47results about How to "Good gating ability" patented technology

The invention discloses a stacked gate dielectric GaN-based insulated gate high-electron mobility transistor, mainly to solve the problem that existing similar devices are low in reliability. The device comprises a substrate (1), an AlN nucleation layer (2), a GaN buffer layer (3), an AlN insertion layer (4), an AlGaN barrier layer (5), a GaN cap layer (6), a SiN passivation layer (7), a gate dielectric layer (8) and a SiN protection layer (9) from bottom to top, wherein two ends of the GaN buffer layer (3) are provided with a source electrode (10) and a drain electrode (11); the middle of the gate dielectric layer (8) is provided with a gate electrode (12); a metal interconnection layer (13) is arranged on the source electrode (10) and the drain electrode (11); and the gate dielectric layer (8) adopts a stacked structure formed by an AlN dielectric insertion layer (81) and a high k dielectric layer (82). The interface characteristics and the gate control capability of the device are improved, the reliability is improved, and the stacked gate dielectric GaN-based insulated gate high-electron mobility transistor can serve as a high-efficiency microwave power device.

The invention discloses a tunneling field effect transistor based on a two-dimensional material/semiconductor hetero-junction and a preparation method thereof. A device forms an interleaved energy band structure in the off state through the energy band design, namely, a tunneling window is inexistent between the two-dimensional material and the semiconductor material, and the ultra-low off-state current can be acquired; the grid voltage can be applied to regulate an energy band alignment way at the two-dimensional material/semiconductor hetero-junction so that the device can form the staggered energy band structure in the on-state, and the effective tunneling barrier height is a negative value; and meanwhile, the current carrier tunnels to a channel region from a source region to realize the direct tunneling, thereby acquiring large on-state current. The device adopts the highly-doped three-dimensional semiconductor material as the source region material, and the three-dimensional semiconductor material and the metal source electrode are unipotential; since the thickness of the two-dimensional material is ultra-thin, the grid voltage can regulate the two-dimensional material and the energy band at the two-dimensional material/semiconductor hetero-junction interface, thereby acquiring an ideal grid control capacity. The tunneling field effect transistor disclosed by the invention is simple in process, and large in compatibility with the traditional semiconductor process.

The invention discloses a GaN-based nanometer channel transistor with high electron mobility and mainly aims at solving the problems that in the prior art, the short channel effect is serious, the grid control ability is poor, and the leak current and transconductance are low.The transistor comprises a substrate (1), a GaN buffer layer (2), a GaN channel (3), AlGaN barrier layers (4), a grid dielectric layer (5), a passivation layer (6), a source electrode, grid electrodes and a drain electrode from bottom to top.The AlGaN barrier layers are additionally arranged on the two sides of the GaN nanometer channel, the GaN nanometer channel is wrapped by the AlGaN barrier layers, and AlGaN/GaN heterojunctions are formed on the top and the two sides of the GaN nanometer channel; the grid electrodes are located on the two sides and the top of each AlGaN/GaN heterojunction.The transistor has the advantages of being good in grid control ability, large in saturation current and small in leak resistance, and can be used as a small-size high-speed high-frequency device.

The invention, which belongs to the super-large-scale integrated circuit manufacturing technology field, provides a preparation method of a vertical silicon nanowire field effect transistor with a small parasitic resistance. Compared to a traditional plane field effect transistor, by using the vertical silicon nanowire field effect transistor prepared in the invention, on one hand, a good abilityof restraining a short channel effect can be provided and leakage current and drain induced barrier lowering (DIBL) can be reduced because of a good gate control ability caused by a one-dimensional geometric structure of the vertical silicon nanowire field effect transistor; on the other hand, a device area can be further reduced and an integration level of an IC system can be raised.

