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Heat-conductive laminated material and manufacturing method thereof

A technology of laminate materials and thermal conductive layers, applied in chemical instruments and methods, layered products, semiconductor devices, etc., can solve the problem of poor contact tightness between thermally conductive pressure-sensitive adhesive tapes and adherends, difficulty in removing adhesive tapes, and damage to electronic products. components, etc., to achieve the effects of excellent reworkability, favorable thermal conductivity, and excellent handling performance

Inactive Publication Date: 2009-09-30
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for these heat-conducting pressure-sensitive tapes, the adhesive strength of the tape is uniform, and the tape cannot meet the requirements for more complex properties such as sheets exhibiting strong adhesion on one surface and weak adhesion on the other surface
For example, in the case where low-strength electronic components and high-strength heat dissipation components are fixed together with pressure-sensitive tape for heat dissipation, it is extremely difficult to remove the tape (i.e., rework) in the event of initial bond failure, and if the tape is forcibly removed , it may damage electronic components
To solve this problem, there have been proposed methods of controlling the adhesion strength by treating one surface of the pressure-sensitive tape with dusting powder, but these methods bring about other problems because the heat-conductive pressure-sensitive tape and the adherend Contact tightness tends to deteriorate, resulting in significantly lower thermal conductivity

Method used

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  • Heat-conductive laminated material and manufacturing method thereof
  • Heat-conductive laminated material and manufacturing method thereof
  • Heat-conductive laminated material and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0166] The details of the present invention are described below using a series of examples and comparative examples, but the following examples do not limit the present invention in any way.

[0167] First, components (a) to (f) used in the following Examples and Comparative Examples are listed below.

[0168]

[0169] -(A-1) Dimethicone in which both molecular chain terminals are terminated with dimethylvinylsiloxy groups, having a kinematic viscosity at 25° C. of 600 mm 2 / sec

[0170] -(A-2) Dimethicone in which both molecular chain terminals are terminated with dimethylvinylsiloxy groups, having a kinematic viscosity at 25° C. of 30,000 mm 2 / sec

[0171]

[0172] -(B-1) Alumina powder with an average particle size of 10.7 microns (absolute specific gravity: 3.98)

[0173] -(B-2) Alumina powder with an average particle size of 1.1 microns (absolute specific gravity: 3.98)

[0174] -(B-3) Zinc oxide powder with an average particle size of 0.6 microns (absolute specifi...

preparation example 1 to 4

[0195] [Preparation Examples 1 to 4, Comparative Preparation Examples 1 to 4]

[0196]

[0197] The components shown in Table 1 below were mixed together in the blending amounts (parts by mass) shown in Table 1 using the method described below, thereby forming a series of compositions S1 to S7. Compositions S5, S6 and S7 do not meet the conditions of the present invention.

[0198] Component (a), component (b), and if used, component (g) and component ( h), and mix the components for 60 minutes. Subsequently, component (d) and component (e) were added, and the resulting mixture was thoroughly mixed. Finally, component (c) and component (f) are added, and the mixture is mixed well again to form a homogeneous composition.

[0199] [Table 1]

[0200]

[0201] (Note 1): The values ​​in parentheses ( ) in this table represent parts by volume of the resin portion in component (f) per 100 parts by volume of component (a).

[0202] (Note 2): The concentration values ​​of com...

Embodiment 1 to 4

[0204] [Examples 1 to 4, Comparative Examples 1 to 5]

[0205]

[0206] The laminates shown in Tables 2 and 3 below were produced in the following manner using the conditions shown in Tables 2 and 3. First, one of the compositions obtained in Table 1 (hereinafter referred to as composition X1) was selected, and this composition X1 was applied to a substrate and then cured to produce a single-layer thermally conductive cured product (Y1). Subsequently, another composition obtained in Table 1 (hereinafter referred to as composition X2) was selected, and this composition X2 was applied to the single-layer thermally conductive cured product Y1, followed by curing, resulting in a laminate (Y2).

[0207]Each of the laminates thus obtained was evaluated for tack, reworkability and selective releasability, oil bleed, release from the substrate, handling after peeling from the substrate, and thermal resistance. The results are shown in Table 2 and Table 3.

[0208] -Peelability

...

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Abstract

The present invention relates to a heat-conductive laminated material and a manufacturing method thereof. The heat-conductive laminated material which comprises a first solidified product layer that is obtained through solidifying a silicone composition 1 and a second solidified product layer that is obtained through solidifying a silicone composition 2 and is formed on the first solidified product layer. The silicone composition 1 comprises the following components: (a) organopolysiloxane with alkenyl, (b) heat-conductive filler, (c) organic hydrogen polysiloxane, (d) platinum group metal base catalyst, (e) reaction retarder and (f) organosilicon resin. The silicone composition 2 comprises the components (a) to (f) but has a formula different from that of the silicone composition 1. The heat-conductive sheet of the invention has satisfactory viscosity and can be fixed to a heat-generating electronic component or heat-dissipating component by means of the self viscosity. The heat-conductive laminated material represents advantageous reprocessing property.

Description

technical field [0001] The present invention relates to heat-conductive laminates that can be placed at the thermal interface between heat-generating electronic components and heat-dissipating components, such as heat sinks or circuit boards, to cool the heat-generating electronic components. The invention also relates to a method of manufacturing the thermally conductive laminate. Background technique [0002] As electronic components (including semiconductor components such as CPUs, driver ICs and memory chips, and light-emitting components such as LEDs) used in electronic equipment such as personal computers, digital video disks, and portable phones continue to improve in terms of performance and speed, As the size decreases and the level of integration increases, the heat generated by these electronic components increases significantly. The temperature rise of these heat generating electronic components caused by this heat generation can lead to malfunction or even fail...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/28C08J5/18C08L83/04C08L83/05C08K3/08C08K3/22C08K3/04H01L23/373
Inventor 远藤晃洋朝稻雅弥丸山贵宏
Owner SHIN ETSU CHEM IND CO LTD
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