator plate is a ZT-cut quartz, and a frame including a C-shaped portion having a first arm and a second arm extending at least partially about the lateral edges of the resonator plate and wherein each of the first arm and second arm is connected to the resonator plate by means of tethers.

The utility model relates to the field of electronic component detection, in particular to a fixing and positioning device for foreign matter detection of a quartz resonator, which comprises a detection table, a camera is mounted on the detection table, a rotating disc is rotatably connected to the detection table, a movable base is slidably connected to the rotating disc, two fixing rods are connected to the movable base, and the two fixing rods are connected to the detection table. A rubber band is arranged between the two fixing rods in a sleeving mode, a control assembly used for controlling the sliding direction of the movable base is arranged in the detection table, and an adjusting assembly used for rotating the rotating disc is arranged in the detection table. The quartz resonator is fixed through the movable base and the rubber band on the fixing rod, so that the camera can capture a clear image of the quartz resonator without being held by hand, and the quartz resonator can be comprehensively observed from different angles through the flexible adjustment of the rotating disc.

One aspect of the invention relates to a resonator comprising:-a resonating plate having a thickness and a surface, the surface having a maximum length and width, where the resonating plate is ZT cut quartz; and-a frame comprising a C-shaped portion comprising a first arm and a second arm, the first and second arms extending at least partially around a lateral edge of the resonating plate, where the first and second arms are each connected to the resonating plate by means of tethers.

One embodiment of the present invention provides a wafer sensor using a quartz resonator and capable of monitoring a plasma process. A wafer-shaped sensor using a quartz resonator according to one embodiment of the present invention can be used to simultaneously measure frequency changes at various positions by attaching the quartz resonator on a wafer, and thus can improve production yield by diagnosing the degree of etching in real time during a plasma process. In addition, a wafer-shaped sensor using a quartz resonator according to one embodiment of the present invention can remove noise due to having a conductive layer formed on the surface of the quartz resonator, can be used for a long period of time, thus having an increased lifespan, and can reduce process costs through preventive maintenance (PM) cycle optimization.

The invention relates to a quartz harmonic oscillator surface metallization method based on an atom transfer radical polymerization method. The method comprises the following steps: firstly, carrying out surface cleaning and hydroxylation on a quartz substrate; then immersing the quartz substrate into a toluene solution of (3-aminopropyl) triethoxysilane, continuously reacting, immersing the quartz substrate into anhydrous tetrahydrofuran or dichloromethane, and adding an acid absorbent for reacting; mixing the quartz substrate with a monomer with a metal coordination functional group, a catalyst, a ligand and a solvent, and carrying out polymerization reaction; after polymerization, immersing the quartz substrate into a metal salt solution for metal ion adsorption; and taking out, cleaning, reducing and annealing to obtain a pure quartz surface metal layer. According to the method, the absolutely uniform polymer template can be formed on a workpiece with a complex three-dimensional curved surface macroscopically through microcosmic quartz surface modification of the polymer and a dipping-metal reduction method, then uniform atomic layer scale metal deposition is achieved, and extremely high uniformity and shape preserving performance are achieved.

The invention provides a TO quartz crystal resonator with low G sensitivity, and belongs to the technical field of quartz crystal resonators. The antenna comprises a shell, a quartz vibrator and a base, the quartz vibrator comprises a quartz wafer and two electrode structures, and each electrode structure comprises a main electrode and an electrode lead; the quartz wafer is provided with two hollow fan-ring-shaped stress isolation structures; the stress isolation structure is positioned between the main electrode and the tail part of the electrode lead and is not crossed with the electrode lead; four supporting elastic pieces are arranged in the base, five external leads are arranged at the bottom of the base, and the quartz vibrator is erected on the four supporting elastic pieces and is fixed and electrically connected through conductive adhesive. According to the invention, stress and mass load can be reduced, and G sensitivity of the quartz crystal resonator is reduced.

