Method for preparing low-temperature interconnection/high-temperature serving joints by using nano intermetallic compound particles

Abstract

The invention discloses a method for preparing low-temperature interconnection / high-temperature serving joints by using nano intermetallic compound particles, which relates to a packaging and assembling interconnected method for electronic devices. The method specifically comprises the following steps: 1, placing nano intermetallic compound soldering paste on a substrate, completing a process of aligning a component to be welded, and exerting a pressure; and 2, placing the system into a reflow oven, and through the stages of preheating, heat preservation, reflowing and cooling, completing the volatilization of organic matters, the uniform sintering of nano intermetallic compound particles and the wetting and interface reaction of a pad. Because nano intermetallic compound particles are applied to the method disclosed by the invention, the great surface activity of the nano particles can provides a powerful driving force for the sintering process thereof, so that the low-temperature connection compatible with the traditional reflow soldering process and far lower than the melting point of a block thereof is realized, and then a joint with good performances is formed, therefore, the low-temperature bonding / high-temperature serving is realized on the premise of low cost, good compatibility with the traditional process, and high production efficiency.

Description

technical field [0001] The invention belongs to the technical field of micro-connection, and relates to a packaging, assembly and interconnection method for electronic devices, in particular to a method for preparing low-temperature interconnection and high-temperature service joints by using nanometer intermetallic compound particles. Background technique [0002] Connection technology is one of the core technologies in electronic device packaging, LED packaging, microsystem packaging, and power component packaging. According to Moore's Law, the power of packaged components continues to rise and the pin density continues to increase, making it necessary to serve at higher and higher temperatures and ensure long-term reliability. However, traditional solder alloys or conductive silver pastes cannot work reliably in high-temperature environments, and the relatively poor high-temperature service performance of interconnection parts has become one of the main bottlenecks restri...

AI Technical Summary

Problems solved by technology

According to the thermodynamic properties of nanoparticles, the melting point of silver nanoparticles can be reduced to below 100°C, and the connection can be realized at 150°C, and the service temperature of its joints can reach above 300°C, that is, low-temperature connection and high-temperature service are realized; however, the connection process It takes a long time (generally, when the connection temperature is 150°C, the connection time needs to be more than 30 minutes to form a stable connection), the joint is porous structure (the porosity is about 15%, which affects the electrical and thermal conductivity), and the cost is high, which restricts the connection. Wide application of materials

All intermetallic compound interconnection is to fully react the interface at normal brazing temperature until the joint is completely transformed into an intermetallic compound. The service temperature that the joint can withstand is determined by the intermetallic compound with a higher melting point rather than the solder. It can also be used Realize low-temperature connection and high-temperature service, but the reaction time needs at least tens of minutes, the production efficiency is too low, and the components of the joint cannot be precisely controlled, so it is difficult to achieve large-scale industrial application

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