2results about How to "Correct warping" patented technology

This invention provides a wafer storage device and semiconductor equipment. The temperature control unit includes a cooling module and a preheating module, which are thermally connected to the wafer carrier plate through a thermally conductive structure. In the preheating mode, the preheating module heats the wafer carrier plate to a first preset temperature. Due to the increased temperature of the wafer carrier plate, the high-temperature wafer will not break due to a sudden temperature drop after entering the wafer storage device. After the wafer is placed on the wafer carrier plate, it is still at a relatively high temperature. Under the influence of the supporting force of the wafer carrier plate and its own gravity, the warpage of the wafer will be corrected to a certain extent. Before certain process steps, the preheating module can preheat the wafer in advance, thereby reducing the heating time of the process cavity and improving the efficiency of subsequent processes. In the cooling mode, the preheating module and the cooling module work simultaneously to linearly cool the wafer carrier plate to a second preset temperature, which can avoid sudden temperature changes of the wafer and reduce the probability of wafer breakage during cooling.