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459 results about "Circuit reliability" patented technology

Circuit reliability (also time availability) (CiR) is the percentage of time an electronic circuit was available for use in a specified period of scheduled availability. Circuit reliability is given by where T ₒ is the circuit total outage time, Tₛ is the circuit total scheduled time, and T ₐ is the circuit total available time. Tₛ=Tₐ+Tₒ In addition, circuit reliability is the expected lifespan of operation of a functioning system under nominal conditions.

Three-phase power input phase lack detection circuit

The invention relates to an input lack-phase detection circuit of a three-phase power supply, comprising a first current-limiting resistor, a second current-limiting resistor and a third current-limiting resistor which are respectively connected to a first phase line, a second phase line and a third phase line, the input lack-phase detection circuit also comprises a pull-up resistor, a third diode with a cathode which is connected to the third current-limiting resistor, a first optocoupler and a second optocoupler with output ends which are connected in series between the pull-up resistor and signal ground, a first diode which is connected with an input end of the first optocoupler in series between the first current-limiting resistor and an anode of the third diode, a second diode which is connected with the input end of the second optocoupler in series between the second current-limiting resistor and the anode of the third diode, a first capacitor which is connected with the input end of the first optocoupler in parallel and a second capacitor which is connected with the input end of the second optocoupler in parallel, and the pull-up resistor is connected to the output end of the lack-phase detection circuit. The input lack-phase detection circuit reduces the loss on the current-limiting resistors, so the current-limiting resistors are difficult to damage due to small heat, the reliability of the circuit is improved and the service life is prolonged.
Owner:SHENZHEN INOVANCE TECH

Hot carrier circuit reliability simulation

The present invention is directed to a number of improvements in methods for reliability simulations in aged circuits whose operation has been degraded through hot-carrier or other effects. A plurality of different circuit stress times can be simulated within a single run. Different aging criteria may be used for different circuit blocks, circuit block types, devices, device models and device types. The user may specify the degradation of selected circuit blocks, circuit block types, devices, device models and device types independently of the simulation. Device degradation can be characterized in tables. Continuous degradation levels can be quantized. Techniques are also described for representing the aged device in the netlist as the fresh device augmented with a plurality of independent current sources connected between its terminals to mimic the effects of aging in the device. The use of device model cards with age parameters is also described. To further improve the circuit reliability simulation, a gradual or multi-step aging is used instead of the standard one step aging process. Many of these features can be embedded within the circuit simulator. A user data interface is also presented to implement these techniques and further allow users to enter their device models not presented in the simulator. For example, a proprietary model of, say, the substrate current in an NMOS could used be with a SPICE simulator employing a different model to simulate the aging of the circuit.
Owner:CADENCE DESIGN SYST INC

LED power driving circuit

The invention relates to a light-emitting diode (LED) power driving circuit, which comprises a power supply unit, a converting unit, a rectifying and filtering unit and a control unit. The power supply unit converts low-frequency alternating current provided by a power supply network into direct current; the converting unit converts the direct current into high-frequency output pulse; the rectifying and filtering unit filters and rectifies the high-frequency output pulse to obtain stable direct current output needed by an LED lamp; and the control unit samples the direct current output to obtain a voltage sampling signal, and generates a control signal according to an error between the voltage sampling signal and reference voltage through a pulse frequency regulator with a multiplier, wherein the control signal is used for controlling the converting unit to regulate the high-frequency output pulse. Due to the adoption of the pulse frequency regulator with the multiplier, the LED power driving circuit makes an LED driver simple in circuit structure and low in cost; besides, high-power factor output is realized, and the circuit contributes to saving electric energy. Moreover, due to simple circuit and a few devices, the circuit contributes to improving the production efficiency and circuit reliability.
Owner:OCEANS KING LIGHTING SCI&TECH CO LTD +1

Dual-frequency receiving antenna and dual-frequency rectifying antenna

The invention discloses a dual-frequency receiving antenna and a dual-frequency rectifying antenna. The dual-frequency receiving antenna and the dual-frequency rectifying antenna are used for solving the problems that an existing dual-frequency receiving antenna is large in size and small in gain, an existing dual-frequency rectifying antenna is large in size, can not receive weak energy and is not suitable for remote transmission, and a rectifying circuit is poor in reliability. The dual-frequency receiving antenna comprises a rectangular radiating patch. A Z-type groove used for achieving dual-frequency characteristics is formed in the radiation patch. The lower end of the radiation patch is sequentially connected with a dielectric substrate layer and a metal earth plate through a coaxial line. The coaxial line is in circuit connection with the rear end of the radiation patch. An air dielectric layer is formed between the radiation patch and the dielectric substrate layer. The portions, arranged between the radiation patch and the dielectric substrate layer, outside the coaxial line are provided with metal sheets in a bilaterally-symmetric mode. The upper ends of the metal sheets are connected with the radiation patch. The lower ends of the metal sheets are connected with the dielectric substrate layer. One end face of the radiation patch is further connected with the metal sheets connected with the dielectric substrate layer. The dual-frequency receiving antenna and the dual-frequency rectifying antenna can be widely applied in the fields of communication, medical treatment, industry and the like, for microwave power transmission.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Circuit and method for testing reliability of integrated circuit