The present technical solution relates to the field of computing. A device for measuring physiological parameters of a user on the basis of brain electroencephalogram and photoplethysmogram data and acceleration and angular velocity data comprises the following, connected to one another by a noise-immune cable: an electronic circuit board having the following modules arranged thereon: an analog-to-digital converter, a Real Time Clock (RTC) quartz resonator, a read-only memory, a Bluetooth communication module, an accelerometer, a gyroscope, and a module for capturing photoplethysmogram data from a photoplethysmogram sensor; two spring-loaded dry pogo pin electrodes in the form of a comb of spring-loaded gold-plated pin contacts; two spring-loaded dry pogo pin electrodes in the form of a comb of spring-loaded gold-plated pin contacts, which are mounted on springs; a spring-loaded dry pogo pin reference electrode (REF); two spring-loaded dry pogo pin ground electrodes (GND); a module for activating / deactivating the device; and a photoplethysmogram sensor, wherein the device is designed to be embeddable in an over-ear stereo headset.

The application relates to the technical field of resonators, in particular to a quartz resonator wafer manufacturing method and a quartz resonator wafer. The method comprises the following steps: etching N first grooves on the front surface of a quartz wafer and etching N second grooves on the back surface of the quartz wafer, each of the first grooves and the second grooves is in a structure of wide at the top and narrow at the bottom, the second bottom end width of each second groove is equal to the first bottom end width of the opposite first groove, and the second bottom end length is greater than or equal to the first bottom end length; a first through hole is etched from the position opposite to one end of the second bottom end, the first through hole length is equal to the first bottom end width; a second through hole is etched from the other end of the second bottom end, the second through hole length is less than the second bottom end width; and a shallow groove is etched on the target edge of the second through hole, when the quartz resonator wafer is folded along the shallow groove, there is no defect and extra protrusion, and the device performance is improved.

This invention belongs to the field of quartz resonator technology, specifically to a high-frequency quartz resonator wafer and its manufacturing process. It includes a wafer body with grooves on both sides. A vibration electrode is positioned at the center of the bottom of each groove, and the vibration electrode is connected to a surface electrode via wiring. The surface electrode is connected to an electrode excitation area. This invention provides two manufacturing processes for electrodes made of different materials: the first uses a photolithography-etching-sputtering micro-nano fabrication process to manufacture a high-frequency quartz resonator wafer with gold-chromium composite electrodes. The second method, based on the first, modifies the electrode material system and deposition method, using a solution deposition method with multi-component composite electrode ink. The quartz resonator wafer prepared by this invention can achieve frequencies exceeding 200MHz and can be easily packaged.

A quartz resonator including a casing, a pad, an oscillator crystal and a thermistor is provided. The casing includes a first casing and a second casing. The pad is disposed on an outer surface of the second casing. The oscillator crystal includes two thick parts and a thin part whose two ends are respectively connected to the two thick parts. The two thick parts are sandwiched between the first casing and the second casing. An inner surface of the first casing and the thin part of the oscillator crystal form a sealed first space, and an inner surface of the second casing and the thin part of the oscillator crystal form a sealed second space. The thermistor is disposed in the first space or the second space and is electrically connected to the pad.

A quartz resonator element (10) having a vibrating part (110), a holding part (120) disposed so as to surround the vibrating part (110) in plan view, and a support arm (130) connecting the vibrating part (110) and the holding part (120), the quartz resonator element (10) being provided with: a quartz substrate (11) provided so as to spread over the vibrating part (110), the holding part (120), and the support arm (130); a pair of excitation electrodes (140a, 140b) provided on the vibrating unit (110); and a first extraction electrode (150a) and a second extraction electrode (150b) provided on the support arm (130) and electrically connected to each of the pair of excitation electrodes (140a, 140b), the first extraction electrode (150a) and the second extraction electrode (150b) being electrically connected to each of the pair of excitation electrodes (140a, 140b). The quartz substrate (11) has: a first main surface (13A) and a second main surface (13B) which extend along the X-axis and the Z-axis and which face each other in the Y-axis direction, when the axes obtained by rotating the Y-axis of the crystal and the Z-axis of the crystal are defined as the Y '-axis and the Z'-axis; a first side surface (13C) that connects one end of the first main surface (13A) and one end of the second main surface (13B) in the Z '-axis direction to each other; and a second side surface (13D) that connects the ends of the first main surface (13A) and the second main surface (13B) on the opposite side from the first side surface (13C), the first lead-out electrode (150a) is provided across the first main surface (13A), the first side surface (13C), and the second main surface (13B) of the quartz substrate (11), and the second lead-out electrode (150b) is provided across the first main surface (13A), the second side surface (13D), and the second main surface (13B) of the quartz substrate (11).

