43results about How to "Correct warping" patented technology

When mounting an IC chip on a circuit board, bumps are formed on electrodes of the IC chip, and the bumps and the electrodes of the circuit board are aligned in position with each other with interposition of an insulative thermosetting resin having no conductive particle between the electrodes of the circuit board and the bumps. The IC chip is pressed against the circuit board with a pressure force of not smaller than 20 gf per bump by a heated head so as to perform warp correction of the IC chip and the board, while the resin interposed between the IC chip and the circuit board is hardened to bond the IC chip and the circuit board together.

A liquid crystal display device is manufactured by first forming a crystalline semiconductor film 2103, of silicon for example, over an insulating substrate 2101, such as glass. The substrate is warped in the process. The warpage is corrected by suction against a stage 2201. The film crystallinity is enhanced by scanning with a linear laser beam.

A pull band (34) is attached to a printing plate (22) in a flexographic printing operation to hold a flexible substrate (30) in a selected orientation for transfer of ink in a selected pattern. The pull band overcomes differences in friction between the printing plate and the substrate in areas of different amounts of ink to maintain the selected orientation. A specific length pull band may be selected and cut from a roll of pull band material. Pull bands may be attached parallel and perpendicular to the direction of rotation of the printing plate.

In various implementations, provided are systems and methods for correcting the distortion present in a fisheye image, and rendering the image for display as 360-degree video. In various implementations, a computing device can receive 2-dimensional video data captured by an omnidirectional camera. The computing device can map an image from each video frame to a 3-dimensional hemispherical representation. In various implementations, this mapping can be executed using a polynomial model. The 3-dimensional hemispherical representation can then be used in a 360-degree video presentation, to provide a virtual reality experience.

A microlens substrate will warp when an oxide film is formed and annealed before forming a mask in order to adjust the etching rate of wet etching. Accordingly, a film exerting a stress that cancels out this warping is formed upon a microlens. This film functions as an optical path length adjusting layer.

A wiring board which includes a product portion configured with at least one layer of electrically insulating base, a wiring pattern formed on the surface or inner portion of the electrically insulating base, and a wiring protection layer which is formed on the surface of the board and has an opening. Warping over the entire wiring board can be reduced since this wiring board has a warp-correcting portion warped in a direction different from that of the product portion.

A linear light source device comprises a wiring substrate in a rectangular shape and a wiring pattern formed thereon, a plurality of light emitting elements arranged on the wiring substrate in a longitudinal direction of the wiring substrate and connected with the wiring pattern on the wiring substrate, reflectors, each of which includes two parts having slope surfaces on one side and the other side facing each other in the longitudinal direction of each light emitting element, and which are separated from each other on the wiring substrate corresponding to the light emitting elements, respectively; and a sealing resin sealing the light emitting elements by burying a recession portion defined by a surface of the wiring substrate where the light emitting elements are arranged and the two slope surfaces, wherein the two parts of each of reflectors have convex portions on their upper surfaces, respectively.

A light guide plate warping correction method comprises the following steps: placing a warping light guide plate between an upper platen and a lower platen; stitching the upper platen, the warping light guide plate and the lower platen through utilizing an oil hydraulic cylinder against the upper platen; and winding a coin surrounding the light guide plate, wherein there is a gap between the coil and the light guide plate, an electromagnetic wave is generated after energizing the coil, the electromagnetic wave traverses through the gap and heats the warping light guide plate, and the oil hydraulic cylinder still stitches the upper platen, the warping light guide plate and the lower platen when the warping light guide plate is heated by the electromagnetic wave in order to correct the warping light guide plate. A light guide plate warping correction device comprises a holder composed of the upper platen, the lower platen and the oil hydraulic cylinder, and a heater comprising the coil.

