Power module encapsulating structure

Abstract

A power module encapsulating structure mainly comprises DBC, the DBC is provided with chips and bonding wires and is welded on a substrate, power terminals, signal terminals and signal frames are fixed to a circuit board, the circuit board is welded on the DBC through power terminal pins and signal frame pins, an outer shell fixes and seals a whole module, and the outer shell is provided with an opening allowing the power terminals and signal terminals to stretch out and be connected with external application terminals. Two signal terminals are led to a gate electrode of an upper tube and a gate electrode of a lower tube respectively, and the other two signal terminals are led to an emitting electrode of the upper tube and an emitting electrode of the lower tube respectively. Circuits on the circuit board enable the signal terminals and the corresponding signal frames to be communicated, and the signal frames are welded and communicated with the corresponding positions on the DBC. Three power terminals are fixed through the circuit board and are welded and communicated with the corresponding positions on the DBC. The power module encapsulating structure has the advantages of being simple in structure, convenient to mount and use and simple in manufacturing technology, and improving encapsulating precision and using reliability.

Description

technical field [0001] The invention relates to a package structure of a power module, which belongs to the technical field of power electronics. Background technique [0002] Traditional power modules use signal leads or bonding wires to realize the connection between the power part and the signal part. If signal leads are used for connection, insulating materials such as silicone tubes are generally used to cover the outside of the leads. The length control of the silicone tube and the action of the casing need to be manually After completion, the signal leads and signal terminals need to be welded together, which generally needs to be carried out one by one by hand or machine, so it is difficult to achieve automation and consistency in process methods and control. Contents of the invention [0003] The purpose of the present invention is to overcome the shortcomings of the prior art, and provide a power module packaging structure with simple structure, convenient us...

AI Technical Summary

Problems solved by technology

[0002] Traditional power modules use signal leads or bonding wires to realize the connection between the power part and the signal part. If signal leads are used for connection, insulating materials such as silicone tubes are generally used to cover the outside of the leads. The length control of the silicone tube and the action of the casing need to be manually After completion, the signal leads and signal terminals must be welded together, which generally needs to be done manually or by machine one by one, so it is difficult to achieve automation and consistency in process methods and control

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