Ultra-thin ambient light and proximity sensor wafer level package and package method thereof

Abstract

The invention provides ultra-thin ambient light and proximity sensor wafer level package and a package method thereof. The method comprises the steps that a. a light-sensitive wafer with a silicon through-hole structure and a light-emitting wafer are placed on a forming carrier with a tape; b. the light-emitting wafer and the light-sensitive wafer are encapsulated by a light-transmitting material to form an optical cover; c. the optical cover is encapsulated by a non-light-transmitting material, and a light isolation belt is formed between the light-emitting wafer and the light-sensitive wafer to form a protection cover; d. the top of the protection cover is bonded to the processing fixture of an RDL wiring layer; e. the forming carrier and the tape are removed; and f. the RDL wiring layer is formed on the removed surface to realize the wafer level package. According to the invention, traditionally relying on the process of a PCB substrate is changed; the light-sensitive wafer with the silicon through-hole structure and the RDL wiring layer are combined to realize wafer level package; and thinning and efficient production are realized without the PCB substrate.

Description

technical field [0001] The invention relates to sensor packaging technology, in particular to a wafer-level packaging of an ultra-thin ambient light and proximity sensor and a packaging method thereof. Background technique [0002] The miniaturization of smart devices is based on the miniaturization of their components. Ambient light and proximity sensors combine a light-sensing chip and a light-emitting chip. Traditionally, the two chips are manufactured using different wafers, and then combined on the PCB substrate for packaging; the PCB substrate is difficult to thin, which restricts this sensor. thin development. [0003] The PCB substrate, the light sensing chip and the light emitting chip are connected by wire bonding or wire bonding (Wire Bonding), which needs to be operated one by one, and the production efficiency is low, which leads to high cost and is not conducive to miniaturization requirements. Contents of the invention [0004] As mentioned above, how to b...

AI Technical Summary

Problems solved by technology

Ambient light and proximity sensors combine a light-sensing chip and a light-emitting chip. Traditionally, the two chips are manufactured using different wafers, and then assembled on a PCB substrate for packaging; because the PCB substrate is difficult to thin, this kind of sensor is restricted. thin development

[0003] Wire bonding or wire bonding (Wire Bonding) is used to connect the PCB substrate, the photosensitive chip and the light emitting chip. It needs to be operated one by one, and the production efficiency is low, which leads to high cost and is not conducive to miniaturization requirements.

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