The invention discloses a bilinear doping drainage heterogeneous material gate oxide layer graphene tunneling field-effect transistor (DL-HTFETs). The field-effect transistor undergoes P/N type heavy doping at a source region and a drain region, linear doping is carried out on regions, close to a channel, of the source end and the drain end, an oxidation layer close to a source electrode is formed by low-K oxide (SiO2), the oxidation layer close to a drain layer is formed by high-K oxide (HfO2), a conveying model of the novel bilinear doping drainage heterogeneous material gate oxide layer graphene tunneling field-effect transistor is built by means of a quantum mechanics model, and electrical properties of a high-K tunneling field-effect transistor (HK-TFETs), a common gate oxide tunneling field-effect transistor (LK-TFETs), a heterogeneous oxide tunneling field-effect transistor (HTFETs), a common filed-effect transistor and the DL-HTFETs are compared and analyzed by means of the model. As is shown by a research result, the DL-HTFETs have the advantages of low leakage currents, a high current switch ratio, low power consumption and short delay time and the like.

The invention discloses an envelope detector with a graphene transistor, comprising the graphene transistor, a first inductor, a first capacitor, a second inductor, a second capacitor, an input end and an output end, wherein the graphene transistor further comprises a substrate, a transition layer, a metal wiring layer, an interlayer medium layer, connecting lines, a source electrode, a drain electrode, a grid electrode and the channel layer of a graphene membrane, the source electrode is connected with ground, the grid electrode is connected with a bias voltage, and the drain electrode is connected with a working voltage. The envelope utilizes dual polarities of the graphene membrane, and has the advantages that the structure of a circuit is simple and gain can be provided simultaneously.

The invention provides a FinFET structure and a manufacture method thereof. The FinFET structure comprises a substrate, a first fin, a second fin, a grid lamination layer and isolation regions, wherein the first fin comprises a first channel region and a source region placed on the first channel region and wider than the first channel region; the second fin is parallel with the first pin, and comprises a second channel region and a drain region placed on the second channel region and wider than the second channel region; the grid lamination layer covers the substrate and sidewalls of the first and second channel regions; and the isolation regions are respectively placed at the two sides of the source region and the two sides of the drain region and on the grid lamination layer to isolate the source region, the drain region and the grid lamination layer from one another. According to the invention, the new device structure is provided on the basis of a present FinFET technology, and the grid length of the device is not limited by the footprint size, and the problem caused by the short channel effects is effectively solved.

The invention relates to a bi-material railing nanowire tunneling field effect device and a manufacturing method thereof. According to the bi-material railing nanowire tunneling field effect device, a channel is arranged at the center, and a source region and a drain region are respectively arranged at two ends, and an oxide and a gate electrode are covered at the periphery of the channel in sequence. The manufacturing method comprises the steps: SF6 etching a silicon column on a silicon wafer by using a round silicon nitride hard mask; conducting high-temperature oxidation, corroding and reducing the size of the silicon column to be a set diameter value of 6nm-30nm with HF aqueous solution, and conducting high-temperature oxidation to form a silicon column coated by an oxidation layer with set thickness; completing the preparation of a bi-material railing structure by adopting deposition and photoetching technology; and injecting boron and phosphorus of 1*10<20>cm<-2>/10keV and 5*10<18>cm<-2>/10keV at 120-150 DEG C respectively, and annealing at 900 DEG C/10s-1100 DEG C/10s to prepare the source region and the drain region; completing preparation of a metal electrode by CMOS (Complementary Metal-Oxide-Semiconductor) process; and manufacturing the bi-material railing nanowire tunneling field effect device.

The invention relates to a normally closed surface grid-type static induction transistor (SIT) of low power and a manufacturing method. The transistor is formed by parallelly connecting a drain electrode, a substrate of N+ low resistance monocrystal located on the drain electrode, an N- high resistance epitaxial layer located on the substrate of N+ low resistance monocrystal and multiple mutually parallelly-connected SIT units located in the N- high resistance epitaxial layer, wherein the active region uses the short channel design. The transistor is capable of enabling the impurity concentration of the device grid body to be high and enabling the impurity distribution to be more uniform under the corresponding technology support, reducing the own voltage drop of the grid body, increasing the sensitivity of the grid control, improving the device transconductance, reducing the grid source area, reducing the stray capacitance of the grid source, and increasing the SIT working frequency. Compared with the prior art, the short channel design is completely improved revolutionarily.

