A multi-station turntable chip packaging production line

Abstract

The invention discloses a multi-station turntable type chip packaging production line, which belongs to the technical field of chip production and includes a bottom plate, and four first baffles and four second baffles are respectively fixedly connected to the left and right sides of the upper surface of the bottom plate. , corresponding to the four first baffles and the four second baffles are respectively provided with a first transmission mechanism and a second transmission mechanism, the opposite surfaces of the two first baffles and the two second baffles that are close to each other are A material guide table is provided. In the present invention, compared with the traditional processing method, the scheme will load, detect And the sealing glue is combined into a complete processing line, and at the same time, it avoids the damage caused by the position of the transferred chip, which is conducive to the efficient packaging of the chip and improves the packaging accuracy.

Description

technical field [0001] The invention belongs to the technical field of chip production, and in particular relates to a multi-station turntable chip packaging production line. Background technique [0002] Integrated circuits manufactured on the surface of semiconductor chips are also called thin film integrated circuits. Another kind of thick-film integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or circuit board. After the transistor was invented and mass-produced, various solid-state semiconductor components such as diodes and transistors were widely used. Replacing the function and role of vacuum tubes in circuits, the progress of semiconductor manufacturing technology in the middle and late 20th century made integrated circuits possible. Compared with hand-assembled circuits using individual discrete electronic components, integrated circuits can integrate a large number of tiny ...

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a multi-station turntable chip packaging production line, which solves the problem that in the existing packaging technology, the chip needs to be inspected through different stations, and then the station is transferred. And to package the chip, due to the frequent replacement of stations, the detection and packaging process of the chip is very complicated, and it is easy to cause damage to the chip in the process of frequent transfer, and the degree of automation is poor, which is not conducive to the efficient packaging of the chip and affects The problem of package accuracy

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