The application provides a
semiconductor device and a manufacturing method thereof, and an electronic device. The manufacturing method of the
semiconductor device comprises the following steps: manufacturing a plurality of bit lines, the plurality of bit lines are sequentially distributed along a second direction; manufacturing a first
dielectric layer covering the plurality of bit lines; sequentially manufacturing a sacrificial layer and a second
dielectric layer covering the first
dielectric layer; forming a plurality of first through holes penetrating through the second
dielectric layer, the sacrificial layer and the first
dielectric layer and being arrayed and distributed; the bottom of the first through hole is exposed to the
bit line; removing part of the second
dielectric layer and part of the first dielectric layer arranged around the periphery of the first through hole to form a first channel; manufacturing a plurality of
semiconductor columns; the semiconductor columns correspond to fill the first through hole and the first channel arranged around the periphery of the first through hole; replacing the sacrificial layer with a plurality of gate insulating
layers and a plurality of gates arranged around the periphery of the plurality of semiconductor columns to obtain a plurality of transistors. The application realizes the improvement of the
gate control area and the
gate control ability, effectively increases the on-state current, and improves the on-off ratio of the device.