15results about How to "High packaging precision" patented technology

This utility model discloses a packaging mold for a suspended guide coil, relating to the field of mold packaging technology. The device includes a material carrier plate; the material carrier plate has a material-carrying cavity inside, and the top and bottom of the material-carrying cavity are respectively provided with a first mounting limiting groove and a second mounting limiting groove. The first and second mounting limiting grooves are respectively fitted with a first molding component and a second molding component, which support the top and bottom coils. A lead wire support assembly is provided below the bottom coil. The packaging mold for the suspended guide coil of this utility model, through the mutual cooperation of various structures / components in the lead wire support assembly, ensures the parallelism of the three lead wires during the packaging process, effectively avoiding deformation under external force and improving the packaging accuracy of the coil.

This application relates to the field of gas sensor packaging technology, specifically to an automated packaging method, system, and packaging device for gas sensors. The method includes: pre-establishing a packaging process parameter-gas-sensitive channel adaptation model; calculating the actual coaxiality deviation and correcting the sealing pressure reference value based on the gas-sensitive channel aperture; starting the integrated packaging unit, applying pre-pressure according to the corrected sealing pressure, and simultaneously collecting the temperature of the sealing area through an infrared temperature measurement module to determine whether dynamic adjustment of the welding temperature is needed; after welding, maintaining the corrected sealing pressure, and dynamically adjusting the pressure holding time based on the gas-sensitive channel length and the creep coefficient of the sealing material to complete the sealing process. This application achieves a precise balance between sealing performance and conduction efficiency by establishing a dynamic adaptation model of process parameters and gas-sensitive channel structure, overcoming the coupling imbalance bottleneck of existing technologies.

The utility model discloses a central conductor with a discrete structure. The central conductor comprises a conductor layer, an insulating layer, a connecting piece and a ferrite, the three conductor layers and the three insulating layers are alternately and sequentially stacked to form discrete parts; the conductor layer comprises inductance lines, and an included angle is formed between any two inductance lines; the conductor layer on the outermost side of the discrete component is fixedly connected with the ferrite; the connecting pieces are connected to the conductor layers on the outermost sides of the discrete components, and the two ends of the inductance line are electrically connected with the connecting pieces respectively. According to the central conductor of the discrete structure, the inductance wires are arranged to be of the discrete structure, the inductance wires are arranged in an addition growth mode, and compared with the mode that three inductance wires are sequentially bent to wrap the ferrite, the phenomena of inductance wire deformation and magnet cracking can be effectively avoided, the production efficiency can be improved, and the wrapping precision is improved. And the connecting piece can be connected with the PCB support plate by adopting a surface mounting process and a reflow soldering process, so that the efficiency is higher. The connecting piece is connected to the conductor layer on the outermost side, so that the risk of electric leakage caused by contact with a foreign object can be reduced.

The invention relates to the technical field of wire rod processing equipment, and particularly discloses an automatic film wrapping mechanism for wire rods. The mechanism comprises a wrapping module and a feeding module. The wrapping module comprises a rotary film wrapping clamp and two wire clamping units, the two wire clamping units are used for selectively fixing wire products respectively, the rotary film wrapping clamp comprises a fixed wire clamping unit and a movable wire clamping unit which are provided with wrapping through grooves, and the movable wire clamping unit is movably connected to the fixed wire clamping unit; the rotary film wrapping clamp can be switched between a wrapping state and a material waiting state, when the rotary film wrapping clamp is in the wrapping state, a wrapping through hole is defined by the two wrapping through grooves, when the rotary film wrapping clamp is in the material waiting state, the two wrapping through grooves are formed in a spaced mode, and the rotary film wrapping clamp can rotate around the axis of the wrapping through hole; the feeding module is used for placing the protective film at the film feeding position on the rotary film wrapping clamp in the material waiting state, and at least part of the protective film located at the film feeding position is placed in the wrapping through groove. According to the mechanism, the cylindrical protective film can be automatically wrapped on the surface of a wire product through structural improvement.

The embodiment of the invention provides a display panel, a display device and a manufacturing method of the display panel, the display panel comprises a substrate and sub-panels, at least two sub-panels are arranged on the same side of the substrate side by side, each sub-panel comprises a driving circuit layer and a light-emitting layer, the driving circuit layer is arranged on the substrate, and the light-emitting layer is arranged on the side, away from the substrate, of the driving circuit layer; the packaging layer is arranged on the side, away from the substrate, of the light-emitting layer and makes contact with at least part of the light-emitting layer, and the packaging layer covers the at least two sub-panels. In the embodiment, the at least two sub-panels are arranged on the substrate side by side, the packaging layer is arranged on the side, away from the substrate, of the light-emitting layer and is in contact with the light-emitting layer, the packaging layer covers the light-emitting layers of the at least two sub-panels, the light-emitting display device is represented as a whole in appearance, and the integrity of the display effect is good; when the sub-panels are spliced, the influence of the packaging precision of the packaging layer can be eliminated, the splicing gap between the adjacent sub-panels is reduced, and the continuity and integrity of the display panel are improved.

