LED lamp filament illuminating strip and preparation method therefor

Abstract

The invention discloses an LED lamp filament illuminating strip and a preparation method therefor. The illuminating strip comprises LED chips in upper and lower rows, wherein all LED chips in the lower row are distributed at intervals, and all LED chips in the upper row are respectively connected between two adjacent LED chips in the lower row in a lap joint manner. The illuminating surfaces of the LED chips in the upper and lower rows are opposite to each other. The positive and negative electrodes of all LED chips in the upper row are respectively welded with the negative and positive electrodes of two adjacent LED chips, in lap joint connection with the LED chips in the upper row, in the lower row. The preparation method comprises the steps: coating solder paste on the positive and negative electrodes of all LED chips in the lower row; heating the solder paste and enabling the solder paste to be melted, welding the corresponding electrodes, coating the front and back surfaces of chip strips in series connection with fluorescent glue, and solidifying the fluorescent glue. The illuminating strip employs the chips which are not overlapped with each other, and the illuminating surfaces of the chips are arranged oppositely, thereby improving the light-emitting uniformity and facilitating heat dissipation. The wire crossing and tandem among chips is avoided, the packaging cost is reduced, and the yield of finished products is improved.

Description

Technical field [0001] The invention relates to an LED filament light-emitting strip and a preparation method thereof, and belongs to the technical field of semiconductor light-emitting device manufacturing. Background technique [0002] Light-emitting diodes (LEDs) have achieved great development because of their constant current drive, energy saving, environmental protection, small size, low power consumption, and long service life. Compared with traditional incandescent lamps, LED luminescence is difficult to directly replace traditional incandescent lamps due to its point light source and directional characteristics. Therefore, people now make LED chips into filament strips through the packaging process and connect them to current power supplies. Then it can emit light at all angles like a tungsten lamp. Among them, the LEDs in the LED filament lamp are usually fixed together in series or parallel, or a combination of series and parallel, connected by wires, and then assembl...

AI Technical Summary

Problems solved by technology

Although the filament achieves 360-degree light emission, the substrate formed of silicone resin containing phosphor and the light-emitting orientation of the chip must meet specific requirements, otherwise uneven light mixing may eventually occur

[0007] Compared with the existing LED filament chip attached to the substrate, the unidirectional continuous distribution on both sides of the substrate, the substrate not only affects the transmission of light, increases the cost, but also hinders the dissipation of heat, and the distribution of the chip affects the uniformity of light. The wire bonding connection of the chip reduces the reliability of the packaging yield

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