A screen printing apparatus of the invention comprises: a supporting device supporting a circuit substrate from below; a clamp, from both sides, holding the side surface of the circuit substrate supported by the supporting device; a circuit substrate pressing device for pressing the circuit substrate from above, which is supported on the supporting device and maintaining the circuit substrate in a warp and then straightened state along an up-and-down direction. The circuit substrate pressing device holds the circuit substrate to move the same along a holding direction of the clamp. According to the invention, via the circuit substrate pressing device pressing the circuit substrate, a warp of the circuit substrate can be straightened and the circuit substrate can be maintained in this state.

The invention discloses a device for correcting an automobile frame body, which comprises a front correction mechanism, a front jacking mechanism, a front slider, a rear slider, a rear correction mechanism, a guide column, a front clamping and positioning mechanism, a rear clamping and positioning mechanism, a rear jacking mechanism and a base plate, wherein the front correction mechanism and the guide column are arranged side by side, the front jacking mechanism is positioned behind the front correction mechanism, the front clamping and positioning mechanism is positioned behind the front jacking mechanism, the rear clamping and positioning mechanism is positioned on the front slider which is arranged behind the front clamping and positioning mechanism, the rear jacking mechanism is positioned behind the rear clamping and positioning mechanism, the rear correction mechanism is positioned on the rear slider which is arranged behind the rear jacking mechanism, and the front correction mechanism, the front jacking mechanism, the front slider, the rear slider, the rear correction mechanism, the guide column and the front clamping and positioning mechanism are all arranged on the base plate. The device can effectively correct buckling deformation ofthe head and tail parts of the automobile frame after welding.

A method for producing a 3D protective glass, comprises the steps of a glass forming step and a chemical strengthening treatment step, wherein the glass forming step includes a heating step of heatinga flat glass material to a transition temperature Tg [DEG C] or more of the glass material, applying a bending in a thickness direction to at least a portion of a peripheral portion of the glass material using a pair of dies including a punch and a die, and a cooling step of cooling the glass material below the temperature of Tg after the heating step; the chemical strengthening treatment step isa step of performing a chemical strengthening treatment on the glass material after the glass forming step; and the cooling step includes the steps of: recording the control temperature of the die asa control temperature T1 [ DEG C]; when the control temperature of the die is recorded as the control temperature T2 [DEG C], and setting at least one of the T2 and the T1 to be equal to or lower than the Tg of the glass material, wherein the T2 is greater than the T1 and the (T2-T1) is maintained at 10 DEG C or higher.

The invention provides an electronic equipment assembling device and an electronic equipment assembling method which can correct warping of a cable and reliably perform connection work of a plurality of cables with different width sizes. The electronic equipment assembling apparatus includes a robot control device that controls the operation of a gripping device that grips a flat and flexible cable having a free tip and a robot arm that moves the gripping device with respect to a circuit board that is a connection target of the tip of the cable, the gripping device having a suction unit that sucks the gripping device, and the robot arm that moves the gripping device with respect to the circuit board to which the tip of the cable is to be connected. A suction member provided on the lower surface and holding one surface of the cable in a suction manner; and a gripping claw which is located on the outer side of the suction part in the width direction and holds the cable in a manner of clamping the cable in the width direction, a first inclined surface is formed on the inner side of the gripping claw in the width direction, the first inclined surface is inclined from the bottom of the gripping claw in a manner that the gripping width becomes larger toward the upward direction, and a second inclined surface is formed on the bottom of the gripping claw. When the gripping claw is in a horizontal state, the second inclined surface is inclined with the front higher than the rear.

The invention relates to a rotary device. The rotary device (1) according to an embodiment of the present invention is provided with: a casing (2) including a first case (21) and a second case (22) opposed to each other; a motor (3) housed in the casing (2); and a gear (5) that transmits the rotation of the motor (3) to the outside and that is housed in the casing (2). A tubular protrusion part (28) having a first through-hole (281) is formed in the first case (21), and a second through-hole (282) into which the protrusion part (28) is fitted is provided in the second case (22).