Preparation method of manganese-cobalt-nickel thin film heat-sensitive material

A heat-sensitive material, manganese-cobalt-nickel technology, applied in metal material coating process, liquid chemical plating, coating and other directions, can solve the problem of insufficient service life and reliability of devices, poor uniformity, repeatability and stability, and finished device products. problems such as low rate, to achieve the effect of small substrate selection limitations, good uniformity, and dense material structure

Active Publication Date: 2007-02-07
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, the three oxides of manganese oxide, cobalt oxide and nickel oxide are mixed and pressed according to a certain ratio, and then sintered at 1100-1200 ° C. The disadvantages of the materials produced by this method are poor uniformity, repeatability and stability.
The yield of devices made of this material is low, and there are serious deficiencies in the service life and reliability of the devices. Therefore, the performance of the devices is still stagnant at the level of decades ago, which cannot meet the requirements of the development of contemporary aerospace technology.

Method used

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  • Preparation method of manganese-cobalt-nickel thin film heat-sensitive material
  • Preparation method of manganese-cobalt-nickel thin film heat-sensitive material

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Embodiment Construction

[0020] A best example obtained through experimental research is provided below, and the present invention is further described in detail.

[0021] Best practice:

[0022] Acetate proportioning Mn: Co: Ni=52: 32: 16 (atomic ratio), solvent uses glacial acetic acid, and its content only needs to make acetate dissolve, and the size of solvent content is relevant with the single-layer thickness of even glue film.

[0023] The annealing conditions are: heating up to 180°C for 10 seconds and maintaining for 300 seconds;

[0024] The temperature was raised from 180°C to 500°C in 10 seconds and held for 400 seconds.

[0025] The final temperature coefficient of resistance of the thin film is as high as 3.4% / °C.

[0026] In the preparation process of the present invention, the quality of the prepared precursor solution will directly affect the quality of the grown film. When selecting raw materials, the influence on the human body is considered, and non-toxic or low-toxic...

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Abstract

The invention discloses a new preparing method of MnCoNi film material through wetting-chemical method, which is characterized by the following: enlarging area at lower temperature; stabilizing the heat-sensitive material of MnCoNi film; breaking the limit of traditional ceramic element to satisfy the request of aviation and astronautic technological element.

Description

technical field [0001] The invention relates to a thin-film heat-sensitive material, in particular to a preparation method of a manganese-cobalt-nickel (MnCoNi) thin-film heat-sensitive material. technical background [0002] A negative temperature coefficient (NTC) thermistor material is a material whose resistance decreases exponentially with increasing temperature. Thermistors occupy an extremely important position in temperature sensitive components, accounting for almost 40% of the total temperature sensitive components. The resistance-temperature characteristics of NTC thermosensitive materials can convert small temperature changes into resistance changes to form large signal outputs, especially suitable for high-precision measurement. As an important temperature sensing element, NTC thermistor materials are used in different fields. [0003] Manganese-containing spinel NTC thermistor materials have become the cornerstone of NTC materials. Spinel-based metal oxides ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/02C23C18/08
Inventor 侯云黄志明葛玉建蔡愚禇君浩
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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