Improved method for realizing wafer-grade package of ultrathin environment light and proximity sensor, and package

A wafer-level packaging, proximity sensor technology, applied in the direction of electric solid devices, semiconductor devices, electrical components, etc., can solve the problems of difficult thinning of PCB substrates and restricting the development of thinning sensors.

Pending Publication Date: 2016-09-28
宁波德葳智能科技有限公司
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Problems solved by technology

Ambient light and proximity sensors combine a light-sensing chip and a light-emitting chip. Traditionally, the two chips are manufactured using different wafers, and then assembled on a PCB substrate for packaging; because the PCB substrate is difficult to thin, this kind of sensor is restricted. thin development

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  • Improved method for realizing wafer-grade package of ultrathin environment light and proximity sensor, and package
  • Improved method for realizing wafer-grade package of ultrathin environment light and proximity sensor, and package
  • Improved method for realizing wafer-grade package of ultrathin environment light and proximity sensor, and package

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Embodiment Construction

[0040] In order to make the above objects, features and advantages of the present invention more comprehensible, examples will be given below to illustrate the specific implementation of the present invention in detail. The specific embodiments of the present invention are set forth in the following description to fully understand the present invention. However, the present invention can be implemented in a manner different from the following description, and those skilled in the art can make similar extensions without departing from the connotation of the present invention. Accordingly, the present invention is not limited to the specific Examples disclosed below.

[0041] The wafer-level packaging method of the ultra-thin ambient light and proximity sensor in this embodiment is as follows: Figure 1 to Figure 7 shown.

[0042] First, prepare the light sensing chip 10, the light sensing chip 10 can be an ambient light sensor (Ambient LightSensor), or a proximity sensor (Prox...

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Abstract

The invention provides an improved method for realizing a wafer-grade package of an ultrathin environment light and proximity sensor, and a package. A conventional technical process of realizing the wafer-grade package by reliance on a PCB substrate through combination of an RDL wiring layer and a wire bonding technology is changed; a wafer is locked by means of an optical sealing cover and a protective sealing cover; and a formation carry tool can simultaneously bear multiple wafer combinations to be processed, the optical sealing cover and the protective sealing cover can be manufactured simultaneously for all the wafer combinations on the formation carry tool, and besides, the RDL wiring layer formed on a temporary adhesive tape greatly facilitates thin-type design and also facilitates simultaneous processing of the multiple wafer combinations. The method provided by the invention and the package have such technical advantages, thereby achieving the purpose and effect of realizing thinning and efficient production by abandoning the PCB substrate.

Description

technical field [0001] The invention relates to sensor packaging technology, in particular to an improved method for realizing wafer-level packaging of ultra-thin ambient light and proximity sensors and packaging thereof. Background technique [0002] The miniaturization of smart devices is based on the miniaturization of their components. Ambient light and proximity sensors combine a light-sensing chip and a light-emitting chip. Traditionally, the two chips are manufactured using different wafers, and then combined on the PCB substrate for packaging; the PCB substrate is difficult to thin, which restricts this sensor. thin development. Contents of the invention [0003] As mentioned above, how to break through the technological bottleneck of the PCB substrate, how to combine two kinds of light-sensing chips and light-emitting chips with different manufacturing processes into one package and realize the miniaturization requirement is a problem to be solved by the present ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16
CPCH01L25/167H01L2924/181H01L2224/48091H01L2924/00014H01L2924/00012
Inventor 张珊珊林挺宇林海斌蔡旭
Owner 宁波德葳智能科技有限公司
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