An impurity segregation and Schottky source drain component comprises an annular semiconductor channel in the perpendicular direction, an annular gate electrode, an annular gate medium layer, a source area, an impurity segregation area, a drain area, an impurity segregation area and a semiconductor substrate. The source area is located at the bottom of the channel in the perpendicular direction and connected with the substrate. The impurity segregation area is located between the source area and the channel in the perpendicular direction. The drain area is located at the top of the channel in the perpendicular direction. The impurity segregation area is located between the drain area and the channel in the perpendicular direction. The gate medium layer and the gate electrode surround the channel in the perpendicular direction in an annular mode. The source area and the drain area respectively make contact with Schottky which are the same as the channel in barrier height. The source end and drain end impurity segregation areas are highly doped areas with the same kind of impurities. According to the structure, the Schottky barrier source drain structure is used for lowering the thermal budget, decreasing leak currents and simplifying technology requirements, impurity segregation is used for thinning barriers and increasing driving currents, and the channel in the perpendicular direction and the annular gate structure are used for breaking through the photo-etching limitation in the integration machining process and increasing the integration level.

The invention provides a non-junction tunneling field effect transistor and a manufacturing method thereof. The non-junction tunneling field effect transistor comprises an insulation layer, a channel region arranged on the insulation layer, and a source electrode and a drain electrode which are arranged at two sides of the channel region, a gate medium layer arranged on the channel region, and a grid electrode which is arranged on the gate medium layer and comprises a top grid and a static modulation grid electrode. The non-junction tunneling field effect transistor has at least one of advantages as follows, simple structure, easy realization through utilizing the relatively simple process, flexible and adjustable doping concentration and relatively low power consumption.

The invention relates to a manufacturing method of a transistor and especially relates to a manufacturing method of a ring-fence non-junction nanowire transistor. MOCVD is used to epitaxially grow a doped nanowire array on an III-V family material. Through a thermal peeling adhesive tape and a fixing panel, the nanowire is transferred. A non-junction nanowire transistor with a ring-fence structure is manufactured on a silicon-based substrate. By using the manufacturing method of the ring-fence non-junction nanowire transistor provided in the invention, compatibility of an III-V family material nanowire and a plane silicon technology can be realized; simultaneously, mobility degeneration is effectively restrained and a current driving capability of the transistor is increased.

The invention relates to a core shell structure nanowire tunneling field effect device which comprises a gate electrode (6), a source region (1), a drain region (4), a central region and a gate dielectric layer (5), wherein the central region is in a coaxially symmetrical core shell structure; the core in the core shell structure is made of an insulator material; the shell in the core shell structure is made of a semiconductor material; the gate dielectric layer is completely sleeved into the central region and is used for electrically isolating the central region and the gate electrode; the gate electrode is completely sleeved into the dielectric layer; the grate electrode (6), the gate dielectric layer (5) and the central region are equal in length; and the source region and the drain region are respectively arranged at two sides of the central region. A field effect transistor has low leakage current, high grid-control capability and low subthreshold slope, and the drain induced barrier lowing and the short-channel effect are effectively suppressed, so that various nonideal effects of a ring gate nanowire tunneling field effect device in the size reducing process are reduced, and the comprehensive performance of the device is improved.

The invention discloses a two-dimensional heterojunction tunneling field effect transistor immunosensor and a preparation method thereof. A two-dimensional material with a specific band gap is selected and stacked into a vertical heterojunction as a channel layer, and the energy band structures of the device in an on state and an off state are respectively in staggered arrangement and staggered arrangement through gate voltage control, low current in the off state is realized, and in an on state, large current is obtained due to inter-band tunneling. A buried gate structure is used, and specific antibody protein molecules are used for surface modification on the surface of the heterojunction modulated by gate voltage. A heterojunction is used as an effective detection area and has ideal grid control capability. The dielectric regulation and control of a detection area is detected along with a detection sample by utilizing a plurality of electrical parameters. The sensor provided by theinvention has a steeper subthreshold slope, can realize ultra-high sensitivity detection of biomolecules and save precious clinical specimens, and meanwhile, because the thickness of a two-dimensional material is ultra-thin, the sensor has great advantages in size reduction and is convenient for energy band regulation and control.

The invention discloses a total dosage radiation-resistant FinFET device and a fabrication method thereof. In the device, a dumbbell-shaped Fin strip structure is formed on a semiconductor substrate by etching, on one hand, the potential control capability of a grid on a relatively thin middle part of the dumbbell-shaped Fin strip is improved, and the influence of trap charge caused by radiation in a shallow trench isolation (STI) region on the potential of the Fin strip can be effectively reduced; and on the other hand, the distance between the STI regions at two sides of the Fin is expanded,and an off-state leakage current of the device caused by radiation is reduced. And compared with conventional body silicon FinEFT, the dumbbell-shaped Fin strip structure has the advantages that thenormal-state grid control capability of the device is also improved, and the dumbbell-shaped Fin strip structure has larger on-state current.

The invention provides a nanotube device and a manufacturing method thereof. The manufacturing method comprises the following steps: providing a substrate in which a first source-drain region is formed; forming an annular column on the first source-drain region, the annular column comprising an annular channel region; sequentially forming annular gate dielectric layers and gates on the inner walland the outer wall of the annular channel region; and forming a second source-drain region on the annular channel region. In the method, gates are formed on the inner side wall and the outer side wallof a nanotube, so that a source region-gate-drain region nanotube device structure is formed on the inner and outer sides of the nanotube in the longitudinal direction, the gate area is increased, the gate control capability is improved, and the device has higher driving current. Moreover, the manufacturing difficulty is low, the compatibility with the existing process is good, and mass production of the nanotube device is facilitated.

The invention provides a low-power fin type field effect transistor and a manufacturing method thereof, and belongs to the technical field of super-large integrated circuit manufacture. The thickness of a sidewall channel layer and the thickness of a top channel layer of the field effect transistor are no greater than 10nm, and a fin-type isolation bar is formed on a deep body area far away from top gate control. Further shortening of a device trench length is facilitated, short channel effect control ability of the device is improved, and static power consumption is minimized. The source-drain area of the device is a monocrystalline active island, and has maller source-drain series resistance. Compared with a fin type field effect transistor employing lifting source-drain structure, the low-power fin type field effect transistor requires no epitaxial lifting source-drain to obtain rapidly high open-state current. The low-power fin type field effect transistor is compatible with conventional IC-manufacture technology and has the advantages of simple process and low manufacture cost.

The present invention provides a MOSFET device having a recessed drain structure with bidirectional level transfer, comprises a p-type substrate, a p-type epitaxial layer, an n-type drift layer, a p-type body region, a groove first drain, a first drain N + implantation region, a groove second drain, a second drain N + implantation region, a groove gate, a gate oxide dielectric layer, a p-type lightly doped first RESURF region and a p-type lightly doped second RESURF region; The invention realizes the complete symmetrical structure of the MOSFET. On the premise of guaranteeing a certain depth of the gate electrode and the drain trench, the device can realize the bidirectional level transmission and reduce the unavoidable loss when the circuit is used for the bidirectional level transmission. By using groove technology, the gate control ability of the device is improved, the transmission distance of the carrier is reduced, the on-resistance is reduced, and the reliability of the device is improved. By using RESURF technology, the electric field of surface breakdown is ensured to be increased, and the on-resistance of the device is also reduced, which further improves the reliabilityof the device.