An anti-interference, high-sensitivity integrated quartz resonant accelerometer chip structure comprises a pendulum platform, an upper pendulum assembly connected above the pendulum platform, and a lower pendulum assembly connected below the pendulum platform; the upper pendulum assembly and the lower pendulum assembly are identical in structure and symmetrically arranged about the pendulum platform; the upper pendulum assembly comprises a quartz resonator and a metal pendulum fixed by glue; the upper pendulum assembly and the lower pendulum assembly of the present invention are both assembled by mounting the metal pendulum-quartz resonator, and are aligned and assembled with the pendulum platform to form a "sandwich" chip structure, doubling the mass of the inertial mass block and improving the sensitivity of the accelerometer; an annular stress isolation groove and a double "C" stress isolation groove are designed in the metal pendulum to reduce the influence of complex interference factors such as assembly residual stress, external interference stress, and interference thermal stress on the axial stress of the quartz resonator, suppress temperature drift and time drift, and improve long-term stability.

The utility model belongs to the technical field of quartz resonators, and particularly relates to a quartz crystal resonator with a waterproof structure, which comprises a shell and a bottom plate, a step opening is arranged at the bottom of the shell, the bottom plate is arranged in the step opening and is sealed through an annular sealing gasket and a sealing ring, T-shaped sliding grooves are symmetrically arranged on two sides of the shell, and the T-shaped sliding grooves are communicated with the step opening. A sliding groove is formed in the bottom plate, an extrusion strip is installed in the sliding groove in a sliding mode, the position change of the extrusion strip is controlled through rotation of an adjusting bolt, an extrusion inclined face of the extrusion strip is used for pressing the bottom plate upwards, and therefore the sealing performance between the bottom plate and the shell is improved; a quartz crystal piece is fixed to the upper surface of the bottom plate, and electrode pins are welded to the two sides of the quartz crystal piece; the surface of the electrode pin is sleeved with the protective sleeve, the inner wall of the protective sleeve is uniformly provided with the limiting protruding plates, the damage resistance of the electrode pin is improved through the design of the protective sleeve, the whole device is compact in structure, high in sealing performance and convenient to operate, and the problems that a quartz crystal resonator is insufficient in sealing and poor in electrode pin protection in long-term use can be effectively solved.

The application discloses a method and device for detecting the conductive glue bonding quality of a quartz wafer in situ, and the method comprises the following steps: a, determining a testable area on the wafer; b, inputting an image recognition system with a teaching module to accurately identify the testable area; c, testing the test area of the wafer electrode with a probe, and reading the resistance value, that is, the on-resistance value of the conductive glue; and d, displaying and storing the resistance value obtained by the test into a database for data analysis and product tracing. The application realizes real-time and effective control of the quartz resonator processing technology and quality by monitoring the conductive glue bonding quality of a quartz resonator in a pre-processing stage, and achieves the purposes of improving product yield and avoiding waste of production resources.

The invention provides a high-frequency quartz resonator and a design method thereof. The high-frequency quartz resonator comprises a ceramic base, a metal cover plate, a quartz wafer and a metal electrode, the ceramic base comprises an accommodating cavity and a base gold plating platform arranged in the accommodating cavity; the quartz wafer is positioned in the accommodating cavity and is fixed on the base gold-plated platform through the conductive adhesive to form electric connection; the metal electrode comprises a first electrode layer and a second electrode layer, and the first electrode layer and the second electrode layer are symmetrically arranged on the upper side surface and the lower side surface of the quartz wafer; the first electrode layer and the second electrode layer have the same structure, are arranged in a kitchen knife shape and comprise main body parts and knife handle parts, and the main body parts and the quartz wafer are concentrically arranged; and the metal cover plate is packaged on the upper surface of the ceramic base, so that the accommodating cavity forms a closed chamber. The technical problems of parasitic mode interference, temperature drift and insufficient structural reliability in a high-frequency miniaturized resonator are effectively solved, and high-frequency application requirements of various electronic circuits are met.

