Method of light-cured resin packaging liquid-state metal printed circuit

A light-curing resin and printed circuit technology, applied in printed circuits, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problems of packaging thickness and uniformity that are difficult to guarantee, and achieve package specifications that are easy to control and have a wide range of applications. , the effect of improving packaging accuracy and speed

Active Publication Date: 2016-09-07
BEIJING DREAM INK TECH CO LTD
View PDF4 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method needs to wait for a long time, and because of the natural curing method, it is difficult to guarantee the thickness and uniformity of the package

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of light-cured resin packaging liquid-state metal printed circuit
  • Method of light-cured resin packaging liquid-state metal printed circuit
  • Method of light-cured resin packaging liquid-state metal printed circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Figure 1 to Figure 3 It shows the process of encapsulating liquid metal printed circuit with photocuring resin, and the steps include:

[0037] 1) The printed circuit to be packaged is a printed circuit with liquid metal as a wire. Use a dispenser to coat or adhere the photocurable resin in a liquid state to the surface of the liquid metal printed circuit. In this embodiment, the coating thickness is 0.5mm. Liquid metal wires can be connected with electronic components such as semiconductor chips, capacitors, resistors, diodes, and triodes to form functional circuits;

[0038] The liquid metal 2 is a Wood's alloy containing indium, which is an alloy of 50% bismuth, 25% lead, 12.5% ​​tin, and 12.5% ​​cadmium. A printed circuit 3 made of liquid metal is attached to a substrate, which is a rigid substrate 7 ( Figure 4 ), made of rigid plastic.

[0039] 2) The irradiation machine 5 irradiates the light 4 of a specific wavelength onto the photocurable resin 1 on the su...

Embodiment 2

[0042] 1) The printed circuit to be packaged is a printed circuit with liquid metal as a wire. Use a dispenser to coat or adhere the photocurable resin in a liquid state to the surface of the liquid metal printed circuit. The specific coating process and coating thickness are the same as Example 1 is the same.

[0043] Liquid metal 2 is a low melting point gallium indium alloy Ga 80 In 20 . The printed circuit 3 made of liquid metal is attached to the substrate, which is a flexible substrate 8 ( Figure 5 ), made of silicone.

[0044] 2) The irradiation machine 5 irradiates the light 4 of a specific wavelength onto the photocurable resin on the surface of the liquid metal printed circuit ( Figure 6 ), the irradiated photocurable resin is transformed from a liquid state into a solid state by a chemical reaction, and is closely combined with the liquid metal printed circuit, covering the liquid metal wire, forming a protection for the wire, and realizing the packaging of th...

Embodiment 3

[0048] see Figure 7 , step 2) is: the irradiation machine 5 is located under the substrate, and during the packaging process, the irradiation machine 5 irradiates the light 4 of a specific wavelength through the transparent flexible substrate (the substrate material is a PVC film) onto the liquid photocurable resin 1 on the surface of the printed circuit 3 , the final packaging structure is obtained after the irradiated resin is cured and the excess resin material is removed

[0049] Other operations are the same as in Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
wavelengthaaaaaaaaaa
Login to view more

Abstract

The invention provides a method of a light-cured resin packaging liquid-state metal printed circuit. The method comprises the following steps: 1, a printed circuit to be packaged is a printed circuit taking liquid-state metal as a lead wire, a light-cured resin at a liquid state is coated to or adhered to the surface of the liquid-state metal printed circuit by use of an adhesive deposit device; and 2, an irradiation machine irradiates light to the light-cured resin on the surface of the liquid-state metal printed circuit, the irradiated light-cured resin is converted into a solid state from a liquid state through a chemical reaction, and thus the liquid-state metal printed circuit is packaged. The method for packaging the liquid-state metal printed circuit by use of the light-cured resin, brought forward by the invention, by use of the feature that the light-cured resin can be converted into the solid state from the liquid state under light irradiation, rapid and accurate packaging of the liquid-state metal printed circuit is realized, the circuit reliability is improved, and the adaptation scope is enlarged.

Description

technical field [0001] The invention belongs to the field of printing, and in particular relates to a device and method for surface encapsulating a liquid metal printed circuit by using photocurable resin. Background technique [0002] Integrated circuit printing technology is a technology widely used in consumer electronics, industrial production, electrical equipment, and medical monitoring. Its main feature is to realize the miniaturization of electronic equipment and the rapid iteration of R & D and production through the standardization of technology, process and integration. Integrated circuit printing technology has promoted the development of the information age and is also the cornerstone of current and future industrial civilization. [0003] At present, the widely used integrated circuit printing technology mainly uses the etching method. The basic process is to plate a copper wire layer on the multi-layer composite resin base material, coat the photoresist on th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/284H05K3/287
Inventor 姚又友刘静陈柏炜
Owner BEIJING DREAM INK TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap