136 results about "Thickness shear" patented technology

Exemplary embodiments provide a piezoelectric resonator element, to reduce the reaching of an attenuating vibration of a main vibration to a marginal edge of the piezoelectric resonator element, as well as to stabilize an oscillating-frequency without worsening the CI value, nor inducing another vibration mode. The piezoelectric resonator element having a thickness shear vibration as a main vibration, a first groove and a second groove formed so as to surround the center part of a main surface, and the thickness at the first groove and the second groove structured to be between 70% to 96%, inclusive, of the thickness of the center part of the resonator element.

A piezoelectric vibrator element includes a vibrating portion that excites thickness-shear vibration, and a peripheral portion that is disposed on the periphery of the vibrating portion and has a thickness thinner than the vibrating portion, the vibrating portion and the peripheral portion being formed in a piezoelectric substrate. A buffering portion and a mount portion are sequentially connected to the peripheral portion. The buffering portion includes a slit formed between the mount portion and the peripheral portion. The mount portion has notches which are formed at both end portions in a direction orthogonal to an arrangement direction of the mount portion, the buffering portion, and the peripheral portion.

A vibrating element includes a piezoelectric substrate having an excitation section adapted to excite a thickness-shear vibration, and provided with a step section in each of side surfaces on both ends, and a peripheral section having a thickness smaller than a thickness of the excitation section, and the peripheral section has at least one projection section disposed on both principal surfaces in an area where a vibratory displacement when the excitation section excites a vibration is sufficiently attenuated.

Aspects of the invention provide piezoelectric resonator element having a plurality of grooves for suppressing propagation of the thickness shear vibration from the center portion to the outer peripheral portion of the main surface being placed in enclosure-like shapes surrounding the center portion of at least one of the main surfaces.

Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.

A resonator element includes a substrate vibrating in a thickness-shear vibration mode, a first excitation electrode disposed on one principal surface of the substrate, and has a shape obtained by cutting out four corners of a quadrangle, and a second excitation electrode disposed on the other principal surface of the substrate, and a ratio (S2/S1) between the area S1 of the quadrangle and the area S2 of the first excitation electrode fulfills 87.7%≦(S2/S1)<95.0%.

A crystal resonator comprises an AT-cut crystal vibrating element that is driven by a thickness-shear mode and is in the shape of a rectangular plate. A pair of excitation electrodes is formed, facing front and rear surfaces of the crystal vibrating element. Each of the excitation electrodes is formed in the shape of a quadrangle as viewed from the top, and mass adjustment portions are formed at least two opposite sides of each of the excitation electrodes formed on the front and rear surfaces.

A piezoelectric resonator includes a pair of driving electrodes and a pair of lead electrodes that are formed facing each other on the frontside and backside of a piezoelectric plate that operates in a thickness-shear vibration mode. The front and back driving electrodes are formed such that they each have one or more pairs of parallel sides and have the same shape, and their centers face each other. The parallel sides of one of the front and back driving electrodes are formed parallel with either the X-axis or the Z′-axis of the piezoelectric plate, but the parallel sides of the other driving electrodes are formed without being parallel with the X-axis and Z′-axis thereof.

A resonator element includes a quartz crystal substrate in which a plane including X and Z′ axes is set as a main plane and a direction oriented along a Y′ axis is a thickness direction. The quartz crystal substrate includes a first region in which thickness shear vibration is generated, a second region that has a thickness thinner than the first region, and first protrusions that are disposed between one pair of electrode pads disposed to be lined in a direction oriented along a Z′ axis on a mounted side of the second region. When Lx is a length of the first protrusions along the X axis and X is a wavelength of flexural vibration of the quartz crystal substrate, a relation of “λ/2×(2n+1)−0.1λ≦Lxλ/2×(2n+1)+0.1 λ” (where n is a positive integer) is satisfied.

A resonator element includes a substrate including a first principal surface and a second principal surface respectively forming an obverse surface and a reverse surface of the substrate, and vibrating in a thickness-shear vibration mode, a first excitation electrode disposed on the first principal surface, and a second excitation electrode disposed on the second principal surface, and being larger than the first excitation electrode in a plan view, the first excitation electrode is disposed so as to fit into an outer edge of the second excitation electrode in the plan view, and the energy trap confficient M fulfills 15.5≦M≦36.7.

The current invention relates to a conductivity-dielectric (CD) electrode design with apertures that allow compressional waves to propagate away from the surface of the acoustic wave device unimpeded. This prevents reflection of compressional waves that would interact with the viscosity sensor surface, thus altering the device response. It allows compressional waves to pass through, and allows the dual mode viscosity sensor responses to be utilized for density/viscosity/elasticity measurement and correlation. The invention further offers methods of instrumentation to detect unwanted reflections, to compensate, and to correct for the distortions caused by reflections. Finally, the invention provides a system and method for utilizing deliberately introduced reflections to obtain additional information, including fluid density.

In an ultrasonic motor, an elliptical vibration is generated by combining a longitudinal primary resonance vibration resulting from an expansion and a contraction of the vibrator in a direction of the central axis and a torsional secondary resonance vibration or a torsional tertiary resonance vibration resulting from twisting of a rotation axis, and the dimension ratio of the rectangle of the vibrator is chosen such that a resonance frequency of the longitudinal primary resonance vibration, resulting from the expansion and the contraction of the vibrator in the direction of the central axis and a resonance frequency of the torsional secondary resonance vibration or the torsional tertiary resonance vibration resulting from twisting of the rotation axis match. The vibrator includes a torsional piezoelectric body that generates a thickness shear vibration, and that is arranged at an anti-node position of the torsional secondary resonance vibration or the torsional tertiary resonance vibration.

A vibrating element includes: an element plate that has a vibrating portion that performs thickness-shear vibration, a peripheral portion that is integrally formed with the vibrating portion, and a protruding portion that is provided at the peripheral portion; and an excitation electrode that is provided at the vibrating portion. When a side length of the vibrating portion is Mx, when a side length of the excitation electrode is Ex, and when a wavelength of flexure vibrations of the element plate is λ, the relationship of (Mx−Ex)/2=λ/2, and Mx/2={(A/2)+(¼)}λ (where, A is a positive integer) is satisfied, and when a length of the protruding portion is Dx, and when a distance between the vibrating portion and the protruding portion is Sx, the relationship of Dx=λ/2)×m, and (λ/2)×n−0.1λ≦Sx≦(λ/2)×n+0.1λ (where m and n are positive integers) is satisfied.

Thickness shear mode resonator pressure sensors include a housing having an outer dimension that is less than 0.575 inch (14.605 millimeters). Pressure transducers may include a quartz pressure sensor and a quartz reference sensor, wherein an electronics assembly of the pressure transducer is configured to drive at least one of the quartz pressure sensor and the quartz reference sensor at a frequency greater than 10 MHz. Transducer assemblies include an electronics assembly configured to drive at least one quartz sensor of the transducer assembly at a frequency greater than 10 MHz.