The utility model relates to a dual-channel quartz resonance humidity-sensitive device, which is based on the energy trapping theory of a quartz crystal, that is, only waves higher than cutoff frequency can be spread on a quartz substrate when the waves are spread on the quartz substrate. The thickness of the non-electrode area of the quartz substrate is changed by forming the concave separation grooves in the non-electrode area of the upper surface and the non-electrode area of the quartz substrate, the cut-off frequency of the non-electrode area of the quartz substrate can be changed, and the cut-off frequency difference value of the electrode area and the non-electrode area of the quartz substrate is increased. According to the dual-channel quartz resonator, the wave of the electrode area of one vibration electrode group on the quartz substrate cannot be transmitted to the electrode area of the other vibration electrode group, so that the vibration coupling and interference of the dual-channel quartz resonator are reduced, the structure is simple, the processing cost is low, and the vibration interference problem of the traditional dual-channel quartz resonator is effectively solved.

The invention provides a crystal oscillator constant temperature structure, which comprises a base, a printed board, a quartz resonator, a heating component power tube, a crystal, a thermistor and a cover plate, and is characterized in that the base is tightly connected with the printed board through a screw hole 1 and is fixed on the printed board; a heating component power tube in the heating circuit is fixed in the constant-temperature structure through a screw hole 2; the crystals are tightly connected through the constant-temperature structure base, and crystal pins are connected with the printed board through the via holes 3; the thermistor is positioned in the space 4 of the constant-temperature structure base and is welded on the printed board; the cover plate passes through the screw holes 5 and is tightly connected with the thermostatic bath base through screws; the crystal is mounted in the constant-temperature structure by the constant-temperature structure crystal oscillator; the space 4 at the base of the constant-temperature structure is used for reducing temperature induction delay and effectively ensuring the temperature control effect.

This invention relates to a quasi-convex quartz resonator achieving a high quality factor and its design method. The quasi-convex quartz resonator includes: a quartz wafer plate region and a plurality of rectangular protrusions arranged in parallel at intervals thereon, the plurality of rectangular protrusions forming a square wave region; the width of the rectangular protrusions is W. H The distance between two adjacent rectangular protrusions is W. L The distance between the same side of two adjacent rectangular protrusions (W) H +W L All are equal; the duty cycle of each of the rectangular protrusions [W] is equal. H / (W H +W L The thickness is calculated based on the integral thickness of the sub-intervals divided into corresponding regions of the plano-convex quartz resonator. This invention reproduces the shape of the plano-convex quartz resonator by arranging fine protrusions on the surface of the resonator; this shape is called "quasi-convex." The shape of the protrusions gradually changes according to a rule. Simultaneously, by optimizing the thickness H and length L of the rectangular protrusions to simulate the vibration displacement characteristics of the plano-convex quartz resonator, the excellent quality factor Q and sufficiently high productivity of the plano-convex resonator are achieved.

The invention discloses a high-strength low-hysteresis thermistor crystal oscillator and a preparation method, the high-strength low-hysteresis thermistor crystal oscillator comprises a ceramic substrate, the upper side of the ceramic substrate is provided with an accommodating inner groove, the accommodating inner groove is internally provided with a quartz resonator, and the ceramic substrate is internally provided with an accommodating inner cavity located below the quartz resonator. A thermistor is arranged in the containing inner cavity, the thermistor and the quartz resonator are both connected with a patterned metal connecting line in the ceramic substrate, a supporting frame is arranged on the outer side of the ceramic substrate along the edge, and supporting arms which horizontally extend into the containing inner cavity to support and lift the thermistor are arranged on the two sides of the supporting frame. At least one supporting groove is formed in the position, corresponding to the thermistor, of the upper side of the supporting arm, and the supporting groove is filled with electric conduction and heat conduction buffer slurry in close contact with the thermistor. The crystal oscillator packaging structure can solve the technical problems of an existing crystal oscillator packaging structure in the aspects of supporting stability, thermistor protection, heat conduction and the like.

The utility model relates to the technical field of quartz resonator installation, in particular to a patch quartz resonator damping installation structure, which comprises a printed circuit board (PCB) and a resonator, the PCB is provided with a groove, the groove penetrates through the PCB, and the resonator is installed in the groove and is perpendicular to the PCB. The quartz crystal resonator and the quartz crystal resonator are perpendicular to each other, the acceleration sensitivity of the corresponding crystal resonator is in a non-sensitive direction when the deformation direction of the PCB is maximum, and the acceleration sensitivity of the quartz crystal resonator is reduced to the maximum extent when the acceleration of the crystal resonator is in a sensitive direction and is perpendicular to the deformation direction of the PCB is in a minimum direction. And the vibration phase noise qualification rate of the anti-vibration crystal oscillator is improved. The qualified rate and the vibration result are improved, which means that in the batch production process, the test time and raw materials of the product are greatly saved, the production speed is improved, and the production cost is saved.