The invention discloses a multi-needle mechanical crystal-stabbing type Mini-LED mass transfer system and a use method, the system comprises a substrate assembly line, a planar motion platform and a multi-needle crystal-stabbing device, the multi-needle crystal-stabbing device comprises a crystal-stabbing head assembly and a three-axis motion gantry, the crystal-stabbing head assembly comprises a bottom plate and a plurality of sub crystal-stabbing heads, and the sub crystal-stabbing heads are arranged on the bottom plate. The bottom plate is provided with a needle outlet hole, and the plurality of sub-stabbing crystal heads are distributed around the periphery of the needle outlet hole; the sub-stabbing crystal head comprises a shell, a motor and a tungsten needle clamp, the shell is provided with a guide rail, the tungsten needle clamp is arranged on the shell in a guiding and sliding mode along the guide rail, and the tungsten needle is switched between a first position state and a second position state through movement of the tungsten needle clamp. In addition, the invention further provides a using method using the system, and the multi-needle-head mechanical crystal-stabbing type Mini-LED mass transfer system and method solve the problems that at present, the transfer efficiency is low, the needle head density is limited by the thickness of a needle rod, and the packaging precision is limited.

The utility model discloses a PCB packaging machine with high packaging stability in the PCB packaging field, which comprises an operation table, supporting legs, a clamping and fixing mechanism and a cleaning mechanism, the supporting legs are fixedly connected to the edge positions of the four corners of the bottom of the operation table, the clamping and fixing mechanism is connected to the top of the operation table, and the cleaning mechanism is connected to the bottom of the operation table. According to the PCB packaging machine with the high packaging stability, a PCB is placed on the operation table, a rotating disc is rotated, a bidirectional threaded rod is driven to rotate, a limiting block and a limiting groove are matched, a sliding block drives a connecting plate to be close to each other, a clamping plate makes contact with the PCB, the rotating disc continues to be rotated, and the PCB can be conveniently and rapidly packaged. The connecting plate slides on the outer side of the sliding rod, the extension spring is stretched, the clamping plate tightly clamps the PCB through the counter-acting force of the extension spring, the PCB is prevented from shaking, the stability in the packaging process is guaranteed, the welding block is accurately inserted into the welding hole, and the packaging precision is improved.

The utility model relates to the technical field of packaging devices, and discloses a diode module chip packaging device which comprises a workbench, storage grooves are formed in the two sides of the upper surface of the workbench, bidirectional threaded rods are rotationally connected to the two sides of the inner walls of the storage grooves, and driven bevel gears are fixedly connected to the middles of rod bodies of the bidirectional threaded rods. The front end of the inner wall of the storage groove is rotationally connected with a rotating column. When the diode module chip packaging device is used, a rotary knob is rotated to drive a rotating column to rotate and drive a driving bevel gear and a driven bevel gear to rotate at the same time, then a bidirectional threaded rod is driven to rotate, and gaskets on the two sides are driven to move oppositely, so that the diode module chip packaging device can flexibly cope with substrates of different sizes; the spiral ring is rotated to drive the rotating ring to transversely move and simultaneously drive the rotating ring to move together, then the clamping block abuts against the clamping groove, the rotating column can be limited, the rotating column rotates due to positive and negative external force, and the positioning stability of the base plate is improved.

The utility model discloses a kind of packaging devices for sensor assembly belong to sensor packaging technical field, it includes bottom plate, two sides on the bottom plate are respectively fixedly connected with side plate, first packaging table and second packaging table are equipped between two side plates, the top of second packaging table is equipped with support frame. The packaging device for sensor assembly, first packaging table is driven to be close to packaging mechanism by sliding plate, fixed block then moves second packaging table by slide and sliding rod, when guiding assembly moves to the bottom of guiding groove, second packaging table will drive multiple sliding rods to move down, when guiding assembly moves to the top of guiding groove, second packaging table then moves out the top of packaging mechanism, first packaging table equipped with sensor assembly then moves to the below of packaging mechanism, so operation, the time period of taking and placing sensor assembly on second packaging table, packaging mechanism still keeps normal work, to realize the purpose of continuity to sensor assembly efficiently packaging in turn.

