Chip package production line of multichip intelligent card

Abstract

The invention discloses a chip package production line of a multichip intelligent card, comprising a card conveying mechanism, a packaging module, a thermal compression module, a chip detection module and a card receiving module, wherein the modules are in sequence arranged along a card conveying direction; the packaging module comprises two chip belt supply mechanisms, a chip blanking mechanism and a chip carry packaging mechanism; two packaging stations are configured for the packaging module; a chip positioning mechanism is respectively arranged at each packaging station; chip belt supply mechanisms comprise chip belts and chip belt transmission mechanism; chip belts in two chip belt supply mechanisms in parallel extend along a direction perpendicular to the card conveying direction, and the transmission directions thereof are opposite. The equipment is applicable to package and fixation of the single-chip card and the multichip card and has the advantages of quick package and thermal compression fixation speed, high production efficiency and precision.

Description

technical field [0001] The invention relates to smart card manufacturing equipment, in particular to a chip packaging production line equipment for multi-core smart cards. Background technique [0002] During the production process of the contact smart card, it is necessary to package the chip into the card. In the process of packaging chips, the chip needs to be transported to the corresponding card chip slot for packaging first, and then pressed, heated and fixed. Therefore, the card packaging production line is mainly divided into packaging modules and thermal pressing modules. [0003] An ordinary smart card is provided with one chip in each card, but there are also some cards provided with multiple chips, such as two chips, four chips and so on. The chips in these multi-chip cards are divided into two parts and arranged at both ends of the card, and the orientations of the chips at different ends are opposite (one of the four corners of the chip is provided with a hypo...

AI Technical Summary

Problems solved by technology

[0005] The packaging module in the existing smart card packaging production line is usually used to package single-chip cards. When used for packaging multi-chip cards, it is necessary to rotate the card by 180° or rotate the chip by 180° to protect the second set of chips. It can be accurately transported into the chip slot of the card; since the chip or card needs to be rotated during the transport process, on the one hand, the transport speed is slow and the production efficiency is low; on the other hand, the packaging accuracy of the chip is easily affected

Images