Packaging transmission control system of photovoltaic module chip

A transmission control and photovoltaic module technology, which is applied in photovoltaic power generation, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems that the precision of chip packaging cannot be improved, so as to facilitate data analysis, reduce the scope, improve packaging precision and pass rate effect

Active Publication Date: 2022-07-08
安徽钜芯半导体科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing photovoltaic module chip packaging can only detect whether the chip packaging is complete and whether the packaging is qualified, and cannot realize the subsequent improvement of the accuracy of the chip packaging, and still use the original chip packaging method for packaging; therefore the present invention provides A packaging and transmission control system for photovoltaic module chips, which is used to solve the above problems

Method used

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  • Packaging transmission control system of photovoltaic module chip

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Embodiment Construction

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] like figure 1 As shown, a package drive control system for photovoltaic module chips includes a package module, a detection module, a server, a tracking module, a data management module and an analysis module;

[0032] The encapsulation module, the detection module, the tracking module, the data management module and the analysis module are all connected in communication with the server;

[0033] The packaging module is used for chip packaging, and the existing chip packaging device can be directl...

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Abstract

The invention discloses a packaging transmission control system of a photovoltaic module chip, and belongs to the technical field of chip packaging, the packaging transmission control system comprises a packaging module, a detection module and a server, the packaging module and the detection module are both in communication connection with the server; the server is also in communication connection with a tracking module, a data management module and an analysis module; the tracking module is used for tracking the packaging process of the chip and uploading collected packaging monitoring data to the cloud for storage; the data management module is used for carrying out data acquisition management, obtaining analysis data and sending the analysis data to the analysis module; the analysis module is used for analyzing the received analysis data, and the specific method comprises the steps that a data extraction unit is arranged, a data filling template is arranged in the data extraction unit, data extraction is conducted on detection data through the data extraction unit, the data filling template is filled with the extracted data, and the data extraction unit is used for extracting the detection data; and marking the data filling template filled with the data as selected data, and performing coordinate processing on the selected data.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, in particular to a packaging transmission control system for photovoltaic module chips. Background technique [0002] Photovoltaic module chip package is a casing for installing semiconductor integrated circuit chips, which plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, and is also a bridge to communicate the internal world of the chip and the external circuit, and the contacts on the chip are connected by wires. to the pins of the package housing, which in turn establish connections to other devices through wires on the printed board. [0003] However, the existing photovoltaic module chip packaging can only detect whether the chip packaging is complete and whether the packaging is qualified, and cannot achieve subsequent improvement in the precision of the chip packaging, and the original chip packaging method is stil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67276H01L21/67271Y02E10/50
Inventor 曹孙根许波春冯亚宁吴博张曹朋陈松
Owner 安徽钜芯半导体科技有限公司
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