Thick-film anti-vulcanization paster resistor and manufacturing method thereof

Abstract

The invention discloses a thick-film anti-vulcanization paster resistor and a manufacturing method thereof. A second front side electrode is added to a first front side electrode so as to form an overlapped and intersected structure of the second front side electrode and a resistor layer as well as the second front side electrode and a first protecting layer; and the expansion coefficient of a second protecting layer is matched with that of the second front side electrode. Due to the structural method design, a vulcanization route is greatly prolonged, so that the anti-vulcanization property of the paster resistor is improved, and moreover, the phenomenon that the electrode is corroded by vulcanization gas from cracks caused in wave peak soldering or reflow soldering of a PCB (Printed Circuit Board) of the resistor because of the difference of expansion coefficients of an electro-nickelling layer, an electro-tinning layer and the second protecting layer. Therefore, the production cost of the thick-film anti-vulcanization paster resistor is greatly lowered, and the thick-film anti-vulcanization paster resistor can be widely applied to ordinary electronic products.

Description

technical field [0001] The invention relates to a resistor and a manufacturing method thereof, in particular to a thick-film anti-sulfurization chip resistor and a manufacturing method thereof. Background technique [0002] Chip resistors, also known as chip resistors, are small in size, light in weight, suitable for reflow soldering and wave soldering, stable in electrical performance, high in reliability, low in assembly cost, and match with automatic mounting equipment, high in mechanical strength and It is widely used in computers, mobile phones, electronic dictionaries, medical electronic products, camcorders, electronic watt-hour meters and VCD players due to its superior high-frequency characteristics. However, in some occasions where the concentration of sulfide gas is high, such as places where volcanic gas is emitted, farms, wine brewing, parking lots, chemical plants, mining and thermal power plants, etc., electronic equipment using chip resistors often produce su...

AI Technical Summary

Problems solved by technology

The reason why the anti-sulfurization ability of the chip resistor is not strong is mainly due to the following disadvantages in the material and product structure: the nickel-plated layer 40 and the tin-plated layer 50 are directly overlapped on the edge of the second protective layer 28, while the second protective layer 28 The material of the second protective layer is usually a resin material. When the customer performs wave soldering or reflow soldering on the chip resistor on the PCB, the expansion coefficient of the nickel plating layer and the tin plating layer is different from that of the second protective layer. also different

At present, the anti-sulfurization solution of chip resistors often uses sulfur-resistant noble metal materials to replace or cover the silver material layer of the front electrode. The main disadvantage is that the cost is too high

As resistors are the most basic components on electronic circuits, the high cost will inevitably make this kind of sulfur-resistant resistors using precious metal materials unable to be applied to ordinary electronic products.

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