Temperature and pressure integrated sensor and preparation method thereof

A technology that integrates sensors and pressure, applied in the field of sensors, can solve problems such as being affected and unable to work, and achieve the effects of reducing parasitic, improving applicability, and reducing costs

Inactive Publication Date: 2019-07-12
HOHAI UNIV CHANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a temperature and pressure integrated sensor and its preparation method to solve the problem that the temperature sensor and pressure sensor in the prior art use wires to transmit and collect signals, which will be affected or even unable to work in some extremely harsh environments technical issues

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  • Temperature and pressure integrated sensor and preparation method thereof
  • Temperature and pressure integrated sensor and preparation method thereof
  • Temperature and pressure integrated sensor and preparation method thereof

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0025] It should be noted that, in the description of the present invention, the terms "front", "rear", "left", "right", "upper", "lower", "inner", "outer" and the like indicate orientations or positions The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and does not require that the present invention must be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. The terms "front", "rear", "left", "right", "upper" and "lower" used in the description of the present invention refer to the directions in the drawings, ...

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Abstract

The invention discloses a temperature and pressure integrated sensor and a preparation method thereof, belongs to the technical field of sensors, and aims to solve the technical problem that signals acquired by the sensor through wire transmission are affected and even cannot work in some extremely severe environments. A temperature and pressure integrated sensor comprises a substrate and a piezoelectric material arranged on the surface of the substrate, a resonator is arranged on the piezoelectric material, and a sealing cavity is formed in the substrate. The temperature is measured by utilizing the effect that the resonant frequency of the delay line SAW resonator deposited on the piezoelectric material can be changed along with the external temperature; the pressure is measured by utilizing the effect that the resonant frequency of the delay line SAW resonator growing on the cavity can be changed along with the external pressure. The temperature and pressure integrated sensor does not need to be driven by an internal energy source and does not need a wire to transmit signals, so that the sensor has the characteristics of being wireless, passive and capable of working in extremely severe environments such as high temperature, high pressure and sealed space.

Description

technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to a temperature and pressure integrated sensor and a preparation method thereof. Background technique [0002] Temperature and pressure are two very important parameters in industrial production. Rapid and accurate measurement of temperature and pressure is of great practical significance to improve production efficiency, ensure product quality, and save energy. However, in the actual production process, the commonly used thermocouples or temperature sensors made of semiconductor materials need to use wires to transmit the signals collected by the sensors. And in some extremely harsh environments such as high temperature, high pressure, and sealed space, the performance of these temperature sensors will be seriously affected or even unable to work. [0003] Pressure sensors not only play an important role in industrial production, but also begin to emerge in electronic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02G01K11/26G01L19/00
CPCG01D21/02G01K11/265G01L19/0092
Inventor 王李蔡春华金纪东滕思茹曹元
Owner HOHAI UNIV CHANGZHOU
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