Solder-reflow soldering method

A welding method and reflow soldering technology, which are applied in the direction of welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problem of high void rate in reflow soldering, achieve effective control of solder void rate, eliminate air bubbles, and reduce the risk of forming solder voids The effect of chance

Inactive Publication Date: 2009-04-01
BYD CO LTD
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: provide a reflow soldering method, aiming to solve the problem of high solder void rate in existing reflow soldering

Method used

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Examples

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Embodiment Construction

[0006] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0007] In the embodiment of the present invention, when the workpiece to be welded is in the reflow zone of the reflow oven, ultrasonic waves are used to oscillate it, so that most of the bubbles in the liquid solder are broken, which effectively reduces the probability of welding voids at the soldering place, and can perform soldering on the surface of the soldering tin. Cleaning, so that the welding void rate is effectively controlled and the welding performance is also improved.

[0008] The welding equipment used in the reflow soldering method of the embodiment of the present invention includes a reflow furnace and an u...

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Abstract

The invention is applicable to the field of reflow soldering, which provides a reflow soldering method comprising the following steps: a workpiece to be soldered is arranged into a reflow brazier, and processes are carried out in a preheating region, a reacting region, a reflow region and a cooling region of the reflow brazier in sequence. The ultrasonic wave is applied on the workpiece to be soldered in the reflow region to cause the workpiece to vibrate while being processed. As soldering tin in the reflow region is easy to generate bubbles and form voidages and the ultrasonic wave is applied in the reflow region to cause the workpiece to vibrate, a majority of bubbles generated by the soldering tin are eliminated, thereby effectively reducing the probability of forming soldering voidages at the soldering part, and the surface of the soldering tin can be cleaned so as to ensure that the soldering voidage ratio can be effectively controlled and the soldering performance can be improved.

Description

technical field [0001] The invention belongs to the field of welding, in particular to a reflow soldering method. Background technique [0002] Reflow soldering is a widely used PCB board soldering process, mainly used for soldering SMD components on PCB boards. When the solder melts into a liquid state, some bubbles do not have enough energy to escape from the solder, and when the solder solidifies, a void is formed; as the pad increases, the bubbles in the liquid solder need a longer distance to escape from the solder. out, more energy is required. In the case of a certain energy, with the increase of the pad, more bubbles cannot escape from the solder, and the solder void rate will be higher, which will affect the electrical and thermal conductivity. Although the flux can improve the solderability of the solder at a certain temperature, and can volatilize into a gas under suitable temperature conditions, but the flux that has not volatilized after the soldering is compl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/20B23K1/008
Inventor 黄镇生刘旭
Owner BYD CO LTD
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