The application relates to a sandwich structure quartz resonator and an optimization method thereof and a hydrogen sensor. The quartz resonator comprises metal electrodes and a quartz light plate; the metal electrodes are arranged on the upper and lower sides of the quartz light plate to form a sandwich structure; the lower metal electrode comprises a platinum electrode and a chromium electrode which are sequentially arranged in layers from bottom to top; the upper metal electrode comprises a first electrode and a second electrode which are arranged at intervals along the length direction of the quartz light plate; the first electrode comprises a chromium electrode, a gold electrode and a platinum electrode which are sequentially arranged in layers from bottom to top; the second electrode comprises a chromium electrode and a gold electrode which are sequentially arranged in layers from bottom to top; and the thickness of the platinum electrode is 0.2 mu m. The quartz resonator with the optimized thickness of the platinum electrode realizes good decoupling characteristics and energy trapping effect of the quartz resonator, reduces the interference of the resonator parasitic mode during the working of the sensor, reduces energy loss, improves the working performance of the quartz resonator, and further improves the sensitivity of the sensor.

The utility model discloses a frame-supported quartz resonator, which comprises a base, a crystal is arranged on the base, a pin is arranged at the lower end of the base, a protection mechanism for preventing the pin from being bent is arranged on the base, and the protection mechanism comprises a protection sleeve, a movable sleeve, a sliding block, a mounting groove, a mounting rod and a spring. A movable sleeve is fixedly connected to the lower end of the base, a protective sleeve is fixedly connected to the lower end of the base, a sliding block is fixedly connected to the outer side of the movable sleeve, a mounting groove is formed in the inner wall of the protective sleeve, a mounting rod is fixedly connected into the mounting groove, and a spring is arranged on the outer side of the mounting rod in a sleeving mode. The movable sleeve is installed in the protective sleeve through a sliding block, a spring and the like, the movable sleeve wraps the pin and slides on the outer side of the pin, when the pin is connected into a circuit, the movable sleeve can slide on the outer side of the pin under the action of the spring and the sliding block, at the moment, the extending length of the pin can be reduced through the movable sleeve, and the pin is effectively prevented from being bent.

The utility model discloses an air tightness screening device for a glass-sealed quartz resonator. The air tightness screening device comprises a box body, a sealing cover is movably arranged at the upper part of the box; the bottom of the box body is of a protruding structure with the four edges sunken towards the middle. A water outlet is formed in the bottom of the box body corresponding to the convex structure; the upper part of the side wall of the box body is fixedly connected with a first hollow pipe and a second hollow pipe which are communicated, and the first hollow pipe is connected with an air compressor, so that after the outer surface of the resonator is cleaned, if the outer surface of the resonator is changed, the air tightness of the resonator is relatively poor, and if the outer surface of the resonator is not changed, the air tightness of the resonator is relatively good; by means of the screening mode, resistance testing can be avoided, rapid detection of the air tightness of the resonator is achieved, unqualified products are prevented from flowing into the market and affecting use, the detection cost and the detection time cost are remarkably reduced, operation is easy, the equipment cost is low, and the method is suitable for large-scale air tightness screening of the glass-sealed quartz resonator.

The invention discloses a TiAl alloy transition layer-based quartz resonance force sensor interface strengthening structure and a preparation method thereof. The structure comprises a Fe-based substrate, a TiAl alloy transition layer, an epoxy resin packaging layer and a quartz resonance sheet, the TiAl alloy transition layer is deposited on the surface of the Fe-based substrate, and the epoxy resin packaging layer wraps the TiAl transition layer and packages the quartz resonance piece on the surface of the Fe-based substrate. The content of Al in the TiAl transition layer is 0-70 at.%, and the thickness of the TiAl transition layer is 50-1000 nm. Stable chemical bonding of the Fe-based substrate and the epoxy resin is achieved through the TiAl transition layer, and relative slippage of an interface is avoided; the cubic phase content in the transition layer is adjusted through the Al content, the lattice mismatching degree with Fe is reduced, and the interface stress is reduced. Through 10000 times of loading-unloading cycle tests, compared with a sensor without a transition layer, the indicating value error is reduced by 37.5%, the repeatability error is reduced by 57.2%, the hysteresis error is reduced by 78.3%, and the durability is remarkably improved while the sensing precision + / -0.2% FS is kept.

