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155results about How to "Increase temperature coefficient" patented technology

Current/frequency conversion circuit

The invention discloses a current/frequency conversion circuit, which comprises an integrator, a logic control circuit, a constant current source, an analog electronic switch and a temperature compensation circuit, wherein the input end of the integrator is connected to the input current, and the output end of the integrator is connected to the logic control circuit; the control signal output endof the logic control circuit is connected to the analog electronic switch, and the logic control circuit is further provided with a digital output end used for outputting a digital pulse frequency anda clock input end used for inputting an external clock; one end of the analog electronic switch is connected to the output end of the constant current source, and the other end of the analog electronic switch is connected to the input end of the integrator; and the temperature compensation circuit is connected to an adjusting port of the constant current source. The reference voltage is directlychanged through the temperature compensation circuit, so that the output of the constant current source is changed, the temperature change of the whole circuit is compensated, and the current/frequency conversion circuit is good in temperature coefficient. The temperature coefficient of the circuit is greatly improved without depending on an index of a single device. Meanwhile, the line structureis simple and the stability of a converter cannot be affected.
Owner:XIAN MICROELECTRONICS TECH INST

Flexible magnetic field measurement device and manufacturing method

The invention discloses a flexible magnetic field measurement device and a manufacturing method and belongs to the magnetic sensor field. The device comprises a flexible substrate layer, a metal buffer layer, a magnetostrictive layer, a piezoelectric film layer and a protection layer which are sequentially laminated from down to up, wherein a side of the piezoelectric film layer corresponding to the protection layer is provided with an energy transducer layer embedded in the protection layer, and the energy transducer layer is a single-end or double-end resonance type structure composed of aninterdigital energy transducer and a reflecting grating. The measurement device is advantaged in that through utilizing the flexible substrate material, compared with a sensor prepared from a traditional rigidity substrate material, besides surface acoustic wave modes including common rayleigh waves and Love waves, a new wave mode, e.g., lamb waves can be further generated by the flexible magneticsensor, so bending property, high magnetic field sensitivity, integrated processing and low cost are realized, and the measurement device is suitable for miniaturization and intelligentization development of sensors, and the measurement device is applicable to magnetic field measurement and intelligent wearing fields.
Owner:CHONGQING UNIV

Novel packaging method of MEMS (Micro-electromechanical Systems) structure and processing circuit integrated system

The invention relates to a novel packaging method of an MEMS (Micro-electromechanical Systems) structure and a processing circuit integrated system. The method comprises the following steps: (1) preserving a plurality of circuit chip holding areas on each substrate unit of an MEMS wafer, and putting circuit chips on the MEMS wafer to form integration of the MEMS structure with a processing circuit; (2) utilizing a vertical intercoupling technique, using silicon as a cover plate in which a vertical through hole is formed, filling a conductive material into the through hole to form an input port and an output port of the structure; (3) forming a plurality of grooves in the binding surface of the cover plate for providing a vacuum airtight environment necessary for working of an MEMS device and a space required by the circuit, wherein an air sucking agent film inside the cover plate groove is used for maintaining the vacuum degree; (4) performing wafer binding on the cover plate and the MEMS wafer so as to achieve the wafer grade vacuum integrated packaging. The method is not only simple in process, wide in application range and remarkable in effect, but also can avoid thermal stress caused by the coefficient of thermal expansion, and can remarkably improve the temperature coefficient of a device.
Owner:BEIJING MXTRONICS CORP +1

Linear Regulator with Current-Limited Short-Circuit Protection

ActiveCN102279613AReduce volumeTo achieve the purpose of pressure regulationElectric variable regulationShort circuit protectionVoltage regulation
The invention relates to a linear voltage stabilizer with current-limiting short circuit protection. The linear voltage stabilizer comprises a starting circuit, a reference voltage circuit, a comparison amplifying circuit, a short circuit protection circuit, a current sampling circuit, a voltage sampling circuit and an adjusting pipe, wherein the starting circuit delivers the input voltage sourceinto the reference voltage circuit; the reference voltage circuit provides the adjusted reference voltage to the comparison amplifying circuit; an output end of the adjusting pipe is connected in series with the current sampling circuit; the current sampling circuit feeds back the sampled output current signal to the comparison amplifying circuit; the voltage sampling circuit feeds back the sampled output voltage signal to the comparison amplifying circuit; the comparison amplifying circuit processes the output current signal and the output voltage signal and delivers to a control end of the adjusting pipe so that the adjusting pipe works in a linear area and the aim of current limiting and voltage regulation is achieved; and the short circuit protection circuit processes the acquired output voltage signal and delivers to the control end of the adjusting pipe so that the adjusting pipe is adjusted from the linear area to a shutoff area and the aim of short circuit protection is achieved.
Owner:江苏晟楠电子科技股份有限公司

MEMS wafer level vacuum package structure and manufacturing method thereof

The invention provides an MEMS wafer level vacuum package structure and a manufacturing method thereof. The package structure comprises a silicon cover plate and an MEMS wafer with a movable structure, wherein a vertical through hole is formed on the cover plate, the through hole is internally filled with a conductive material, a bonding surface of the cover plate is provided with a groove, a layer of getter film is arranged at the bottom of the groove, and the silicon cover plate and the MEMS wafer with the movable structure form the vacuum package structure by wafer bonding. The manufacturing method provided by the invention comprises the following steps: at first, manufacturing the through hole on the cover plate, and filling the conductive material in the hole; and then, forming the groove on the bonding surface, depositing a layer of getter film on the bottom of the groove, depositing a layer of multilayer metal film in a bonding area, and wafer bonding the cover plate with the MEMS wafer with the movable structure in a vacuum environment. According to the MEMS wafer level vacuum package structure provided by the invention, the groove with the getter and the through hole are formed on the silicon cover plate to export an electrode from the closed groove without carrying out wire bonding, so that the procedures are simple, meanwhile, the vacuum maintenance ability in the package structure is improved, contamination of granules to the movable structure during cutting is avoided, and performance of the device is guaranteed.
Owner:BEIJING MXTRONICS CORP +1

Bandgap reference circuit

The invention discloses a bandgap reference circuit which comprises a starting circuit, a PTAT (Proportional To Absolute Temperature) current generating circuit and an output buffer and reference voltage generating circuit, wherein the output buffer and reference voltage generating circuit comprises two triodes and three mirror image circuits which form mirror images together with PTAT current, drain electrodes of a first NMOS (N-channel Metal Oxide Semiconductor) tube and a second NMOS tube are respectively connected with the second mirror image circuit and the third mirror image circuit, and a grid electrode and the drain electrode of the first NMOS tube are connected with a grid electrode of the second NMOS tube; the first and second triodes are respectively connected between source electrodes of the first and second NMOS tubes and the ground, and the first mirror image circuit is connected with the source electrode of the first NMOS tube; an output path comprises a first PMOS (P-channel Metal Oxide Semiconductor) tube and a first resistor, a grid electrode of the first PMOS tube is connected with the drain electrode of the second NMOS tube, the first resistor is connected between a drain electrode of the first PMOS tube and the source electrode of the second NMOS tube, and reference voltage is output by the drain electrode of the first PMOS According to the bandgap reference circuit, the driving capability of an output end can be increased, and a temperature coefficient can be improved.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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