ActiveCN102590735AMeasuring and differentiating degradationElectrical testingCircuit reliabilityHemt circuits
The invention belongs to the technical field of integrated circuit test, and in particular relates to a circuit and a method for testing reliability of an integrated circuit. According to the core circuit of the testing circuit, auxiliary p-type metal oxide semiconductor field effect transistors (pMOSFETs) and n-type metal oxide semiconductor field effect transistors (nMOSFETs) are connected between every two stages of inverters of a ring oscillator (RO) and between a high level Vdd and low potential Vss, and a switch transistor is plugged in an input and output connecting line. By controlling the grid voltages of the auxiliary transistors and the switch transistor, normal oscillation of the RO can be realized in the core circuit, dynamic stress is applied to complementary metal oxide semiconductor field effect transistors (CMOSFETs) of the RO, and negative bias temperature instability (NBTI), positive bias temperature instability (PBTI) and hot carrier injection (HCI) stresses are respectively applied to the pMOSFETs or the nMOSFETs of the RO. The testing circuit has the functions of: degradation measurement of the pMOSFETs in the RO under the NBTI stress, degradation measurement of the nMOSFETs under the PBTI stress, degradation measurement of the pMOSFETs under the HCI stress, degradation measurement of the nMOSFETs under the HCI stress, and comparison with degradation measurement of the CMOSFETs under the dynamic stress.
Owner:FUDAN UNIV

Input and output common-ground boost-buck photovoltaic grid-connected inverter and control method thereof

The invention discloses an input and output common-ground boost-buck photovoltaic grid-connected inverter and a control method thereof. The photovoltaic grid-connected inverter disclosed by the invention comprises five switch tubes, three diodes, two inductors and a capacitor. The input and output common-ground boost-buck photovoltaic grid-connected inverter has the beneficial effects that voltage at two ends of a ground parasitic capacitor of a photovoltaic cell panel is zero and remains unchanged; leakage current is effectively eliminated; input and output of the inverter are common-grounded and are beneficial to building of a three-phase system and the applications of the inverter can be further expanded; boosting and bucking can be achieved by a single stage of the inverter, the grid-connected voltage requirement can be achieved by a DC side only by low voltage and the application range of the inverter is expanded; a transformer does not exist in a circuit, the required active and passive devices are few and a system is high in efficiency, small in volume and light in weight; and an electrolytic capacitor does not exist in the circuit, the reliability of the circuit is improved and the service life of the circuit is prolonged.
Owner:YANSHAN UNIV

Self-adaptive switching frequency regulator circuit

ActiveCN103607112AOptimizing Switching Frequency ConfigurationReduce lossPower conversion systemsCircuit reliabilityControl signal
The invention discloses a self-adaptive switching frequency regulator circuit which mainly solves the problem that in the prior art, a switching convertor only has high efficiency in a narrow load range. The self-adaptive switching frequency regulator circuit comprises a pattern discrimination module, a threshold selection module, fundamental oscillation logic, jitter frequency control logic and a controlled current source. The pattern discrimination module detects external feedback voltage FB to generate two comparison logic signals which are subjected to logical operation in the threshold selection module, low-threshold voltage of a comparer in the fundamental oscillation logic is determined, the fundamental oscillation logic outputs clock signals and is used for driving the jitter frequency control logic to generate a set of control signals to control output current of the controlled current source, frequency jitter is achieved, and electromagnetic interference of the switching convertor is lowered. The self-adaptive switching frequency regulator circuit is high in reliability, all functions can be integrated in a chip, and the self-adaptive switching frequency regulator circuit can be applied to various power supply management systems.
Owner:天健九方(西安)毫米波设计研究院有限公司

Integrated circuit interconnection reliability analysis method for modeling based on neural network parameters

InactiveCN106547962AOvercome the disadvantage of long simulation timeImproving the Efficiency of Interconnect Reliability SimulationDesign optimisation/simulationSpecial data processing applicationsCircuit reliabilityIntegrated circuit interconnect
The invention discloses an integrated circuit interconnection reliability analysis method for modeling based on neural network parameters. The method comprises the steps of acquiring training data by ANSYS simulation; building a neural network model structure based on EM reliability; and training a reliability neural network model and acquiring a model result. The advantages that the neural network has a strong non-linear mapping function and a rapid learning ability are utilized to model an EM reliability input and output relation via the neural network and train the model, results with respect to reliability under various work conditions are acquired after the model is built, reliability data under different conditions can be predicted in very short time, the defect that simulation time is long due to the fact that the reliability results under all input conditions need to be simulated when traditional ANSYS finite element software analyzes circuit reliability in different conditions, and the method provided by the invention is significant in research on interconnection reliability of the integrated circuit.
Owner:TIANJIN UNIV

