Fan-out packaging device
A packaging device, fan-out technology, applied in the direction of electric solid device, semiconductor device, semiconductor/solid state device parts, etc. Good thermal conductivity, improved packaging accuracy, and beneficial effects on heat dissipation
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[0028] see figure 1 , figure 1 It is a schematic flowchart of an embodiment of the fan-out packaging method of the present invention, and the method includes:
[0029] S101: Provide an interposer and a packaging substrate, the interposer includes a base and a wiring area on one side of the base, wherein the base is formed with a hole, the hole includes a conductive layer, and the wiring area is electrically connected to one end of the conductive layer in the hole; the packaging substrate includes A silicon wafer base layer, a pad and a first re-wiring layer, the pad is arranged on one side of the silicon wafer base layer, and the first re-wiring layer is arranged on the other side of the silicon wafer base layer, wherein the pad and the first re-wiring layer are Layer electrical connection;
[0030] In an application scenario such as figure 2 shown, figure 2 for figure 1 A schematic structural diagram of an embodiment of the interposer. The intermediate board used in t...
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