The invention relates to a method for manufacturing an on-chip temperature compensation quartz resonator, which comprises the following steps of: determining a design resistance value of a platinum resistor according to a temperature measurement precision requirement, and determining the line width, the thickness and the length of the platinum resistor based on the design resistance value of the platinum resistor; preparing one or more platinum resistors on the wafer based on the line width, thickness and length of the platinum resistor; wherein each platinum resistor adopts S-shaped wiring and is connected in parallel with a fusible fine tuning electrode; after the platinum resistor is prepared, preparing a sensitive chip structure and a sensitive chip electrode on the wafer; measuring a difference value between an actual resistance value and a designed resistance value of the platinum resistor by using a four-wire detection method, and adjusting the fusible fine tuning electrode connected in parallel with the platinum resistor based on the difference value until the actual resistance value and the designed resistance value of the platinum resistor reach a preset error range; and pasting the processed sensitive chip and the ASIC circuit into a ceramic shell, connecting a welding spot on the sensitive chip to a welding spot of the ceramic shell by using a gold wire, and then carrying out parallel seam welding to obtain the prepared on-chip temperature compensation quartz resonator. According to the method, temperature hysteresis can be reduced, performance parameters can be compensated through the temperature, collected by the platinum resistor, of the resonator chip, and the full-temperature performance of the resonator is integrally improved.

A quartz resonator comprises a shell, a connecting pad, an oscillator crystal and a thermistor. The shell comprises a first shell and a second shell. The connecting pad is arranged on the outer surface of the second shell. The oscillator crystal comprises two thick parts and a thin part of which the two ends are respectively connected with the two thick parts. The two thick parts are clamped between the first shell and the second shell. A closed first space is formed between the inner surface of the first shell and the thin part of the oscillator crystal, and a closed second space is formed between the inner surface of the second shell and the thin part of the oscillator crystal. The thermistor is arranged in the first space or the second space and is electrically connected with the connecting pad. The quartz resonator provided by the invention can accurately measure the temperature.

The application discloses a quartz resonator and a wafer-level vacuum packaging method thereof. The quartz resonator is made of a full quartz material and comprises a base, a cap and a quartz resonant structure arranged in a vacuum sealed cavity between the base and the cap. The base and the cap are vacuum packaged through an annular sealing structure surrounding the cavity. The method is based on a wafer-level process, and the base unit, the resonant structure unit and the cap unit with the cavity are arrayed and prepared on a quartz wafer respectively, and the integration and vacuum packaging of the structure are realized through twice alignment and bonding. The quartz resonator adopts a full quartz structure, the thermal expansion coefficients of which are completely matched, so that thermal stress is fundamentally eliminated, and the temperature stability and reliability of the device are improved. Meanwhile, the wafer-level integration process realizes high-precision batch manufacturing, and the production efficiency is significantly improved.

The utility model relates to a composite resonance humidity-sensitive chip structure with asymmetric electrodes, which belongs to the technical field of quartz resonators and comprises a quartz substrate, vibrating electrodes with different sizes are arranged on the upper surface and the lower surface of the quartz substrate, and the vibrating electrodes are connected with bonding pads on the upper surface and the lower surface of the quartz substrate through connecting electrodes. A platinum resistor with an MEMS structure is prepared on the upper surface of the quartz substrate, the platinum resistor is directly connected with a bonding pad, and the bonding pad is arranged on the edge of the quartz substrate. According to the utility model, the symmetrical electrode structure of the traditional quartz resonator is changed, the sensitivity of the quartz resonator is effectively improved, the refrigeration efficiency and uniformity of an external refrigeration device to the composite resonant humidity-sensitive chip structure can be improved, the surface temperature difference between the platinum resistor and the vibration electrode is reduced, and the surface temperature of the quartz resonator is monitored in real time; and the real-time high-precision measurement of the dew point is realized.