5G radio frequency front end assembling equipment and assembling method thereof

Abstract

The invention discloses 5G radio frequency front end assembling equipment, which comprises a module assembling unit and a circuit forming unit which are sequentially arranged along an assembling sequence, wherein the module assembling unit comprises a substrate forming device and a chip mounting device; the circuit forming unit comprises a chip plastic packaging device and a circuit etching device; and the chip plastic packaging device comprises a sealing box body, a first sealing isolation layer and a sealing cavity, and a workpiece rotating device, a plastic packaging forming device and a high-pressure generating device are arranged in the sealing cavity. The invention further discloses an assembling method of 5G radio frequency front end assembling equipment. According to the invention, through the arrangement of the module assembling unit, under a streamlined assembling mode, high-precision and high-efficiency completion of compounding of multiple layers of substrates and assembling of chips is realized, the chip plastic packaging device adopts organic matter solidification to form a plastic packaging layer with the planarization reaching the standard, and the circuit etching device prepares a circuit network through a selective etching process. Quality requirements are strictly controlled, and good assembling precision of the substrate and the chip is guaranteed.

Description

Technical field[0001]The present invention relates to the field of 5G antenna processing, and more particularly to assembly equipment and assembly methods thereof in the 5G RF front end.Background technique[0002]With the continuous development of 5G communication technology, the assembly accuracy requirements of the antenna will be attractive, with the radio front end as the most basic components in the antenna, and its assembly accuracy requirements are especially important. The existing radio front end generally adopts the flat distribution of the assembly device, the line layered line, considering the need to assemble the multi-layer substrate laminate into a composite substrate, and mount various chips in the corresponding position, it is inevitably caused by the assembly accuracy and The integration requirement is high. However, in the existing assembly process, since the assembly continuity between the devices is poor, there is more human doping factors, and in large quantitie...

AI Technical Summary

Problems solved by technology

The existing RF front-end generally adopts the planar distribution of assembly devices and the layered routing of circuits. Considering the need to assemble multi-layer substrates into composite substrates and install various chips at corresponding positions, it will inevitably lead to equipment assembly accuracy and High integration requirements

However, in the existing assembly process, due to poor assembly continuity between devices and more artificial doping factors, good substrate composite assembly accuracy and chip mounting accuracy cannot be guaranteed in mass production, and The plastic sealing device adopts a one-time plastic sealing molding method, and defects are prone to occur inside the plastic sealing layer. At the same time, the surface of the plastic sealing layer cannot achieve a good flattening effect, thereby affecting the quality and reliability of the workpiece. In addition, the existing chip assembly device uses a single The heat source method uses hot-melt adhesive to install the chip. The heating and melting rate of this method is slow and the effect is poor. It is easy to block the glue outlet due to uneven hot-melt, which is difficult to meet mass production.

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