Chip packaging device of multi-chip intelligent card

Abstract

The invention discloses a chip packaging device of a multi-chip intelligent card. The chip packaging device of the multi-chip intelligent card comprises a card conveying guide track, two chip belt supply mechanisms, chip punching mechanisms and a chip carrying and packaging mechanism, wherein two packaging stations are arranged on the card conveying guide track; each chip belt supply mechanism comprises a chip belt and a chip belt conveying mechanism; the chip belts in the two chip belt supply mechanisms extend in parallel in the direction perpendicular to the card conveying direction; the conveying directions of the chip belts in the two chip belt supply mechanisms are opposite; each chip punching mechanism comprises a punching die and a punching actuating mechanism arranged below the punching die; two punching holes are formed in each punching die; and the two chip belts in the two chip belt supply mechanisms respectively pass through places below the punching die of one of the chip punching mechanisms. The chip packaging device has the advantages of high packaging speed, high production efficiency, high packaging precision and the like.

Description

technical field [0001] The invention relates to smart card manufacturing equipment, in particular to a smart card chip packaging device. Background technique [0002] In the smart card production process, it is necessary to package chips into the card. Ordinary smart cards have one chip in each card. In addition, some cards have multiple chips, such as two chips, four chips, etc. The chips in these multi-chip cards are divided into two parts and set at both ends of the card. , the orientations of the chips at different ends are opposite (one of the four corners of the chip is provided with a hypotenuse, the positions of the hypotenuses are different, and the orientations of the chips are different), while the orientations of the chips at the same end are the same. The chip at one end of the card is called the first group of chips, and the chip at the other end of the card is called the second group of chips; the orientation of the two groups of chips in the card is 180° dif...

AI Technical Summary

Problems solved by technology

[0003] During the chip packaging process of the multi-core smart card, after the first set of chip packaging is completed, the card needs to be rotated 180° or the chip is rotated 180° , in order to ensure that the second group of chips can be accurately packaged into the package slot of the card, the existing problem is: because the chip or card needs to be rotated during the package process, on the one hand, the package speed is slow and the production efficiency is low; on the other hand, It is easy to affect the packaging accuracy of the chip

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