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Multi-chip contact intelligent card groove milling packaging personalized production line

A contact-type, multi-chip technology, applied in collaborative devices, record carriers used by machines, instruments, etc., can solve the problems of affecting chip packaging accuracy, low production efficiency, slow packaging speed, etc., and reduce the time for card transfer. , The effect of improving production efficiency and saving packaging time

Active Publication Date: 2017-02-22
GUANGZHOU MINGSEN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. Slot milling, encapsulation and personalization are completed by three independent devices, and the transfer of cards between the two devices takes up more production time and the production efficiency is low
[0006] 2. Existing slot milling equipment is usually used to package single-chip cards. When it is used for packaging multi-chip cards, it is necessary to rotate the card 180° or rotate the chip 180° to ensure that the second set of chips Can be accurately packaged into the packaging slot of the card; because the chip or card needs to be rotated during the packaging process, on the one hand, the packaging speed is slow and the production efficiency is low; on the other hand, the packaging accuracy of the chip is easily affected

Method used

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  • Multi-chip contact intelligent card groove milling packaging personalized production line
  • Multi-chip contact intelligent card groove milling packaging personalized production line
  • Multi-chip contact intelligent card groove milling packaging personalized production line

Examples

Experimental program
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Effect test

Embodiment Construction

[0060] The present invention will be further described in detail below in conjunction with the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0061] see figure 1 , the multi-chip contact smart card slot milling and packaging personalization production line of the present invention includes slot milling equipment A, packaging equipment B and personalization equipment C connected together. The tank equipment A, packaging equipment B and personalization equipment C are arranged on a frame a, and a control cabinet b is arranged on the lower part of the frame a.

[0062] see figure 1 , figure 2 , Figure 4 and Figure 20-Figure 23 , the slot milling device A includes a card delivery mechanism c and a card issuing module e and a slot milling module g arranged in sequence along the card delivery direction, wherein the card delivery mechanism c includes a card delivery guide rail c-1 for dialing Card dial sync...

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PUM

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Abstract

The invention discloses a multi-chip contact intelligent card groove milling packaging personalized production line. The production line comprises a groove milling device, a packaging device and a personalization device which are connected together, wherein the packaging device comprises a packaging module, the packaging module comprises two chip band supply mechanisms, a chip punching mechanism and a chip carrying packaging mechanism; two packaging work stations are arranged at positions, which are corresponding to the packaging module, in a chip carrying guide rail of the groove milling device, and each packaging work station is provided with a chip positioning mechanism; each of the two chip band supply mechanisms comprises a chip band and a chip band conveying mechanism; and the chip bands in the two chip band supply mechanisms extend in parallel along a direction vertical to a chip conveying direction, and the transmission directions of the chip bands in the two chip band supply mechanisms are opposite. The production line is applied to groove milling packaging of a single-chip card, is also applied to groove milling packaging of a multi-chip card, and has the advantages of fast packaging speed, high production efficiency, high packaging precision and the like.

Description

technical field [0001] The invention relates to smart card manufacturing equipment, in particular to a multi-chip contact smart card milling groove packaging personalization production line. Background technique [0002] In the production process of contact smart cards, it needs to go through three major processes of milling, packaging and personalization. Wherein, encapsulation refers to the encapsulation of chips in the card. Before packaging the chip, it is necessary to mill out the chip slot on the card to accommodate the chip. Therefore, the packaging process of the card is mainly divided into two main processes: slot milling and packaging. Among them, slot milling is completed by slot milling equipment, and packaging is done by Packaged equipment is complete. [0003] An ordinary smart card is provided with one chip in each card, but there are also some cards provided with multiple chips, such as two chips, four chips and so on. The chips in these multi-chip cards a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/07G06K19/077G06K17/00
CPCG06K17/00G06K19/072G06K19/07745Y02P90/30
Inventor 魏广来王开来房训军徐飞李南彪赖汉进黄文豪岳亚涛郑鸿飞张长建
Owner GUANGZHOU MINGSEN TECH CO LTD
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