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Chip resistor and method for manufacturing same

一种贴片电阻、制造方法的技术，应用在电阻制造、电阻器、电阻器零部件等方向，能够解决导通不良、断线等问题，达到高精度电阻值调整的效果

Active Publication Date: 2016-11-09
KAO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reason is that if a pair of electrodes is vulcanized, it may cause poor conduction or disconnection

Method used

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  • Chip resistor and method for manufacturing same
  • Chip resistor and method for manufacturing same
  • Chip resistor and method for manufacturing same

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Embodiment Construction

[0028] Hereinafter, the chip resistor and its manufacturing method according to the embodiment of the present invention will be described with reference to the drawings.

[0029] (Structure of the chip resistor described in the embodiment of the present invention)

[0030] figure 1 It is a plan view of the chip resistor according to the embodiment of the present invention. figure 2 (a) is figure 1 A-A sectional view of, figure 2 (b) is figure 1 A'-A' sectional view. The chip resistor 1 has: an insulating substrate 2; a pair of electrodes 3, 3 formed on an upper surface 2A of the insulating substrate 2; 3 and 3 are formed so that both sides are in contact with ruthenium oxide as the main component; and an insulating film (covering layer 15 described later) that covers the resistor 4 and covers a part of the pair of electrodes 3 and 3 .

[0031] The pair of electrodes 3, 3 each have: an auxiliary electrode layer 3A having a rectangular planar shape; and a main electrode ...

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Abstract

Provided are: a chip resistor which is capable of adjusting the resistance with high accuracy, while maintaining high sulfurization resistance of an electrode thereof, even in cases where the resistance of the chip resistor is low; and a method for manufacturing this chip resistor. This chip resistor (1) comprises an insulating film which covers a resistor (4) that is formed so as to be in contact with both of a pair of electrodes (3, 3) formed on the upper surface (2A) of an insulating substrate (2). Each of the pair of electrodes (3, 3) comprises: (1) a main electrode layer (3B) that contains silver as a main metal component, while containing 10% by weight or more of palladium, and an auxiliary electrode layer (3A) that has a lower specific resistance than the main electrode layer (3B); (2) a multilayer portion wherein the auxiliary electrode layer (3A) and the main electrode layer (3B) are sequentially laminated in this order on one surface of the insulating substrate (2); and (3) an exposed part (3A1) of the auxiliary electrode layer (3A) on the far side from the resistor (4), where the main electrode layer (3B) does not cover a part of the auxiliary electrode layer (3A), and an extending part (3B1) that extends from the near side to the far side from the resistor (4).

Description

technical field [0001] The invention relates to a chip resistor and a manufacturing method thereof. Background technique [0002] For a chip resistor, it is regarded as a problem that a pair of electrodes are vulcanized, and the chip resistor has: a pair of electrodes formed on one surface of an insulating substrate, and the main component is silver; a resistor body The resistor is formed on one surface of the insulating substrate so as to be in contact with both of the pair of electrodes; and the insulating film covers the resistor and exposes a part of the pair of electrodes. The reason is that if a pair of electrodes is vulcanized, poor conduction or disconnection may occur. [0003] Therefore, for example, there has been proposed a technique for suppressing sulfuration of a pair of electrodes by using a metal material containing silver and palladium as the metal material of the pair of electrodes (see Patent Document 1). [0004] prior art literature [0005] patent d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/00H01C17/06H01C17/242
CPCH01C1/148H01C1/012H01C1/12H01C1/14H01C7/00H01C17/006H01C17/06H01C17/242
Inventor 松本健太郎
Owner KAO CORP
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