Distributed battery management system and method for lead-acid storage battery pack equalization

Provided is a distributed battery management system and method for lead-acid storage battery pack equalization. Multiple lead-acid storage batteries are connected in series to form a series lead-acid storage battery unit. Multiple series lead-acid storage battery units are connected in parallel to form a lead-acid storage battery pack. The output end of the lead-acid storage battery pack is connected with a master control unit. Each lead-acid storage battery is connected with a slave control unit. A constant-current/voltage equalization device in the master control unit is connected with the corresponding lead-acid storage battery pack through the equalization switch of the slave control unit. Each slave control unit acquires the output voltage signal of the corresponding lead-acid storage battery and sends the output voltage signal to the master control unit. The master control unit acquires a maximum voltage signal and a minimum voltage signal of the multiple lead-acid storage batteries. When a voltage difference between the maximum voltage signal and the minimum voltage signal is greater than a preset threshold, the master control unit controls the constant-current/voltage equalization device and the equalization switch to perform equalization operation on the lead-acid storage battery corresponding to the minimum voltage signal. The distributed battery management system and method achieve organic combination of cost and circuit reliability.
Owner:许涛

Matrix vector multiplication double-track logic circuit based on DNA composite strand displacement and method thereof

The invention discloses a matrix vector multiplication double-track logic circuit based on DNA composite strand displacements and a method thereof; the method comprises the following steps: firstly building a three-row-three-column matrix and three-row-one column vector multiplication system according to a composite strand displacement combination mechanism; building a third-order matrix vector multiplication operated digit logic circuit; using a double-track idea to convert the digit logic circuit into a third-order matrix vector multiplication operated dual-track logic circuit; converting the dual-track logic circuit into a seesaw logic circuit; converting the seesaw logic circuit into a biochemical logic circuit; finally using Visual DSD simulation software to verify the outputted result and parse the three-row-three-column matrix and three-row-one column vector multiplication system complex dynamics behaviors, and enabling the simulation result to prove the result validity. The method provides basic theory basis for building a higher-order matrix vector multiplication in a later time and matrix and matrix multiplication logic operations, thus promoting the biology computer development, and improving the bio-computer logic circuit reliability.
Owner:ZHENGZHOU UNIVERSITY OF LIGHT INDUSTRY

Short-circuit protection circuit for APF high-power IGBT

The invention discloses a short-circuit protection circuit for an APF high-power IGBT. The short-circuit protection circuit comprises the working control circuit of the IGBT and the short-circuit protection circuit of the IGBT, the working control circuit of the IGBT is used for controlling the IGBT to work or not, and the short-circuit protection circuit of the IGBT is used for monitoring the short circuit currents of the IGBT and preventing the short circuit of the IGBT from causing overvoltages to damage the IGBT through a slowly lowered grid voltage circuit. The short-circuit protection circuit of the IGBT comprises the working control circuit of the short-circuit control circuit, the detecting circuit of the short-circuit protection circuit, the slowly lowered grid voltage circuit and a latch protecting resetting circuit, wherein the working control circuit is used for controlling the short-circuit protection circuit to work or not, the detecting circuit is used for detecting the voltage of the IGBT, the slowly lowered grid voltage circuit is used for slowly lowering grid voltages, and the latch protecting resetting circuit is used for protecting and locking a PWM, and completely turning off the IGBT. The short-circuit protection circuit for the APF high-power IGBT has the advantages of improving the reliability of the working circuit, and reducing the overvoltages in a turning off process by adopting the soft turn-off mode of slowly lowering IGBT grid voltages when a short circuit occurs.
Owner:STATE GRID CORP OF CHINA +1

Three-dimensional metal-based Printed Circuit Board (PCB) assembly structure, corresponding light-emitting lamp and manufacturing method

The invention relates to a three-dimensional metal-based Printed Circuit Board (PCB) assembly structure assembly structure in a light-emitting lamp, which consists of a single continuous metal-based circuit board and a plurality of light-emitting components on the upper surface of the metal-based circuit board. Each light-emitting component is connected with the metal-based circuit board by a circuit; parts on the metal-based circuit board, which are provided with the light-emitting components, are not positioned on the same plane or curved surface; and the metal-based circuit board is of a three-dimensional structure. The invention also relates to the light-emitting lamp with the assembly structure and a manufacturing method of the assembly structure. Due to the adoption of the three-dimensional metal-based PCB circuit board assembly structure which is of the structure, the corresponding light-emitting lamp and the manufacturing method, the heat conduction contact surface is larger; a single module assembly has simple and practical structure; the process is simplified; the three-dimensional metal-based PCB circuit board assembly structure is convenient and rapid to process, is beneficial to mass mechanical production, has low cost, has high circuit reliability and stable and reliable performance and is firm and durable; the assembly stability and the mechanical strength of a circuit board assembly are improved; and the three-dimensional metal-based PCB circuit board assembly structure is difficult to deform and has wide application range.
Owner:蔡子丰
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