Oven with bent rail

A technology of curved rails and ovens, applied in general parts of printing machinery, printing, printing machines, etc., can solve problems such as no prevention, and achieve the effect of reducing internal stress concentration, reducing heat shrinkage, and correcting warpage.
CN110370799AInactive Publication Date: 2019-10-25江苏上达半导体有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
江苏上达半导体有限公司
Publication Date
2019-10-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention belongs to the technical field of flexible circuit board ink baking devices, and in particular, relates to an oven with a bent rail. An upper roller bracket fixed plate and a lower roller bracket fixed plate are arranged in the oven; multiple rows of upper roller brackets are symmetrically arranged on the lower side of the upper roller bracket fixed plate in an oven access port direction, and the extension lengths of the upper roller brackets are gradually increased from middle row to two side rows; lower roller brackets matched with the upper roller brackets of the upper rollerbracket fixed plate are symmetrically arranged on the upper side of the lower roller bracket fixed plate in the oven access port direction, and the extension lengths of the lower roller brackets are gradually reduced from middle row to two side rows; and rollers rotated in the oven access port direction are arranged at the end parts of free ends of the upper roller brackets and at the end parts offree ends of the lower roller brackets. Under a concave-convex cooperation effect of the upper roller brackets and the lower roller brackets, flexible circuit boards are baked in a reverse warping state for drying ink to achieve a warp correcting effect.
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Description

technical field

[0001] The invention belongs to the technical field of ink baking devices for flexible circuit boards, and in particular relates to an oven with curved tracks. Background technique

[0002] In recent years, electronic products have become increasingly miniaturized and thinner. Based on this trend, the structure of electronic components and their carriers has to be further refined and refined, which directly makes the precision requirements for bonding ICs Higher and higher.

[0003] The manufacturing method of flexible circuit boards is usually: applying surface treatment process and ink printing process on the circuit pattern formed by stamping and lamination process and wet film or dry film etching process. After ink printing, heat curing treatment is usually carried out. However, the ink will shrink due to heat during the curing process, especially when the ink is epoxy ink, the heat shrinkage is more serious, and the heat shrinkage makes the printing sur...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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