The invention discloses a circuit substrate and a processing method thereof, and a system-in-package substrate and a processing method thereof. The processing method of the circuit substrate comprises the following steps: providing an insulating base layer and two composite copper layers; the insulating base layer is stacked between the ultrathin copper layers of the two composite copper layers and then pressed into a whole, and the carrier copper layer is removed to obtain a first intermediate plate; performing MSAP process treatment on the first intermediate plate to form a line set comprising an inner-layer line and an impedance prototype on the ultrathin copper layer; the inner-layer lines in the two groups of line sets are communicated, and the impedance rudiment is of a single-line coplanar impedance structure formed by an impedance line lengthening body and a peripheral copper body; after the preset part of the impedance line lengthening body and the inner-layer circuit are subjected to film covering protection, the exposed part of the impedance line lengthening body and the peripheral copper body are etched away to obtain the hypersensitive impedance; and removing the film to obtain the circuit substrate. According to the processing method, the packaging density and precision are improved, large-scale production of the circuit board product with the hypersensitive impedance is realized, and the yield of the hypersensitive impedance is improved.

The utility model belongs to toothpick production technical field especially relates to a toothpick packaging machine, including base, connecting frame, support column, placement roll, guide wheel, drive roll and plastic roll etc., connecting frame installs in the upper portion one side of base, support column is fixedly connected in the upper portion of connecting frame, placement roll rotation sets up on the cylindrical surface of support column, guide wheel rotation sets up in the lower portion of connecting frame, drive roll is same and sets up in the lower portion of connecting frame, and is located the left of guide wheel, two plastic rolls are parallelly distributed rotation sets up in the upper portion other side of base. Through the integration of horizontal seal and longitudinal seal function in a pair of heat seal roll, realize the synchronous heating packaging of packaging material, compared with traditional step type packaging mode, this design effectively avoids the problem of poor sealing caused by uneven heating, sealing misplacement, significantly improves the uniformity and sealing of sealing, prevents toothpick from being damp or contaminated, improves product stability and shelf life.

The invention discloses a supercapacitor and lithium battery production line equipment, which is characterized by comprising: a shelling machine, a frame, a first conveying device, the first conveying device for conveying a material tray to move forward along the production line is installed on the top of the frame; a glue pool, the glue pool for containing conductive glue is fixed on the top of the frame; a glue printing device, the glue printing device is installed at one end of the frame, and the glue printing device applies the conductive glue in the glue pool to the inner wall of the electrode shell on the material tray; a film making device, the film making device is installed on the top of the frame and adjacent to the glue printing device, the electrode mother material is punched and processed to obtain the electrode, and the electrode falls into the electrode shell on the material tray under the action of thrust, so that the electrode is bonded to the electrode shell through the conductive glue, and the positive and negative electrode combination device is set to realize the flipping and inversion of a negative electrode shell at one time. Compared with the existing single negative electrode shell inversion, the production efficiency is greatly improved, and the full servo automatic sealing device improves the operability, visualization and packaging accuracy.

The utility model relates to the technical field of rice skin processing, concretely to a kind of packaging device for strip rice skin, including conveying device, the top of conveying device is equipped with carding component, the carding component includes fixed frame, the inboard of fixed frame is slidably connected with moving plate, the center of moving plate is penetrated and is equipped with guide rod, the surface of guide rod is fixedly connected with rotating frame, the top of conveying device is equipped with packaging device.The utility model is equipped with carding component, and rice skin and its packaging bag in conveying process can be effectively arranged and positioned.The component can gradually push the packaging bag on both sides to the center line of conveying device when position deviation is detected, to realize the central alignment and posture correction of rice skin.Not only ensure that rice skin is in uniform, standard position before entering packaging station, but also improve packaging precision and automation efficiency.

The utility model provides a packaging substrate and a chip packaging structure, and the packaging substrate comprises a glass substrate which is internally provided with a conductive through hole; a first packaging unit; the first packaging unit comprises a first plastic packaging layer which is located on the first surface of the glass substrate; and the first rewiring layer is positioned on one side, deviating from the glass substrate, of the first plastic packaging layer and is electrically connected with the first end of the conductive through hole. According to the invention, the first packaging unit with a flat shape can be provided, and the production yield and the use reliability of a product are improved.

The utility model relates to the technical field of electronic cigarette processing, and discloses an electronic cigarette oil storage bin automatic packaging device which comprises a workbench, a packaging assembly is arranged at the top of the workbench, a conveying assembly is arranged in the workbench, and the packaging assembly comprises two side plates fixedly connected to the top of the workbench. A motor is fixedly connected to the side wall of one side plate, a rotating rod is fixedly connected to the output end of the motor, a plurality of cams are fixedly connected to the surface of the rotating rod, a belt wheel is fixedly connected to one end of the rotating rod, a top plate abuts against the bottoms of the cams, and at least one limiting rod is slidably connected into the top plate. The surfaces of the limiting rods are sleeved with first springs, and a plurality of pressing heads are fixedly connected to the bottom of the top plate. According to the utility model, through the structural arrangement of the packaging assembly, the problems in the prior art that manual packaging is limited in productivity, the requirement of large-scale production is difficult to meet, and the situation of unstable packaging quality is easy to occur are solved.