Chip packaging process

Abstract

The invention discloses a chip packaging process, which comprises the steps of obtaining a substrate with a lead frame, and presetting a target circuit frame capable of meeting a circuit conversion function on the lead frame; packaging the position of the lead frame on the substrate; cutting the redundant part of the substrate to obtain a packaging piece; assembling a chip and the packaging piece, and welding and connecting the chip pins of the chip with the frame connecting pins of the lead frame; and carrying out coating operation on the chip pins and the surface of the chip. According to the process provided by the invention, the target circuit frame is preset on the lead frame and can achieve a circuit conversion function; and a chip molding and packaging process is canceled, after the lead frame is directly packaged and molded, the chip and the packaging piece are welded and fixed, then coating treatment and single packaging are performed, and the chip pins and the frame connecting pins are connected by welding. The welding heat is low, the bonding strength is high, the connection strength is high after coating treatment, the insulation effect is good, and the reliability of the chip can be effectively improved.

Description

technical field [0001] The invention relates to the field of chip packaging, in particular to a chip packaging process. Background technique [0002] Current detection is an important function of the electric drive system of new energy vehicles, and its performance is directly related to the stability and reliability of electric vehicles. The current detection method based on the Hall current sensor has the advantages of low loss, stable performance, built-in isolation, and strong overload capability, and has gradually become the mainstream solution for current detection in new energy vehicles. Today, when new energy vehicle policy subsidies are decreasing year by year and market competition is becoming increasingly fierce, how to reduce the hard cost of products, ensure product reliability, and reduce production cycle are important items that need continuous improvement. [0003] Chip packaging refers to a process of plastic packages with different shapes formed by chips a...

AI Technical Summary

Problems solved by technology

[0006] (1) Due to the need to use the PCB board to complete the pin circuit conversion, the cost of the PCB board is increased;

[0007] (2) The existing structure adopts SMT patch technology, which has the risk of solder balls and virtual soldering;

[0008] (3) The cost of the chip is high, and poor molding and packaging will cause a large cost loss;

[0009] (4) After the chip, PCB board and PCB board pins are assembled, they need to be integrally molded and packaged. The high temperature and high pressure during molding will generate greater stress on the chip and PCB board, and affect the performance of the chip;

[0010] (5) The packaged chip needs to be baked, and the baking time is longer, which reduces the mass production efficiency

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