The utility model relates to the technical field of packaging devices, and discloses a
diode module
chip packaging device which comprises a
workbench, storage grooves are formed in the two sides of the upper surface of the
workbench, bidirectional threaded rods are rotationally connected to the two sides of the inner walls of the storage grooves, and driven bevel gears are fixedly connected to the middles of rod bodies of the bidirectional threaded rods. The front end of the inner wall of the storage groove is rotationally connected with a rotating column. When the
diode module
chip packaging device is used, a rotary knob is rotated to drive a rotating column to rotate and drive a driving
bevel gear and a driven
bevel gear to rotate at the same time, then a bidirectional
threaded rod is driven to rotate, and gaskets on the two sides are driven to move oppositely, so that the
diode module
chip packaging device can flexibly cope with substrates of different sizes; the spiral ring is rotated to drive the rotating ring to transversely move and simultaneously drive the rotating ring to move together, then the clamping block abuts against the clamping groove, the rotating column can be limited, the rotating column rotates due to positive and negative external force, and the positioning stability of the base plate is improved.