Bilinear doping drainage heterogeneous material gate oxide layer graphene tunneling field-effect transistor

A technology of tunneling field effect and heterogeneous materials, which is applied in the field of graphene tunneling field effect transistors, can solve the problems of static power consumption increase and affecting the switching speed of MOSFET devices, etc.

Inactive Publication Date: 2014-10-08
NANJING UNIV OF POSTS & TELECOMM
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Problems solved by technology

[0005] As the metal-oxide-semiconductor field effect transistor (Metal-Oxide-Semiconductor Field Effect Transistor, MOSFET) gate length shrinks below 45nm, the subthreshold swing (Subthreshold Swing, SS) seriously affects the switching rate of the MOSFET device at the corresponding gate voltage, causing the leakage current of the MOSFET to increase exponentially with the decrease of the power supply voltage, so that the static power consumption increases exponentially

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  • Bilinear doping drainage heterogeneous material gate oxide layer graphene tunneling field-effect transistor
  • Bilinear doping drainage heterogeneous material gate oxide layer graphene tunneling field-effect transistor
  • Bilinear doping drainage heterogeneous material gate oxide layer graphene tunneling field-effect transistor

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with specific embodiments and accompanying drawings.

[0021] The bilinear doped-drain heterogeneous material gate oxide layer graphene tunneling field effect transistor of the present invention includes a source S, a drain D, a channel, an oxide layer 6 near the source, an oxide layer 7 near the drain, and a double gate 8-pole structure, the channel is composed of graphene nano-strips, and the graphene tunneling field effect transistor is P-type heavily doped region 2, linear doped region from the end close to the source S to the end close to the drain D. The impurity region 3, the intrinsic graphene nano-strip 1, the linear doped region 4, the N-type heavily doped region 5; the double gate 8 and the P-type heavily doped region 2, close to the source oxide layer 6 Between the linear doped region 3 and the intrinsic graphene nanostrip 1, near the drain oxide layer 7 and the double gate 8 and the intrin...

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Abstract

The invention discloses a bilinear doping drainage heterogeneous material gate oxide layer graphene tunneling field-effect transistor (DL-HTFETs). The field-effect transistor undergoes P/N type heavy doping at a source region and a drain region, linear doping is carried out on regions, close to a channel, of the source end and the drain end, an oxidation layer close to a source electrode is formed by low-K oxide (SiO2), the oxidation layer close to a drain layer is formed by high-K oxide (HfO2), a conveying model of the novel bilinear doping drainage heterogeneous material gate oxide layer graphene tunneling field-effect transistor is built by means of a quantum mechanics model, and electrical properties of a high-K tunneling field-effect transistor (HK-TFETs), a common gate oxide tunneling field-effect transistor (LK-TFETs), a heterogeneous oxide tunneling field-effect transistor (HTFETs), a common filed-effect transistor and the DL-HTFETs are compared and analyzed by means of the model. As is shown by a research result, the DL-HTFETs have the advantages of low leakage currents, a high current switch ratio, low power consumption and short delay time and the like.

Description

technical field [0001] The invention belongs to the field of graphene tunneling field effect transistors and relates to a structural device suitable for graphene devices. Background technique [0002] In recent years, the appearance of graphene has stirred up huge waves in the scientific community, and it is considered to be one of the most promising carbon nanomaterials in the future due to its superior properties. Graphene has high electron mobility and high conductivity. Transistors made of graphene are not only small in size, low in power consumption, and low in requirements for the working environment, but also easy to design into various structures. However, since graphene is a zero-bandgap material, its Fermi energy is lightly distributed, so it is not suitable for direct application in transistors. However, the band gap can be generated by cutting graphene into strips in a certain direction [HAN M Y, OZYILMAZ B, KIM P, et al. Energy band-gap engineering of graphene ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L29/49H01L29/36
CPCH01L29/7831H01L29/78684
Inventor 王伟高健张露岳工舒
Owner NANJING UNIV OF POSTS & TELECOMM
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