55results about How to "Reduce heat shrinkage" patented technology

A bag of a heat shrinkable, gas-barrier thermoplastic film for packaging an item comprises a first seal adjacent a bottom edge and connecting first and second side edges, and defining an area between it, the side edges and a top edge for receiving the item, a second seal along the bottom edge or between the bottom edge and the first seal and connecting the side edges, and having a shaped portion adjacent a corner of the bag at the first side edge and the bottom edge which projects towards the top edge, and a precut extending from the bottom edge towards an apex of the shaped portion, the first seal extending from the second side edge towards the shaped portion at a level below the apex and around the shaped portion to the first side edge, and a manually graspable tab being formed between the first side edge, the first and second seals adjacent the first side edge and the shaped portion.

An interlayer insulation film is etched to form contact holes in an integrated circuit part. At this time, a trench is not formed in a guard ring part. Subsequently, ion implantation is carried out in source / drain regions in a peripheral circuit part for contact compensation, and high-temperature annealing is carried out in order to activate implanted impurities. Subsequently, an interlayer insulation film, a storage capacitor, and another interlayer insulation film are formed in sequence. Then, contact holes reaching a part of wiring layers are formed in the peripheral circuit part while, in the guard ring part, a trench reaching a diffusion layer is formed. Next, a barrier metal film is formed in each of the contact holes and the trench, and further, a contact plug comprising, for example, a W film is buried therein.

Provided is an alkali-free glass, which is substantially free of alkali metal oxides, and has a strain point of more than 680° C., an average coefficient of thermal expansion in the temperature range of 30 to 380° C. of 40 to 55×10−7 / ° C., and a liquidus temperature of less than 1,200° C. Further, the alkali-free glass comprises, as a glass composition in terms of mass %, 55 to 70% of SiO2, 10 to 20% of Al2O3, 0.1 to 4.5% of B2O3, 0 to 1% of MgO, 5 to 15% of CaO, 0.5 to 5% of SrO, and 5 to 15% of BaO.

The invention provides a heat-shrinkable polyester film with high mechanical strength in a width direction that is orthogonal to the main shrinking direction and high tensile rupture elongation in the film width direction after being subjected to an aging treatment in a high-temperature environment. The heat-shrinkable polyester film is made from a polyester resin containing ethylene terephthalate as the main component and a monomer component that can serve as an amorphous component in an amount of 0 mol % or more and less than 1 mol % relative to the total amount of polyester resin components.

The invention discloses a power cable comprising a supporting core, single core bodies, and an insulation layer. The supporting core and the single core bodies are disposed in the insulation layer. The supporting core is disposed on the central position of the insulation position, and the number of the single core bodies is more than one. The single core bodies are in a circular arrangement, and are disposed in an annular cavity formed by the supporting core and the insulation layer. Each of the single core bodies comprises a hollow conductive layer, an insulation medium filler, and an insulation medium protection sleeve. The insulation medium filler is disposed in the hollow conductive layer, and the periphery of the insulation medium protection sleeve is provided with wrinkled textures. The outer side of the insulation layer is provided with an inner sheath, the outer side of which is provided with a fireproof layer. The outer side of the fireproof layer is provided with a steel wire armor layer in a single-stranded and twisted way, and the steel wire armor layer adopts galvanized circular steel wires. The outer side of the steel wire armor layer is provided with an outer sheath. The thermal shrinkage problem of the cable is effectively solved, and at the same time, mechanical damages of underground machinery construction and subterranean animals are prevented.

A flat panel display glass substrate includes a glass comprising, in mol %, 55-80% SiO2, 3-20% Al2O3, 3-15% B2O3, and 3-25% RO (the total amount of MgO, CaO, SrO, and BaO). The contents in mol % of SiO2, Al2O3, and B2O3 satisfy a relationship (SiO2+Al2O3) / (B2O3)=7.5-17. The strain point of the glass is 665° C. or more. The devitrification temperature of the glass is 1250° C. or less. The substrate has a heat shrinkage rate of 75 ppm or less. The rate of heat shrinkage is calculated from the amount of shrinkage of the substrate measured after a heat treatment which is performed at a rising and falling temperature rate of 10° C. / min and at 550° C. for 2 hours by the rate of heat shrinkage (ppm)={the amount of shrinkage of the substrate after the heat treatment / the length of the substrate before the heat treatment}×106.