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Solder-reflow soldering method

A soldering method and reflow soldering technology, applied in soldering equipment, metal processing equipment, manufacturing tools, etc., to achieve the effects of improving soldering performance, eliminating air bubbles, and effectively controlling solder void rate

Inactive Publication Date: 2011-03-02
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: provide a reflow soldering method, aiming to solve the problem of high solder void rate in existing reflow soldering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0008] The welding equipment used in the reflow soldering method of the embodiment of the present invention includes a reflow furnace and an ultrasonic generation and control system. The reflow oven includes four zones: a preheating zone, an active zone, a reflow zone and a cooling zone. The reflow oven creates a protective atmosphere to avoid oxidation during soldering. The ultrasonic generation and control system is used to generate appropriate ultrasonic waves and control the power and action time of ultrasonic waves. The ultrasonic wave is added to the workpiece to be welded in the reflow zone, and the power of the ultrasonic wave increases with the weight of the workpiece. The time for the ultrasonic wave to act on the workpiece is 0.5 to 1.5 minutes. The specific time can be adjusted according to the actual situation by changing the speed of the workpiece conveyor belt and the length range of the ultrasonic wave.

[0009] After the workpiece to be welded is loaded into...

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PUM

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Abstract

The invention is applicable to the field of reflow soldering, which provides a reflow soldering method comprising the following steps: a workpiece to be soldered is arranged into a reflow brazier, and processes are carried out in a preheating region, a reacting region, a reflow region and a cooling region of the reflow brazier in sequence. The ultrasonic wave is applied on the workpiece to be soldered in the reflow region to cause the workpiece to vibrate while being processed. As soldering tin in the reflow region is easy to generate bubbles and form voidages and the ultrasonic wave is applied in the reflow region to cause the workpiece to vibrate, a majority of bubbles generated by the soldering tin are eliminated, thereby effectively reducing the probability of forming soldering voidages at the soldering part, and the surface of the soldering tin can be cleaned so as to ensure that the soldering voidage ratio can be effectively controlled and the soldering performance can be improved.

Description

technical field [0001] The invention belongs to the field of welding, in particular to a reflow soldering method. Background technique [0002] Reflow soldering is a widely used PCB board soldering process, mainly used for soldering SMD components on PCB boards. When the solder melts into a liquid state, some bubbles do not have enough energy to escape from the solder, and when the solder solidifies, a void is formed; as the pad increases, the bubbles in the liquid solder need a longer distance to escape from the solder. out, more energy is required. In the case of a certain energy, with the increase of the pad, more bubbles cannot escape from the solder, and the solder void rate will be higher, which will affect the electrical and thermal conductivity. Although the flux can improve the solderability of the solder at a certain temperature, and can volatilize into a gas under suitable temperature conditions, but the flux that has not volatilized after the soldering is comp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/20B23K1/008
Inventor 黄镇生刘旭
Owner BYD CO LTD
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