The application discloses a kind of magnetic material encapsulation
solvent-free
epoxy glue and its preparation method and application, belong to
adhesive technical field.The
solvent-free
epoxy glue is by weight fraction, by 60-75 parts of
bisphenol A type
epoxy resin modifier, 15-25 parts of composite curing
system, 3-8 parts of functional polycarboxylate dispersant, 2-5 parts of thixotropic modifier, 1-3 parts of synergistic aid composition;Through the epoxy resin of gamma-aminopropyl
triethoxysilane graft modification constructs magnetic material affinity structure, compound anhydride-amine composite curing
system,
collocation functional dispersant and
silane modified
nanocomposite thixotropic agent, combined with gradient mixing, segmented vacuum degassing, in-situ modification dispersion process, realize the synergistic effect of each component.The application solves the problem that the existing magnetic material encapsulation
solvent-free epoxy glue is weak, glue flying silk is serious, insulation and
weathering performance decays fast, can be used for ferrite,
neodymium iron
boron,
samarium cobalt magnetic material encapsulation, preparation process controllable, suitable for industrialized
batch production.